Abstract
The interfacial reactions between Sn-based solders and two common substrate materials, Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu have been studied for several decades, and currently there are still many un-resolved issues. The reactions between Sn-based solders and Ni are equally challenging. Recent studies further pointed out that Cu and Ni interacted strongly when they were both present in the same solder joint. While this cross-interaction introduces complications, it offers opportunities for designing better solder joints. In this study, the Ni effect on the reactions between solders and Cu is discussed first. The presence of Ni can in fact reduce the growth rate of Cu3Sn. Excessive Cu3Sn growth can lead to the formation of Kirkendall voids, which is a leading factor responsible for poor drop test performance. The Cu effect on the reactions between solders and Ni is then covered in detail. The knowledge gained from the Cu and Ni effects is applied to explain the recently discovered intermetallic massive spalling, a process that can severely weaken a solder joint. It is pointed out that the massive spalling was caused by the shifting of the equilibrium phase as more and more Cu was extracted out of the solder by the growing intermetallic. Lastly, the problems and opportunities brought on by the cross-interaction of Cu and Ni across a solder joint is presented.
Access provided by Autonomous University of Puebla. Download to read the full chapter text
Chapter PDF
Similar content being viewed by others
Keywords
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
References
A. Rahn (ed.), in The Basics of Soldering (John Wiely & Sons, New York, 1993)
J.H. Lau (ed.), in Flip Chip Technology (McGraw Hill, New York, 1996)
K.N. Tu, K. Zeng, Mater. Sci. Eng. R34, 1 (2001)
W.G. Bader, Weld. J. Res. Suppl. 28, 551s (1969)
C.J. Thwaites, Electroplat. Met. Finish. 26, 10 (1973)
W.A. Mulholland, D.L. Willyard, Weld. J. Res. Suppl. 54, 466s (1974)
R. Duckett, M.L. Ackroyd, Electroplat. Met. Finish. 29, 13 (1976)
H. Heinzel, K.E. Saeger, Gold Bull. 9, 7 (1976)
D.M. Jacobson, G. Jumpston, Gold Bull. 22, 9 (1989)
P.A. Kramer, J. Glazer, J.W. Morris, Jr., Metall. Mater. Trans. 25A, 1249 (1994)
J. Glazer, Inter. Mater. Rev. 40, 65 (1995)
F.G. Yost, Gold Bull. 10, 94 (1977)
C.E. Ho, Y.M. Chen, C.R. Kao, J. Electron. Mater. 28, 1231 (1999)
C.E. Ho, S.Y. Tsai, C.R. Kao, IEEE Trans. Adv. Packag. 24, 493 (2001)
Z. Huang, P.P. Conway, C. Liu, R.C. Thomson, J. Electron. Mater. 33, 1227 (2004)
J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, P. Thomson, J. Appl. Phys. 85, 8456 (1999)
P. Liu, Z. Xu, J.K. Shang, Metall. Mater. Trans. 31A, 2857 (2000)
H. Matsuki, H. Ibuka, H. Saka, Sci. Technol. Adv. Mater. 3, 261 (2002)
K. Zeng, V. Vuorinen, J.K. Kivilahti, IEEE Trans. Electron. Packag. Manufact. 25, 162 (2002)
S.K. Kang, D.Y. Shih, K. Fogel, P. Lauro, M.J. Yim, G.G. Advocate, Jr., M. Griffin, C. Goldsmith, D.W. Henderson, T.A. Gosselin, D.E. King, J.J. Konrad, A. Sarkhel, K.J. Puttlitz, IEEE Trans. Electron. Packag. Manufact. 25, 155 (2002)
Y.D. Jeon, S. Nieland, A. Ostmann, H. Reichl, K.W. Paik, J. Electron. Mater. 32, 548 (2003)
N. Torazawa, S. Arai, Y. Takase, K. Sasaki, H. Saka, Mater. Trans. 44, 1438 (2003)
T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, K.F. Kobayashi, Mater. Trans. 44, 2375 (2003)
C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Mater. Res. 18, 2540 (2003)
C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Electron. Mater. 33, 1200 (2004)
M. He, Z. Chen, G. Qi, Acta Mater. 52, 2047 (2004)
J.W. Yoon, S.W. Kim, S.B. Jung, J. Alloys Compd. 385, 192 (2004)
Y.D. Jeon, K.W. Paik, A. Ostmann, H. Reichl, J. Electron. Mater. 34, 80 (2005)
T. Laurila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R49, 1 (2005)
T.T. Mattila, J.K. Kivilahti, J. Electron. Mater. 34, 969 (2005)
A. Kumar, M. He, Z. Chen, Surf. Coat. Tech. 198, 283 (2005)
S.T. Kao, J.G. Duh, J. Electron. Mater. 34, 1129 (2005)
J.W. Yoon, S.B. Jung, J. Alloys Compd. 396, 122 (2005)
D.G. Kim, J.W. Kim, S.B. Jung, Mater. Sci. Eng. B 121, 204 (2005)
C.Y. Liu, K.N. Tu, T.T. Sheng, C.H. Tung, D.R. Frear, P. Elenius, J. Appl. Phys. 87, 750 (2000)
P.S. Teo, Y.W. Huang, C.H. Tung, M.R. Marks, T.B. Lim, in Proc. of 2000 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 33
F. Zhang, M. Li, C.C. Chum, K.N. Tu, J. Mater. Res. 17, 2757 (2002)
F. Zhang, M. Li, C.C. Chum, Z.C. Shao, J. Electron. Mater. 32, 123 (2003)
M. Abtew, G. Selvaduray, Mater. Sci. Eng. R27, 95 (2000)
K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001)
K. Zeng, K.N. Tu, Mater. Sci. Eng. R38, 55 (2002)
K.N. Tu, A.M. Gusak, M. Li, J. Appl. Phys. 93, 1335 (2003)
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Mater. Sci. Eng. R44, 1 (2004)
S.K. Kang, P.A. Lauro, D.-Y. Shih, D.W. Henderson, K.J. Puttlitz, IBM J. Res. & Dev. 49, 607 (2005)
S. Ahat, M. Sheng, L. Luo, J. Electron. Mater. 30, 1317 (2001)
T.-C. Chiu, K. Zeng, R. Stierman, D. Edwards, K. Ano, in Proceedings of 2004 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 1256
M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K. N. Tu, Proceedings of 2004 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 668
P.T. Vianco, J.A. Rejent, P.F. Hlava, J. Electron. Mater. 33, 991 (2004)
P. Borgesen, D. W. Henderson, Report of Universal Instruments (http://www.uci.com), (2004)
K. Zeng, R. Stierman, T.-C. Chiu, D. Edwards, K. Ano, K.N. Tu, J. Appl. Phys. 97, 024508 (2005)
Z. Mei, M. Ahmad, M. Hu, G. Ramakrishna, in Proceedings of 2005 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 415
M. Oh, Doctor Dissertation, Lehigh University, (1994)
S.W. Chen, S.H. Wu, S.W. Lee, J. Electron. Mater. 32, 1188 (2003)
J.Y. Tsai, Y.C. Hu, C.M. Tsai, C.R. Kao, J. Electron. Mater. 32, 1203 (2003)
C.M. Chung, P.C. Shih, K.L. Lin, J. Electron. Mater. 33, 1 (2004)
L. Garner, S. Sane, D. Suh, T. Byrne, A. Dani, T. Martin, M. Mello, M. Patel, R. Williams, Intel Technol. J. 9, 297 (2005)
I.E. Anderson, J.L. Harringa, J. Electron. Mater. 35, 94 (2006)
T.B. Massalski (ed.), in Binary Alloy Phase Diagrams (ASM International, Metal Park, OH, 1990) p. 1481
P. Nash, A. Nash, Bull. Alloy Phase Diag. 6, 350 (1985)
E.K. Ohriner, Weld. J. Res. Suppl. 7, 191 (1987)
S. Bader, W. Gust, H. Hieber, Acta. Metall. Mater. 43, 329 (1995)
D. Gur, M. Bamberger, Acta Mater. 46, 4917 (1998)
J.A. van Beek, S.A. Stolk, F.J. J. van Loo, Z. Metallkde 73, 441 (1982)
C.M. Liu, M.S. Thesis, National Central University, Taiwan (2000)
K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000)
NEMI (National Electronics Manufacturing Initiative)-Workshop on Modeling and Data Needs for Lead-Free solders, (New Orleans, LA, February 15th 2001)
Soldertec-ITRI, Lead-free alloys-the way forward, October 1999 (http://www.lead-free.org)
IDEALS (International Dental Ethics and Law Society), Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering, Brite-Euram contract BRPR-CT96-0140, project number BE95-1994 (1994–1998)
JEITA (Japan Electronics and Information Technology Industries Association), Lead-Free Roadmap 2002, v 2.1, (2002)
K.F. Seeling, D.G. Lockard, United States Patent, Patent No. 5352407, (Oct 1994)
IPC Roadmap, Assembly of Lead-Free Electronics, 4th draft, IPC, (Northbrook, IL, June 2000)
L.S. Bai, Taiwan Printed Circuit Association (TPCA) Magazine 31, 21 (2006)
C.E. Ho, Y.L. Lin, C.R. Kao, Chem. Mater. 14, 949 (2002)
J.W. Jang, D.R. Frear, T.Y. Lee, K.N. Tu, J. Appl. Phys. 88, 6359 (2000)
C.E. Ho, R.Y. Tsai, Y.L. Lin, C.R. Kao, J. Electron. Mater. 31, 584 (2002)
S.M. Hong, C.S. Kang, J.P. Jung, IEEE Trans. Adv. Packag. 27, 90 (2004)
G.Y. Jang, J.G. Duh, J. Electron. Mater. 34, 68 (2005)
C.M. Liu, C.E. Ho, W.T. Chen, C.R. Kao, J. Electron. Mater. 30, 1152 (2001)
M. Li, K.Y. Lee, D.R. Olsen, W.T. Chen, B.T. C. Tan, S. Mhaisalkar, IEEE Trans. Electron. Packag. 25, 185 (2002)
S.K. Kang, W.K. Choi, M.J. Yim, D.Y. Shih, J. Electron. Mater. 31, 1292 (2002)
L.C. Shiau, C.E. Ho, C.R. Kao, Solder. Surf. Mount Tech. 14/3, 25 (2002)
M.O. Alam, Y.C. Chan, K.N. Tu, Chem. Master. 15, 4340 (2003)
K.Y. Lee, M. Li, J. Electron. Mater. 32, 906 (2003)
C.B. Lee, J.W. Yoon, S.J. Suh, S.B. Jung, C.W. Yang, C.C. Shur, Y.E. Shin, J. Mater. Sci.: Mater. Electron. 14, 487 (2003)
A. Sharif, M.N. Islam, Y.C. Chan, Mater. Sci. Eng. B 113, 184 (2004)
D.Q. Yu, C.M. L. Wu, D.P. He, N. Zhao, L. Wang, J.K.L. Lai, J. Mater. Res. 20, 2205 (2005)
W.T. Chen, C.E. Ho, C.R. Kao, J. Mater. Res. 17, 263 (2002)
W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, C.R. Kao, Mater. Sci. Eng. A 396, 385 (2005)
C.E. Ho, W.C. Luo, S.C. Yang, C.R. Kao, in Proceedings of IMAPS Taiwan 2005 International Technical Symposium (Taipei, June 2005), p. 98
C.E. Ho, Y.W. Lin, S.C. Yang, C.R. Kao, in Proceedings of the 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, IEEE/CPMT (Irvine, March 2005), p. 39
C.E. Ho, Y.W. Lin, S.C. Yang, C.R. Kao, D. S. Jiang, J. Electron. Mater. 35, 1017 (2006)
M.O. Alam, Y.C. Chan, K.N. Tu, J.K. Kivilahti, Chem. Mater. 17, 2223 (2005)
K.S. Kim, S.H. Huh, K. Suganuma, J. Alloys Compd. 352, 226 (2003)
J.S. Ha, T.S. Oh, K.N. Tu, J. Mater. Res. 18, 2109 (2003)
C.H. Wang, S.W. Chen, Acta Mater. 54, 247 (2006)
S.K. Kang, W.K. Choi, D.Y. Shih, P. Lauro, D.W. Henderson, T. Gosselin, D.N. Leonard, in Proceedings of 2002 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 146
Y. Zheng, C. Hillman, P. McCluskey, in Proceedings of 2002 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 1226
M.D. Cheng, S.Y. Chang, S.F. Yen, T.H. Chuang, J. Electron. Mater. 33, 171 (2004)
J.H. L. Pang, T.H. Low, B.S. Xiong, X. Luhua, C.C. Neo, Thin Sol. Films, 462–463, 370 (2004)
J.W. Yoon, S.W. Kim, J.M. Koo, D.G. Kim, S.B. Jung, J. Electron. Mater. 33, 1190 (2004)
J.W. Yoon, S.W. Kim, S.B. Jung, J. Alloys Compd. 391, 82 (2005)
C.B. Lee, S.B. Jung, Y.E. Shin, C.C. Shur, Mater. Trans. 43, 1858 (2002)
A. Zribi, A. Clark, L. Zavalij, P. Borgesen, E.J. Cotts, J. Electron. Mater. 30, 1157 (2001)
G. Ghosh, Acta Mater. 49, 2609 (2001)
G. Ghosh, J. Electron. Mater. 33, 229 (2004)
C.E. Ho, Doctor Dissertation, National Central University, Taiwan, (2002)
C.E. Ho, L.C. Shiau, C.R. Kao, J. Electron. Mater. 31, 1264 (2002)
L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, E.J. Cotts, J. Electron. Mater. 33, 1429 (2004)
D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, K. Puttlitz, J. Mater. Res. 17, 2775 (2002)
S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, K. Puttlitz, in Proceedings of 2003 IEEE Electron. Comp. Tech. Conf. (ECTC), p. 64
S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, K. Puttlitz, J. Minerals Metals Mater. Soc. 5, 61 (2003)
S. Terashima, Y. Kariya, T. Hosoi, M. Tanaka, J. Electron. Mater. 32, 1527 (2003)
C.H. Lin, S.W. Chen, C.H. Wang, J. Electron. Mater. 31, 907 (2002)
C.Y. Li, J.G. Duh, J. Mater. Res. 20, 3118 (2005)
P. Oberndorff, Doctoral Dissertation, Technical University of Eindhoven, (2001)
G.Z. Pan, A.A. Liu, H.K. Kim, K.N. Tu, P.A. Totta, Appl. Phys. Lett. 71, 2946 (1997)
C.R. Kao, C.E. Ho, L.C. Shiau, Solder Point with Low Speed of Consuming Nickel, R.O.C. patent, patent No. 181410, (2003)
S.J. Wang, C.Y. Liu, J. Electron. Mater. 32, 1303 (2003)
T.L. Shao, T.S. Chen, Y.M. Huang, C. Chen, J. Mater. Res. 19, 3654 (2004)
C.M. Tsai, W.C. Luo, C.W. Chang, Y.C. Shieh, C.R. Kao, J. Electron. Mater. 33, 1424 (2004)
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2006 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Ho, C.E., Yang, S.C., Kao, C.R. (2006). Interfacial reaction issues for lead-free electronic solders. In: Lead-Free Electronic Solders. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-48433-4_10
Download citation
DOI: https://doi.org/10.1007/978-0-387-48433-4_10
Published:
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-48431-0
Online ISBN: 978-0-387-48433-4
eBook Packages: EngineeringEngineering (R0)