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About this book
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
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Table of contents (31 chapters)
Editors and Affiliations
Bibliographic Information
Book Title: MCM C/Mixed Technologies and Thick Film Sensors
Editors: W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
Series Title: NATO Science Partnership Subseries: 3
DOI: https://doi.org/10.1007/978-94-011-0079-3
Publisher: Springer Dordrecht
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media Dordrecht 1995
Hardcover ISBN: 978-0-7923-3460-6Published: 30 April 1995
Softcover ISBN: 978-94-010-4039-6Published: 13 November 2012
eBook ISBN: 978-94-011-0079-3Published: 06 December 2012
Series ISSN: 1388-6576
Edition Number: 1
Number of Pages: X, 318
Topics: Electronics and Microelectronics, Instrumentation, Circuits and Systems, Electrical Engineering, Optical and Electronic Materials, Characterization and Evaluation of Materials, Signal, Image and Speech Processing