The crystal orientation of the tin phase in a Pb-free Sn solder joint has a significant effect on the stress state, and hence on the reliability of the solder joint. A set of crystal plasticity analyses was used to evaluate stress and strain resulting from a 165°C temperature change in a single-crystal joint using two simplified geometries used in practical solder joints. Phenomenological flow models for ten slip systems were estimated based upon semiquantitative information available in the literature, along with known anisotropic elastic property information. The results show that the internal energy of the system is a strong function of the tin crystal orientation and geometry of the solder joint. The internal energy (and presumably the likelihood of damage) is highest when the crystal c-axis lies in the plane of the substrate, leading to significant plastic deformation. When the a-axis is in the plane of the interface, deformation due to a 165°C temperature change is predominantly elastic. The texture of the copper substrate using isotropic Cu elastic properties, or anisotropic elastic properties with [001] \( \parallel \) substrate normal direction, does␣not have a significant effect on the stress or strain in the Sn phase of the joint.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
M. Kerr, N. Chawla, Acta Mater. 52 (2004) 4527
Guo F, Choi S, Subramanian KN, Bieler TR, Lucas JP, Achari A, Paruchuri M, Mater. Sci. & Engr. A 351 (2003) 190
Choi S, Lee J, Guo F, Bieler TR, Subramanian KN, and Lucas JP, JOM 53(6) (2001) 22
Wu CML, Yu DQ, Law CMT, Wang L R Mater. Sci. & Engr. R 44 (2004) 1
Amagai M, Watanabe M, Omiya M, Kishimoto K, Shibuya T, Microelectronics Reliability, 42 (2002) 951
Telang AU, Bieler TR, Mason DE, and Subramanian KN, J. Electron Mater., 32 (2003) 1455
Anderson IE, Harringa JL, J. Electronic Mater 33 (2004) 1485
Zhao Y, Miyashita Y, Mutoh Y, International J. Fatigue 23 (2001) 723
Yoon JW, Jung SB, J. Mater Sci 39 (2004) 4211
Terashima S, Tanaka M, Mater. Trans. 45 (2004) 681
Kanchanomai C, Mutoh Y, Mater. Sci. & Engr. A 381 (2004) 113
Zeng QL, Wang ZG, Xian AP, Shang JK, J. Electronic Materials 34 (2005) 62
Lee JG, Guo F, Choi S, Subramanian KN, Bieler TR and Lucas JP, J. Electronic Materials 31 (2002) 946
Kato H, Matsubara K, Kageyama K, Mater. Sci. Tech. 19 (2003) 1403
Terashima S, Kariya Y, Hosoi T, Tanaka MJ, Electr. Mater. 32 (2003) 1527
Shen Y-L, Chawla N, Ege ES, Deng X. Acta Materialia 53, 2633–2642. (2005)
Ahmad M, Hubbard K, Hu M, J. Electronic Packaging 127, 290–98, (2005).
Sidhu RS, Chawla N, Metallurgical and Materials Transactions 39A(4) 799–810, (2008).
Ye H, Basaran C, Hopkins DC. International Journal of Damage Mechanics 2006, 15(1), 41–67
Dreyer W, Muller WH. International Journal of Solids and Structures 2001, 38,1433–1458.
Lee TY, Tu KN, Kuo SM, Frear DR. J. App. Phy. 2001, 90, 4502–4508.
R. Darveaux, Design and Reliability of Solders and Solder␣Interconnections (Warrendale, PA: TMS, 1997), pp. 213–218.
H. Solomon, ASME J. Electron. Pack., 113 (1991).
Kang SK, Shih DY, Leonard D, Henderson DW, Gosselin T, Cho SI, Yu J, Choi WK, JOM 56(6), 34–38 (2004).
Lu HY, Balkan H, Ng KYS, J Mater Sci, Mater Electron 17, 171–188 (2006).
Takaku Y, Liu XJ, Ohnuma I, Kainuma R, Ishida K, Mater. Trans. 45 (2004) 646.
He M, Chen Z, Qi GJ, Wong CC, Mhaisalkar SG, Thin Solid Films 462 (2004) 363.
Ochoa F, Deng X, Chawla N, J. Electronic Materials 33 (2004) 1596.
Lau KJ, Tang CY, Tse PC, Chow CL, Ng SP, Tsui CP, Rao B, International J. Fracture 130 (2004) 617.
Choi S, Lee JG, Subramanian KN, Lucas JP, Bieler TR. J. Electron. Mater. 2002, 31(4), 292.
F. Guo, J.P. Lucas, and K.N. Subramanian, J. Mater. Sci.: Mater. Electron. 12, 27 (2001).
Lee JG, Subramanian KN. Microstructural features contributing to enhanced behavior of Sn-Ag based solder joints, Soldering & Surface Mount Technology 2005, 17, 33–39
Lee JG, Telang AU, Bieler TR, Subramanian KN. J. Electron. Mater 31, (2002) 11
A.U. Telang and T.R. Bieler, Scripta Mater. 52, 1027 (2005).
Rhee H, Lucas JP, Subramanian KN (2002) J. Mater. Sci.: Mater. Electron. 13:477
Yang F, Li JCM. J Mater Sci, Mater Electron (2007) 18, 191–210
Ubachs RLJM, Schreurs PJG., Geers MGD. J. Mech. Phys. Solids 2004, 52, 1763–1792.
Ubachs RLJM, Schreurs PJG, Geers MGD (2007) Mechanics of Materials 39(7): 685–701.
Gong J, Liu C, Conway PP, Silberschmidt VV. Computational Materials Science 39 (2007) 187–197.
Telang AU, Bieler TR. (2005) JOM 57(6):44–49
A.U. Telang, T.R. Bieler, and M.A. Crimp, Mater. Sci. Eng. A 421, 22 (2006).
Telang AU, Bieler TR, Choi S., Subramanian KN (2002) Journal of Materials Research 17(9):2294–2306.
Telang AU, Bieler TR, JOM, 57 (2005) 44.
Park S, Dhakal R, Lehman L, Cotts EJ (2007) Acta Mater 55 3253–3260
S. Park, R. Dhakal, L. Lehman, and E.J. Cotts, IEEE Trans. Compon. Pack. Technol. 30, 178 (2007).
Lehman LP, Athavale SN, Fullem TZ, Giamis AC, Kinyanjui RK, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. (2004) J Electronic 33(12):1429–1439.
Telang AU, Bieler TR, Zamiri A, Pourboghrat F, Acta Materialia 55 (2007) 2265
Borgesen P, Bieler T, Lehman LP, Cotts EJ. MRS Bulletin April 32 (2007) 360–65.
Bieler TR, Jiang H, Lehman LP, Kirkpatrick T, Cotts EJ, Nandagopal B. (2008) IEEE Transactions on Components and Packaging Technologies 31(2):370–381.
Duzgun B, Ekinci AE, Karaman I, Ucar N, J. of Mech. Behavior of Materials, 10 (1999) 187
Fujiwara M,Hirokawa T, J. Japan Inst. Metals 51 (1987) 830
Dutta I, J. Electronic Materials, 32 (2003) 201
P. Sharma and P. Dasgupta, J. Electron. Pack. (Trans. ASME) 124, 292 (2002)
Wei Y, Chow CL, Lau KJ, Vianco P, Fang HE, J. Electronic Packaging 126 (2004) 367
T.R. Bieler and T.K. Lee, Unpublished research.
Mayeur JR, McDowell DL (2007) International Journal Of Plasticity 23(9):457–1485.
Venkatramani G, Ghosh S, Mills M (2007) Acta Materialia 55(11):3971–3986.
Werwer M, Cornec A (2006) International Journal of Plasticity 22(9):1683–1698.
Kumar D, Bieler TR, Eisenlohr P, Mason DE, Crimp MA, Roters F, Raabe D (2008) J. Engineering Materials Technology-Trans. ASME 130(2), 021012.
D.G. House, and E.V. Vernon, Brit J Appl Phys, 11 (1960) 254–9.
V. T. Desphande, D.B. Sirdeshmukh, Acta Cryst. 15 (1962) 294–295.
A. Zamiri (Ph.D. Thesis, Michigan State University, 2008).
ABAQUS Manual, Version 6.3 (Providence, RI: Hibbit, Karlsson & Sorensen Inc., 2001).
J.W. Hutchison, Proc. R. Soc. Lond. A 319, 247 (1976).
Chang, YW, Asaro, RJ, Acta Metallurgica 29 (1981) 241
Peirce, D, Asaro, R, Needleman, A, Acta Metallurgica 30 (1982) 1087
J.O. Suh, K.N. Tu, and N. Tamura, J. Appl. Phys. 102, 063511 (2007).
Sundelin JJ, Nurmi ST, Lepisto TK, Mater. Sci. Eng. A 474 (2008) 201–207.
Sylvestre J, Blander A (2008) J Electronic Materials 37(10), 1618–1623.
Laurila T, Mattila T, Vuorinen V, Karppinen J, Sippola M, Kivilahti JK (2007) Microelectronics Reliability 47(7), 1135–1144.
Henderson DW, Woods JJ, Gosselin TA, Bartelo J, King DE, Korhonen TM, Korhonen MA, Lehman LP, Kang SK, Lauro P, Shih DY, Goldsmith C, Puttlitz KJ (2004) J Mater Res 19:1608–12.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Zamiri, A., Bieler, T. & Pourboghrat, F. Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change. J. Electron. Mater. 38, 231–240 (2009). https://doi.org/10.1007/s11664-008-0595-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-008-0595-0