Abstract
The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4, and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85°C, and 125°C. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stressexponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed to occur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.
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For more information, contact K.N. Subramanian, Michigan State University, Department of Materials Science and Mechanics, 3536 Engineering Building, East Lansing, Michigan 48824-1226; (517) 353-5397; fax (517) 353-9842; e-mail subraman@egr.msu.edu.
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Choi, S., Lee, J.G., Guo, F. et al. Creep properties of Sn-Ag solder joints containing intermetallic particles. JOM 53, 22–26 (2001). https://doi.org/10.1007/s11837-001-0098-4
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DOI: https://doi.org/10.1007/s11837-001-0098-4