Abstract
Interconnection and packaging technologies are becoming more and more important for a successful implementation of new telecommunication systems. Advanced assembly methods like multichip modules and flipchip technology offer competitive advantages such as better performance, smaller equipment size or cost savings on system level.
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References
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© 1995 Springer Science+Business Media Dordrecht
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Lösch, K., Rappold, H.M. (1995). Advanced Multichip Modules for Telecom Applications. In: Jones, W.K., Kurzweil, K., Harsányi, G., Mergui, S. (eds) MCM C/Mixed Technologies and Thick Film Sensors. NATO ASI Series, vol 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0079-3_16
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DOI: https://doi.org/10.1007/978-94-011-0079-3_16
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