Abstract
Severallead-free material systems are availableas replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations oftin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements have been shown to refine the microstructure of several lead-free solder systems, thus improving their mechanical properties. This study investigated the effect of the addition of lanthanum on the melting behavior, microstructure, and shear strength of an Sn-3.9Ag-0.7Cu alloy. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed.
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Dudek, M.A., Sidhu, R.S. & Chawla, N. Novel rare-earth-containing lead-free solders with enhanced ductility. JOM 58, 57–62 (2006). https://doi.org/10.1007/s11837-006-0184-8
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DOI: https://doi.org/10.1007/s11837-006-0184-8