Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review Judith Glazer ReviewPaper Pages: 693 - 700
Lead (Pb)-free solders for electronic packaging Sung K. KangAmit K. Sarkhel OriginalPaper Pages: 701 - 707
Improved mechanical properties in new, Pb-free solder alloys M. MccormackS. Jin OriginalPaper Pages: 715 - 720
Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis P. T. ViancoK. L. EricksonP. L. Hopkins OriginalPaper Pages: 721 - 727
Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling K. L. EricksonP. L. HopkinsP.T Vianco OriginalPaper Pages: 729 - 734
Dispersoid additions to a Pb-free solder for suppression of microstructural coarsening S. JinM. McCormack OriginalPaper Pages: 735 - 739
Investigation of multi-component lead-free solders M. E. LoomansS. VaynmanM. E. Fine OriginalPaper Pages: 741 - 746
A thermodynamic study of the phase equilibria in the Bi-Sn-Sb system H. OhtaniK. Ishida OriginalPaper Pages: 747 - 755
Evaluation of Lead- Free Solder Joints in Electronic Assemblies I. ArtakiA. M. JacksonP. T. Vianco OriginalPaper Pages: 757 - 764
Microstructure evolution of eutectic Sn-Ag solder joints Wenge YangRobert W. MesslerLawrence E. Felton OriginalPaper Pages: 765 - 772
Role of tin content in the wetting of cu and au by tin-bismuth solders Tamar A. PowersT. J. SinglerJ. A. Clum OriginalPaper Pages: 773 - 778
The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles U. RayI. ArtakiP. T. Vianco OriginalPaper Pages: 779 - 785
Intermetallic phase formation in thin solid-liquid diffusion couples F. BartelsJ. W. MorrisW. Gust OriginalPaper Pages: 787 - 790
A comparison of TMGa and TEGa for low-temperature metalorganic chemical vapor deposition growth of CCI4-doped inGaAs S. A. StockmanA. W. HansonG. E. Stillman OriginalPaper Pages: 791 - 799
An accurate and computationally efficient semi-empirical model for arsenic implants into single-crystal (100) silicon Shyh-Horng YangSteven J. MorrisGayle Lux OriginalPaper Pages: 801 - 808
Comparison of Mg and Zn gate implants for GaAs n-channel junction field effect transistors M. E. SherwinJ. C. ZolperJ. F. Klem OriginalPaper Pages: 809 - 818
Feasibility of BCB as an interlevel dielectric in integrated circuits S. BothraM. KellamP. Garrou OriginalPaper Pages: 819 - 825
Patterning and etching of amorphous teflon films C. -C. ChoR. M. WallaceL. A. Files-Sesler OriginalPaper Pages: 827 - 830
Low-Temperature photoluminescence of SiGe/Si disordered multiple quantum wells and quantum well wires J. LeeS. H. LiP. K. Bhattacharya OriginalPaper Pages: 831 - 833
Chemical etching of ZnSe crystals Hitoshi TamuraYasuo OkunoHiroyuki Kato OriginalPaper Pages: 835 - 838