Overview
- Presents the Proceedings of the International Conference of Mechatronics and Cyber-MixMechatronics – 2017
- Includes recent research on Mechatronics and Cyber-Mix Mechatronics
- Written by prominent experts in the field
- Includes supplementary material: sn.pub/extras
Part of the book series: Lecture Notes in Networks and Systems (LNNS, volume 20)
Included in the following conference series:
Conference proceedings info: ICOMECYME 2017.
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About this book
This first edition of conference Proceedings reflects the expansion of the field of Mechatronics, which has now taken its place in the world of newer transdisciplinary fields of Adaptronics, Integronics, and Cyber-Mix Mechatronics. It presents state-of-the art advances in Mechatronics, Adaptronics, Integronics and Cyber-Mix-Mechatronics.
The 1st International Conference of Mechatronics and Cyber-MixMechatronics/ICOMECYME was organized by the National Institute of R&D in Mechatronics and Measurement Technique in Bucharest (Romania), on September 7th–8th, 2017 and attracted specialists from all over the world—including North America, South America, and Asia. In addition to presenting research results, ICOMECYME also offered a forum for exchange between R&D experts.
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Keywords
Table of contents (26 papers)
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Front Matter
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Proceedings of the International Conference of Mechatronics and Cyber-MixMechatronics - 2017
Editors and Affiliations
Bibliographic Information
Book Title: Proceedings of the International Conference of Mechatronics and Cyber-MixMechatronics - 2017
Editors: Gheorghe I. Gheorghe
Series Title: Lecture Notes in Networks and Systems
DOI: https://doi.org/10.1007/978-3-319-63091-5
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing AG 2018
Softcover ISBN: 978-3-319-63090-8Published: 09 August 2017
eBook ISBN: 978-3-319-63091-5Published: 07 August 2017
Series ISSN: 2367-3370
Series E-ISSN: 2367-3389
Edition Number: 1
Number of Pages: IX, 246
Number of Illustrations: 189 b/w illustrations
Topics: Mechatronics, Computational Intelligence