TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
In this topical collection (22 articles)
-
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings
M. I. I. Ramli, M. A. A. Mohd Salleh, M. M. A. Abdullah… Pages 1-12 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper
Yu-Ting Wu, Chih Chen Pages 13-17 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium
Jenn-Ming Song, Wei-Chih Lu, Pei-Wen Chou Pages 18-25 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)
C. Y. Wu, Y. H. Chen, Y. K. Tang, E. J. Lin, Y. X. Lin… Pages 26-33 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Decomposed Copper(II) Acetate Over Expanded Graphite (EG) as Hybrid Filler to Fabricate Epoxy Based Thermal Interface Materials (TIMs)
Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak Pages 34-47 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards
Won Sik Hong, Chulmin Oh Pages 48-58 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading
Dipali Sonawane, Praveen C. Ramamurthy, Praveen Kumar Pages 59-71 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles
Omkar Mypati, Debasish Mishra, Suryakanta Sahu… Pages 72-87 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars
H. Y. Yu, T. H. Yang, Y. S. Chiu, C. R. Kao Pages 88-95 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films
Nalla Somaiah, Praveen Kumar Pages 96-108 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
I-Ju Wang, Ching-Shun Ku, Tu-Ngoc Lam, E-Wen Huang… Pages 109-115 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys
André M. Delhaise, Polina Snugovsky, Jeff Kennedy… Pages 116-127 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature
Shiqian Liu, Stuart McDonald, Qinfen Gu, Syo Matsumura… Pages 128-139 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates
Thomas C. Reeve, Samuel Temple Reeve… Pages 140-151 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties
Paul T. Vianco, Bonnie B. McKenzie, Jerome A. Rejent… Pages 152-172 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
Thiago Soares, Clarissa Cruz, Bismarck Silva… Pages 173-187 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate
Won Sik Hong, Mi Song Kim, Chulmin Oh Pages 188-195 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging
Collin Fleshman, Jenq-Gong Duh Pages 196-201 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields
Yu Tian, Limin Ma, Yishu Wang, Fu Guo, Zhijie Sun Pages 202-211 -
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak Pages 212-225
Continue reading...
To view the rest of this content please follow the download PDF link above.
