Abstract
Chemical mechanical polishing (CMP) is an essential process in semiconductor fabrication. The results of CMP process are determined with the selection of consumables and process parameters. The polishing pad transports the slurry to the interface between the polishing pad and wafer and obtains material removal planarity. The mechanical properties of the polishing pad should be studied to analyze the material removal mechanism of CMP because polishing pad deformation is directly related to material removal rate and its uniformity. Various studies have investigated the stress distribution of the CMP process by using the elastic modulus and Poisson’s ratio of the polishing pad. However, these aspects of polishing pad have not been fully elucidated. In this study, we estimated the mechanical properties of commercial polyurethane-impregnated felt pads by comparing the experimentally measured compressive deformation amounts with finite element analysis results.
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Dasol Lee is a Ph.D. student at the School of Mechanical Engineering, Pusan National University, Busan, Korea. She received her M.S. degree in Mechanical Engineering from Pusan National University. Her research interests include chemical mechanical polishing of electronic materials and manufacturing.
Hyunseop Lee is an Assistant Professor at the School of Mechanical Engineering, Tongmyong University, Busan, Korea. He received his B.S., M.S. and Ph.D. degrees in Mechanical Engineering from Pusan National University. His research fields include chemical mechanical polishing, grinding, and abrasive fluidized bed machining.
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Lee, D., Lee, H. Estimating the mechanical properties of polyurethane-impregnated felt pads. J Mech Sci Technol 31, 5705–5710 (2017). https://doi.org/10.1007/s12206-017-1111-3
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DOI: https://doi.org/10.1007/s12206-017-1111-3