Abstract
This study examined the yield stress and stress–strain deformation of the 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) solder as part of an overall effort to develop a computational model for predicting solder joint reliability. These properties were obtained by compression testing and correlated with the role of Bi in the microstructure by scanning electron microscopy. The strain rates were 4.2 × 10−5 s−1 and 8.3 × 10−4 s−1. The test temperatures ranged from − 25°C to 160°C. Samples were tested in the as-fabricated condition or following a 24-h aging treatment at either 125°C or 150°C. The yield stress decreased monotonically with test temperature at both strain rates for Sn-Ag-Bi in the as-fabricated condition. The 125°C, 24 h aging treatment increased the yield stress measured at 25°C, 75°C, and 125°C, but left it unchanged at − 25°C and 160°C. The 150°C aging treatment caused a cross-over effect at approximately 30°C and 70°C for the 4.2 × 10−5 s−1 and 8.3 × 10−4 s−1 strain rates, respectively. Work softening was observed; its source was a combination of continuous dynamic recrystallization and the Portevin–Le Chatelier effect. The latter phenomenon was solely responsible for fluctuations in the stress–strain curves. Significant variations were observed for the Bi-rich structures as a function of aging treatment as well as following deformation, yet yield stress and plastic deformation performance remained predictable under these very high homologous temperatures.
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Acknowledgments
The authors wish to thank Brian Wroblewski for a thorough review of the manuscript. Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia LLC, a wholly owned subsidiary of Honeywell International Inc. for the U.S. Department of Energy’s National Nuclear Security Administration under contract DENA0003525. This paper describes objective technical results and analysis. Any subjective views or opinions that might be expressed in the paper do not necessarily represent the views of the U.S. Department of Energy or the United States Government.
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Vianco, P.T., McKenzie, B.B., Rejent, J.A. et al. Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties. J. Electron. Mater. 49, 152–172 (2020). https://doi.org/10.1007/s11664-019-07456-4
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DOI: https://doi.org/10.1007/s11664-019-07456-4