Abstract
Further downscaling of the integrated circuits pushes the limits of lithographic technologies and certain variability effects previously considered negligible now should be taken into account. This paper proposes an efficient approach that addresses the problem of interconnect process variations. New models for line parameters parameterized with respect to the geometric transversal dimensions, subject to small or large variations are proposed. The parametric models are solely based on the computation of first order sensitivities. In the multiparametric case the use of multiplicative models can be a better choice than the use of traditional models based on first order Taylor Series truncation.
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Stefanescu, A., Ioan, D., Ciuprina, G. (2010). Parametric Models of Transmission Lines Based on First Order Sensitivities. In: Roos, J., Costa, L. (eds) Scientific Computing in Electrical Engineering SCEE 2008. Mathematics in Industry(), vol 14. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-12294-1_5
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DOI: https://doi.org/10.1007/978-3-642-12294-1_5
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