Abstract
Current implantable neural interfaces, both clinically available solutions and research tools, rely on a limited number of implanted devices (from one to few units). This factor, aside from the obvious spatial resolution limitations, does not conform to the paradigm of the brain as a massively parallel computational system and creates a bottleneck in the amount of information that could be exchanged between the brain and an external processing unit. This issue has fuelled recent research efforts towards the study of distributed neural interfaces, systems that depend on a network of implanted nodes. Such configuration allows to spread of the overall complexity across multiple devices, which can now be more easily scaled down in size and individual power consumption, improving their conformity with the surrounding tissue, which is a major concern in current monolithic solutions. However, this architecture brings a new set of challenges ranging from the optimization of ultra-low-power electronics, through the formulation of a wireless transmission scheme for efficient power delivery and data transfer to the investigation of novel materials and methods for the fabrication of micro-scale, long-term reliable implants. This chapter outlines state of the art and describes design considerations for the future autonomous, wireless distributed neural implants. Aspects of miniaturization and chronic stability of devices including materials choice, implantation procedure, packaging strategies and microelectrode types are described, alongside a discussion on different modalities to achieve wireless power transfer and data telemetry.
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Greenwald, E., Masters, M.R., Thakor, N.V.: Implantable neurotechnologies: bidirectional neural interfacesapplications and vlsi circuit implementations. Med. Biol. Eng. Comput. 54(1), 1–17 (2016)
Crowson, M.G., Semenov, Y.R., Tucci, D.L., Niparko, J.K.: Quality of life and cost-effectiveness of cochlear implants: a narrative review. Audiol. Neurotol. 22(4–5), 236–258 (2017)
Miocinovic S., Somayajula S., Chitnis S., Vitek J.L.: History, applications, and mechanisms of deep brainstimulation. JAMA Neurol. 70, 163–171 (2013)
Obidin, N., Tasnim, F., Dagdeviren, C.: The future of neuroimplantable devices: A materials science and regulatory perspective. Adv. Mater. 32(15), 1901482 (2020)
Wolpaw, J., Wolpaw, E.W.: Brain-Computer Interfaces: Principles and Practice. OUP, New York (2012)
Kozai, T.D.Y.: The history and horizons of microscale neural interfaces. Micromachines. 9(9), 445 (2018)
Laiwalla, F., Nurmikko, A.: Future of neural interfaces. In: Neural Interface: Frontiers and Applications, pp. 225–241. Springer, Singapore (2019)
Szostak, K.M., Grand, L., Constandinou, T.G.: Neural interfaces for intracortical recording: Requirements, fabrication methods, and characteristics. Front. Neurosci. 11, 665 (2017)
Silvoni, S., Ramos-Murguialday, A., Cavinato, M., Volpato, C., Cisotto, G., Turolla, A., Piccione, F., Birbaumer, N.: Brain-computer interface in stroke: A review of progress. Clin. EEG Neurosci. 42(4), 245–252 (2011)
Jorfi, M., Skousen, J.L., Weder, C., Capadona, J.R.: Progress towards biocompatible intracortical microelectrodes for neural interfacing applications. J. Neural Eng. 12(1), 011001 (2014)
Salatino, J.W., Ludwig, K.A., Kozai, T.D.Y., Purcell, E.K.: Glial responses to implanted electrodes in the brain. Nat. Biomed. Eng. 1(11), 862–877 (2017)
Yoshida Kozai, T.D., Langhals, N.B., Patel, P.R., Deng, X., Zhang, H., Smith, K.L., Lahann, J., Kotov, N.A., Kipke, D.R.: Ultrasmall implantable composite microelectrodes with bioactive surfaces for chronic neural interfaces. Nat. Mater. 11(12), 1065–1073 (2012)
Skousen, J.L., Merriam, S.M.E., Srivannavit, O., Perlin, G., Wise, K.D., Tresco, P.A.: Reducing surface area while maintaining implant penetrating profile lowers the brain foreign body response to chronically implanted planar silicon microelectrode arrays. Prog. Brain Res. 194, 167–180 (2011). Elsevier
G¨allentoft, L., Pettersson, L.M.E., Danielsen, N., Schouenborg, J., Prinz, C.N., Linsmeier, C.E.: Size-dependent long-term tissue response to biostable nanowires in the brain. Biomaterials. 42, 172–183 (2015)
Gill, E.C., Antalek, J., Kimock, F.M., Nasiatka, P.J., McIntosh, B.P., Tanguay, A.R., Weiland, J.D.: High-density feedthrough technology for hermetic biomedical micropackaging. MRS Online Proceedings Library Archive, 1572 (2013)
Langenmair, M., Martens, J., Gierthmuehlen, M., Plachta, D.T.T., Stieglitz, T.: Low temperature approach for high density electrical feedthroughs for neural implants using maskless fabrication techniques. In: 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, pp. 2933–2936 (2018)
Clement, C.: The Human Body: A Special Environment, pp. 97–200. Springer International Publishing, Cham (2019)
Koch, J., Schuettler, M., Pasluosta, C., Stieglitz, T.: Electrical connectors for neural implants: Design, state of the art and future challenges of an underestimated component. J. Neural Eng. 16(6), 061002 (2019)
NeuroNexus. Matrix array (small animal). NeuroNexus. https://neuronexus.com/products/electrode-arrays/3D-probes/small-animal-matrix-arrays
Perlin, G.E., Wise, K.D.: An ultra compact integrated front end for wireless neural recording microsystems. J. Microelectromech. Syst. 19(6), 1409–1421 (2010)
Barrese, J.C., Rao, N., Paroo, K., Triebwasser, C., Vargas-Irwin, C., Franquemont, L., Donoghue, J.P.: Failure mode analysis of silicon-based intracortical microelectrode arrays in non-human primates. J. Neural Eng. 10(6), 066014 (2013)
Seo, D., Neely, R.M., Shen, K., Singhal, U., Alon, E., Rabaey, J.M., Carmena, J.M., Maharbiz, M.M.: Wireless recording in the peripheral nervous system with ultrasonic neural dust. Neuron. 91(3), 529–539 (2016)
Yeon, P., Mirbozorgi, S., Ash, B., Eckhardt, H., Ghovanloo, M.: Fabrication and microassembly of a mm-sized floating probe for a distributed wireless neural interface. Micromachines. 7(9), 154 (2016)
Leung, V.W., Lee, J., Li, S., Yu, S., Kilfovle, C., Larson, L., Nurmikko, A., Laiwalla, F.: A CMOS distributed sensor system for high-density wireless neural implants for brain-machine interfaces. In: ESSCIRC 2018-IEEE 44th European Solid State Circuits Conference (ESSCIRC), pp. 230–233. IEEE (2018)
Marin, C., Fernandez, E.: Biocompatibility of intracortical microelectrodes: Current status and future prospects. Front. Neuroeng. 3, 8 (2010)
Fattahi, P., Yang, G., Kim, G., Abidian, M.R.: A review of organic and inorganic biomaterials for neural interfaces. Adv. Mater. 26(12), 1846–1885 (2014)
Kotov, N.A., Winter, J.O., Clements, I.P., Jan, E., Timko, B.P., Campidelli, S., Pathak, S., Mazzatenta, A., Lieber, C.M., Prato, M., et al.: Nanomaterials for neural interfaces. Adv. Mater. 21(40), 3970–4004 (2009)
Polikov, V.S., Tresco, P.A., Reichert, W.M.: Response of brain tissue to chronically implanted neural electrodes. J. Neurosci. Methods. 148(1), 1–18 (2005)
Robinson, F.R., Johnson, M.T.: Histopathological studies of tissue reactions to various metals implanted in cat brains. Technical report. Aeronautical Systems Division Wright-Patterson AFB Ohio Aerospace Medical Division (1961)
Neves, H.P.: Materials for implantable systems. In: Implantable Sensor Systems for Medical Applications, Woodhead Publishing Limited, pp. 3–38. Elsevier, Cambridge (2013)
Ahn, S.-H., Jeong, J., Kim, S.J.: Emerging encapsulation technologies for long-term reliability of microfabricated implantable devices. Micromachines. 10(8), 508 (2019)
Wolf, P.D., Reichert, W.M.: Thermal considerations for the design of an implanted cortical brain–machine interface (bmi). In: Indwelling Neural Implants: Strategies for Contending with the In Vivo Environment, pp. 33–38. CRC Press/Taylor & Francis, Boca Raton (2008)
Stieglitz, T.: Manufacturing, assembling and packaging of miniaturized neural implants. Microsyst. Technol. 16(5), 723–734 (2010)
Karumbaiah, L., Saxena, T., Carlson, D., Patil, K., Patkar, R., Gaupp, E.A., Betancur, M., Stanley, G.B., Carin, L., Bellamkonda, R.V.: Relationship between intracortical electrode design and chronic recording function. Biomaterials. 34(33), 8061–8074 (2013)
Köhler, P., Wolff, A., Ejserholm, F., Wallman, L., Schouenborg, J., Linsmeier, C.E.: Influence of probe flexibility and gelatin embedding on neuronal density and glial responses to brain implants. PLoS One. 10(3), e0119340 (2015)
Du, Z.J., Kolarcik, C.L., Kozai, T.D.Y., Luebben, S.D., Sapp, S.A., Zheng, X.S., Nabity, J.A., Cui, X.T.: Ultrasoft microwire neural electrodes improve chronic tissue integration. Acta Biomater. 53, 46–58 (2017)
Yoshida Kozai, T.D., Kipke, D.R.: Insertion shuttle with carboxyl terminated selfassembled monolayer coatings for implanting flexible polymer neural probes in the brain. J. Neurosci. Methods. 184(2), 199–205 (2009)
Zhang, H., Patel, P.R., Xie, Z., Swanson, S.D., Wang, X., Kotov, N.A.: Tissue-compliant neural implants from microfabricated carbon nanotube multilayer composite. ACS Nano. 7(9), 7619–7629 (2013)
Weltman, A., Yoo, J., Meng, E.: Flexible, penetrating brain probes enabled by advances in polymer microfabrication. Micromachines. 7(10), 180 (2016)
Felix, S.H., Shah, K.G., Tolosa, V.M., Sheth, H.J., Tooker, A.C., Delima, T.L., Jadhav, S.P., Frank, L.M., Pannu, S.S.: Insertion of flexible neural probes using rigid stiffeners attached with biodissolvable adhesive. J. Vis. Exp. 79, e50609 (2013)
Pas, J., Rutz, A.L., Quilichini, P.P., Slezia, A., Ghestem, A., Kaszas, A., Donahue, M.J., Curto, V.F., O’Connor, R.P., Bernard, C., et al.: A bilayered pva/plga-bioresorbable shuttle to improve the implantation of flexible neural probes. J. Neural Eng. 15(6), 065001 (2018)
Metallo, C., Trimmer, B.A.: Silk coating as a novel delivery system and reversible adhesive for stiffening and shaping flexible probes. J. Biol. Methods. 2(1), e13 (2015)
Musk, E., et al.: An integrated brain-machine interface platform with thousands of channels. J. Med. Internet Res. 21(10), e16194 (2019)
Zhang, S., Wang, C., Gao, H., Yu, C., Yan, Q., Lu, Y., Tao, Z., Linghu, C., Chen, Z., Xu, K., et al.: A removable insertion shuttle for ultraflexible neural probe implantation with stable chronic brain electrophysiological recording. Adv. Mater. Interfaces. 7(6), 1901775 (2020)
Xiang, Z., Yen, S.-C., Xue, N., Sun, T., Tsang, W.M., Zhang, S., Liao, L.-D., Thakor, N.V., Lee, C.: Ultra-thin flexible polyimide neural probe embedded in a dissolvable maltose-coated microneedle. J. Micromech. Microeng. 24(6), 065015 (2014)
Sigurdsson, S.A., Yu, Z., Lee, J., Nurmikko, A.: A method for large scale implantation of 3d microdevice ensembles into brain and soft tissue. bioRxiv (2020)
Luan, L., Wei, X., Zhao, Z., Siegel, J.J., Potnis, O., Tuppen, C.A., Lin, S., Kazmi, S., Fowler, R.A., Holloway, S., et al.: Ultraflexible nanoelectronic probes form reliable, glial scar–free neural integration. Sci. Adv. 3(2), e1601966 (2017)
Arafat, M.A., Rubin, L.N., Jefferys, J.G.R., Irazoqui, P.P.: A method of flexible micro-wire electrode insertion in rodent for chronic neural recording and a device for electrode insertion. IEEE Trans. Neural Syst. Rehabil. Eng. 27(9), 1724–1731 (2019)
Cheung, K.C.: Implantable microscale neural interfaces. Biomed. Microdevices. 9(6), 923–938 (2007)
Cavuto, M.L., Constandinou, T.G.: Investigation of insertion method to achieve chronic recording stability of a semi-rigid implantable neural probe. In: 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), pp. 665–669. IEEE (2019)
Montgomery, K.L., Yeh, A.J., Ho, J.S., Tsao, V., Iyer, S.M., Grosenick, L., Ferenczi, E.A., Tanabe, Y., Deisseroth, K., Delp, S.L., et al.: Wirelessly powered, fully internal optogenetics for brain, spinal and peripheral circuits in mice. Nat. Methods. 12(10), 969 (2015)
Delbeke, J., Hoffman, L., Mols, K., Braeken, D., Prodanov, D.: And then there was light: perspectives of optogenetics for deep brain stimulation and neuromodulation. Front. Neurosci. 11, 663 (2017)
Jeong, J., Laiwalla, F., Lee, J., Ritasalo, R., Pudas, M., Larson, L., Leung, V., Nurmikko, A.: Conformal hermetic sealing of wireless microelectronic implantable chiplets by multilayered atomic layer deposition (ald). Adv. Funct. Mater. 29(5), 1806440 (2019)
Neely, R.M., Piech, D.K., Santacruz, S.R., Maharbiz, M.M., Carmena, J.M.: Recent advances in neural dust: Towards a neural interface platform. Curr. Opin. Neurobiol. 50, 64–71 (2018)
Krüger, J., Caruana, F., Rizzolatti, G., et al.: Seven years of recording from monkey cortex with a chronically implanted multiple microelectrode. Front. Neuroeng. 3, 6 (2010)
Szostak, K.M., Mazza, F., Maslik, M., Leene, L.B., Feng, P., Constandinou, T.G.: Microwire-cmos integration of mm-scale neural probes for chronic local field potential recording. In: 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), pp. 1–4. IEEE (2017)
Charthad, J., Chang, T.C., Liu, Z., Sawaby, A., Weber, M.J., Baker, S., Gore, F., Felt, S.A., Arbabian, A.: A mm-sized wireless implantable device for electrical stimulation of peripheral nerves. IEEE Trans. Biomed. Circuits Syst. 12(2), 257–270 (2018)
Ahmadi, N., Cavuto, M.L., Feng, P., Leene, L.B., Maslik, M., Mazza, F., Savolainen, O., Szostak, K.M., Bouganis, C.-S., Ekanayake, J., et al.: Towards a distributed, chronically-implantable neural interface. In: 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), pp. 719–724. IEEE (2019)
Misra, A., Burke, J.F., Ramayya, A.G., Jacobs, J., Sperling, M.R., Moxon, K.A., Kahana, M.J., Evans, J.J., Sharan, A.D.: Methods for implantation of micro-wire bundles and optimization of single/multi-unit recordings from human mesial temporal lobe. J. Neural Eng. 11(2), 026013 (2014)
Graham, A.H.D., Robbins, J., Bowen, C.R., Taylor, J.: Commercialisation of CMOS integrated circuit technology in multi-electrode arrays for neuroscience and cell-based biosensors. Sensors. 11(5), 4943–4971 (2011)
Najafi, K.: Packaging of implantable microsystems. In: 2007 IEEE SENSORS, pp. 58–63. IEEE (2007)
Balke, T., Völker, B., Schenk, H., Radu, I., Reiche, M.: Wafer bonding for optical mems, Proc. ECS, PV2005-02, pp. 184–193 (2005)
Robblee, L.S., Rose, T.L.: Electrochemical guidelines for selection of protocols and electrode materials for neural stimulation. In: Agnew, W.F., McCreery, D.B. (Eds.), Neural Prostheses: Fundamental Studies, Prentice Hall Biophysics and Bioengineering Series. Prentice Hall, Englewood Cliffs, pp 25–66 (1990)
Graham, A.H.D., Bowen, C.R., Taylor, J., Robbins, J.: Neuronal cell biocompatibility and adhesion to modified CMOS electrodes. Biomed. Microdevices. 11(5), 1091 (2009)
Shaw, C.A., Tomljenovic, L.: Aluminum in the central nervous system (CNS): Toxicity in humans and animals, vaccine adjuvants, and autoimmunity. Immunol. Res. 56(2–3), 304–316 (2013)
Khan, W., Jia, Y., Madi, F., Weber, A., Ghovanloo, M., Li, W.: A miniaturized, wirelessly-powered, reflector-coupled single channel opto neurostimulator. In: 2018 IEEE Micro Electro Mechanical Systems (MEMS), pp. 174–177. IEEE (2018)
Chang, T.C., L Wang, M., Charthad, J., J Weber, M., Arbabian, A.: 27.7 a 30.5 mm 3 fully packaged implantable device with duplex ultrasonic data and power links achieving 95kb/s with¡ 10–4 ber at 8.5 cm depth. In: 2017 IEEE International Solid-State Circuits Conference (ISSCC), pp. 460–461. IEEE (2017)
Morales, J.M.H.: Evaluating biocompatible barrier films as encapsulants of medical micro devices. Ph.D. thesis, Universite Grenoble Alpes (2015)
Maloney, J.M., Lipka, S.A., Baldwin, S.P.: In vivo biostability of cvd silicon oxide and silicon nitride films. MRS Online Proceedings Library Archive, 872 (2005)
Vanhoestenberghe, A., Donaldson, N.: Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices. J. Neural Eng. 10(3), 031002 (2013)
Feng, P., Yeon, P., Cheng, Y., Ghovanloo, M., Constandinou, T.G.: Chip-scale coils for millimeter-sized bio-implants. IEEE Trans. Biomed. Circuits Syst. 99, 1–12 (2018)
Nagarkar, K., Hou, X., Stoffel, N., Davis, E., Ashe, J., Borton, D.: Micro-hermetic packaging technology for active implantable neural interfaces. In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp. 218–223. IEEE (2017)
Kurs, A., Karalis, A., Moffatt, R., Joannopoulos, J.D., Fisher, P., Soljačić, M.: Wireless power transfer via strongly coupled magnetic resonances. Science. 317(5834), 83–86 (2007)
Kiani, M., Ghovanloo, M.: The circuit theory behind coupled-mode magnetic resonance-based wireless power transmission. IEEE Trans. Circuits Syst. I: Regul. Pap. 59(9), 2065–2074 (2012)
Lo, Y., Kuan, Y., Culaclii, S., Kim, B., Wang, P., Chang, C., Massachi, J.A., Zhu, M., Chen, K., Gad, P., Edgerton, V.R., Liu, W.: A fully integrated wireless SoC for motor function recovery after spinal cord injury. IEEE Trans. Biomed. Circuits Syst. 11(3), 497–509 (2017)
IEEE. IEEE standard for safety levels with respect to human exposure to radio frequency electromagnetic fields, 3 kHz to 300 GHz. IEEE Std C95.1–2005 (Revision of IEEE Std C95.1–1991), pp 1–238 (2006)
Food and Drug Administration. Information for manufacturers seeking market clearance of diagnostic ultrasound systems and transducers. Food and Drug Administration, pp 1–64 (September 2008). Accessed 30 Dec 2019
Mano, N.: A 280 μWcm−2 biofuel cell operating at low glucose concentration. Chem. Commun. 19, 2221–2223 (2008)
Roseman, J.M., Lin, J., Ramakrishnan, S., Rosenstein, J.K., Shepard, K.L.: Hybrid integrated biological-solid-state system powered with adenosine triphosphate. Nature. 6, 10070 (2015)
Venkatasubramanian, R., Siivola, E., Colpitts, T., O’Quinn, B.: Thin-film thermoelectric devices with high room-temperature figures of merit. Nature. 413(6856), 597–602 (2001)
Yoon, E.-J., Park, J.-T., Chong-Gun, Y.: Thermal energy harvesting circuit with maximum power point tracking control for self-powered sensor node applications. Front. Inf. Technol. Electron. Eng. 19(2), 285–296 (2018)
Shi, B., Li, Z., Fan, Y.: Implantable energy-harvesting devices. Adv. Mater. 30(44), 1801511 (2018)
Katic, J., Rodriguez, S., Rusu, A.: A high-efficiency energy harvesting interface for implanted biofuel cell and thermal harvesters. IEEE Trans. Power Electron. 33(5), 4125–4134 (2018)
Etemadrezaei, M.: Chapter 22 – Wireless power transfer. In: Rashid, M.H. (ed.) Power Electronics Handbook, 4th edn, pp. 711–722. Butterworth-Heinemann, Oxford (2018)
Tran, L.-G., Cha, H.-K., Park, W.-T.: RF power harvesting: A review on designing methodologies and applications. Micro Nano Syst. Lett. 5(1), 14 (2017)
Ouda, M.H., Arsalan, M., Marnat, L., Shamim, A., Salama, K.N.: 5.2-GHz RF power harvester in 0.18-μm CMOS for implantable intraocular pressure monitoring. IEEE Trans. Microwave Theory Tech. 61(5), 2177–2184 (2013)
Kiani, M., Ghovanloo, M.: A figure-of-merit for designing high-performance inductive power transmission links. IEEE Trans. Ind. Electron. 60(11), 5292–5305 (2013)
Ahn, D., Ghovanloo, M.: Optimal design of wireless power transmission links for millimeter-sized biomedical implants. IEEE Trans. Biomed. Circuits Syst. 10(1), 125–137 (2016)
Ho, J.S., Yeh, A.J., Neofytou, E., Kim, S., Tanabe, Y., Patlolla, B., Beygui, R.E., Poon, A.S.Y.: Wireless power transfer to deep-tissue microimplants. Proc. Natl. Acad. Sci. 111(22), 7974–7979 (2014)
Khalifa, A., Liu, Y., Karimi, Y., Wang, Q., Eisape, A., Stanaevi, M., Thakor, N., Bao, Z., Etienne-Cummings, R.: The microbead: A 0.009 mm3 implantable wireless neural stimulator. IEEE Trans. Biomed. Circuits Syst. 13(5), 971–985 (2019)
Lee, J., Mok, E., Huang, J., Cui, L., Lee, A., Leung, V., Mercier, P., Shellhammer, S., Larson, L., Asbeck, P., Rao, R., Song, Y., Nurmikko, A., Laiwalla, F.: An implantable wireless network of distributed microscale sensors for neural applications. In: 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, p 871–874 (March 2019)
Beauchamp, M.S., Beurlot, M.R., Fava, E., Nath, A.R., Parikh, N.A., Saad, Z.S., Bortfeld, H., Oghalai, J.S.: The developmental trajectory of brain-scalp distance from birth through childhood: Implications for functional neuroimaging. PLOS One. 6(9), 1–9 (2011)
Jow, U., Ghovanloo, M.: Design and optimization of printed spiral coils for efficient transcutaneous inductive power transmission. IEEE Trans. Biomed. Circuits Syst. 1(3), 193–202 (2007)
Ho, J.S., Kim, S., Poon, A.S.Y.: Midfield wireless powering for implantable systems. Proc. IEEE. 101(6), 1369–1378 (2013)
Yeon, P., Mirbozorgi, S.A., Lim, J., Ghovanloo, M.: Feasibility study on active back telemetry and power transmission through an inductive link for millimeter-sized biomedical implants. IEEE Trans. Biomed. Circuits Syst. 11(6), 1366–1376 (2017)
Wolf, P.D.: Thermal considerations for the design of an implanted cortical brainmachine interface (bmi). In: Raton, B. (ed.) Indwelling Neural Implants: Strategies for Contending with the In Vivo Environment, chapter 3, pp. 63–86. CRC Press Taylor & Francis, Boca Raton (2008)
Agarwal, K., Jegadeesan, R., Guo, Y., Thakor, N.V.: Wireless power transfer strategies for implantable bioelectronics. IEEE Rev. Biomed. Eng. 10, 136–161 (2017)
Zargham, M., Gulak, P.G.: Fully integrated on-chip coil in 0.13 μm CMOS for wireless power transfer through biological media. IEEE Trans. Biomed. Circuits Syst. 9(2), 259–271 (2015)
Mark, M., Bjrninen, T., Ukkonen, L., Sydnheimo, L., Rabaey, J.M.: SAR reduction and link optimization for mm-size remotely powered wireless implants using segmented loop antennas. In 2011 IEEE Topical Conference on Biomedical Wireless Technologies, Networks, and Sensing Systems, Phoenix, pp. 7–10 (Jan 2011)
Royet, A.S., Michel, J.P., Reig, B., Pornin, J.L., Ranaivoniarivo, M., Robain, B., de Person, P., Uren, G.: Design of optimized high Q inductors on SOI substrates for RF ICs. In: 2016 IEEE International Conference on Electronics, Circuits and Systems (ICECS), Monte Carlo, p 324–327 (2016)
Park, J., Kim, C., Akinin, A., Ha, S., Cauwenberghs, G., Mercier, P.P.: Wireless powering of mm-scale fully-on-chip neural interfaces. In: 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), Turin, pp. 1–4 (Oct 2017)
Jow, U., Ghovanloo, M.: Modeling and optimization of printed spiral coils in air, saline, and muscle tissue environments. IEEE Trans. Biomed. Circuits Syst. 3(5), 339–347 (2009)
Kim, C., Park, J., Ha, S., Akinin, A., Kubendran, R., Mercier, P.P., Cauwenberghs, G.: A 3 mm × 3 mm fully integrated wireless power receiver and neural interface system-on-chip. IEEE Trans. Biomed. Circuits Syst. 13, 1 (2019)
Mirbozorgi, S.A., Yeon, P., Ghovanloo, M.: Robust wireless power transmission to mm-sized free-floating distributed implants. IEEE Trans. Biomed. Circuits Syst. 11(3), 692–702 (2017)
Lee, B., Ahn, D., Ghovanloo, M.: Three-phase time-multiplexed planar power transmission to distributed implants. IEEE J. Emerg. Sel. Top. Power Electron. 4(1), 263–272 (2016)
Yeon, P., Mirbozorgi, S.A., Ghovanloo, M.: Optimal design of a 3-coil inductive link for millimeter-sized biomedical implants. In: 2016 IEEE Biomedical Circuits and Systems Conference (BioCAS), Shanghai, China, pp. 396–399 (2016)
Karimi, Y., Khalifa, A., Montlouis, W., Stanaevi, M., Etienne-Cummings, R.: Coil array design for maximizing wireless power transfer to sub-mm sized implantable devices. In: 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), pp. 1–4 (Oct 2017)
Lee, J., Laiwalla, F., Jeong, J., Kilfoyle, C., Larson, L., Nurmikko, A., Li, S., Yu, S., Leung, V.W.: Wireless power and data link for ensembles of sub-mm scale implantable sensors near 1GHz. In: 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), pp. 1–4 (Oct 2018)
Troyk, P., Bredeson, S., Cogan, S., Romero-Ortega, M., Suh, S., Hu, Z., Kanneganti, A., Granja-Vazquez, R., Seifert, J., Bak, M.: In-vivo tests of a 16-channel implantable wireless neural stimulator. In: 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER), pages 474–477, April 2015
Troyk, P.R., Bradley, D., Bak, M., Cogan, S., Erickson, R., Hu, Z., Kufta, C., McCreery, D., Schmidt, E., Sung, S., Towle, V.: Intracortical visual prosthesis research – Approach and progress. In: 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference, Shanghai, China, pp. 7376–7379 (Jan 2005)
Chang, S.-I., Park, S.-Y., Yoon, E.: Minimally-invasive neural interface for distributed wireless electrocorticogram recording systems. Sensors. 18(1):263 (2018)
Mirbozorgi, S.A., Bahrami, H., Sawan, M., Gosselin, B.: A smart cage with uniform wireless power distribution in 3D for enabling long-term experiments with freely moving animals. IEEE Trans. BioCAS. 10(2), 424--434 (2016)
Jia, Y., Mirbozorgi, S.A., Zhang, P., Inan, O.T., Li, W., Ghovanloo, M.: A dual-band wireless power transmission system for evaluating mm-sized implants. IEEE Trans. Biomed. Circuits Syst. 13(4), 595--607 (2019)
Park, S.I., Brenner, D.S., Shin, G., Morgan, C.D., Copits, B.A., Chung, H.U., Pullen, M.Y., Noh, K.N., Davidson, S., Oh, S.J., Yoon, J., Jang, K.-I., Samineni, V.K., Norman, M., Grajales-Reyes, J.G., Vogt, S.K., Sundaram, S.S., Wilson, K.M., Ha, J.S., Xu, R., Pan, T., Kim, T., Huang, Y., Montana, M.C., Golden, J.P., Bruchas, M.R., Gereau, R.W., Rogers, J.A.: Soft, stretchable, fully implantable miniaturized optoelectronic systems for wireless optogenetics. Nat. Biotechnol. 33(12), 1280--1286 (2015)
Feng, P., Maslik, M., Constandinou, T.G.: Em-lens enhanced power transfer and multinode data transmission for implantable medical devices. In: 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS), Nara, Japan, pp. 1--4 (2019)
Leene, L.B., Maslik, M., Feng, P., Szostak, K.M., Mazza, F., Constandinou, T.G.: Autonomous SoC for neural local field potential recording in mm-scale wireless implants. In: 2018 IEEE International Symposium on Circuits and Systems (ISCAS), Florence, Italy, pp. 1--5 (May 2018)
Lipworth, G., Ensworth, J., Seetharam, K., Huang, D., Lee, J.S., Schmalenberg, P., Nomura, T., Reynolds, M.S., Smith, D.R., Urzhumov, Y.: Magnetic metamaterial superlens for increased range wireless power transfer. Sci. Rep. 4(1), 3642 (2014)
Kiani, M., Ghovanloo, M.: A 13.56-Mbps pulse delay modulation based transceiver for simultaneous near-field data and power transmission. IEEE Trans. Biomed. Circuits Syst. 9(1), 1--11 (2015)
Wang, M.L., Baltsavias, S., Chang, T.C., Weber, M.J., Charthad, J., Arbabian, A.: Wireless data links for next-generation networked micro-implantables. In: 2018 IEEE Custom Integrated Circuits Conference (CICC), San Diego, pp. 1--9 (Apr 2018)
Ozeri, S., Shmilovitz, D.: Ultrasonic transcutaneous energy transfer for powering implanted devices. Ultrasonics. 50(6), 556--566 (2010)
Meng, H., Sahin, M.: An electroacoustic recording device for wireless sensing of neural signals. In: 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Osaka, pp. 3086--3088 (July 2013)
Taalla, R.V., Arefin, M.S., Kaynak, A., Kouzani, A.Z.: A review on miniaturized ultrasonic wireless power transfer to implantable medical devices. IEEE Access. 7, 2092--2106 (2019)
Charthad, J., Weber, M.J., Chang, T.C., Arbabian, A.: A mm-sized implantable medical device (IMD) with ultrasonic power transfer and a hybrid bi-directional data link. IEEE J. Solid State Circuits. 50(8), 1741--1753 (2015)
Chang, T.C., Weber, M.J., Charthad, J., Baltsavias, S., Arbabian, A.: End-to-end design of efficient ultrasonic power links for scaling towards submillimeter implantable receivers. IEEE Trans. Biomed. Circuits Syst. 12(5), 1100--1111 (2018)
Maleki, T., Cao, N., Song, S.H., Kao, C., Ko, S., Ziaie, B.: An ultrasonically powered implantable micro-oxygen generator (IMOG). IEEE Trans. Biomed. Eng. 58(11), 3104--3111 (2011)
Ayazian, S., Hassibi, A.: Delivering optical power to subcutaneous implanted devices. In: 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Boston, pp. 2874--2877 (Aug 2011)
Lee, S., Cortese, A.J., Gandhi, A.P., Agger, E.R., McEuen, P.L., Molnar, A.C.: A 250 μm × 57 μm microscale opto-electronically transduced electrodes (MOTEs) for neural recording. IEEE Trans. Biomed. Circuits Syst. 12(6), 1256--1266 (2018)
Mujeeb-U-Rahman, M., Adalian, D., Chang, C.-F., Scherer, A.: Optical power transfer and communication methods for wireless implantable sensing platforms. J. Biomed. Opt. 20(9), 1--9 (2015)
Das, R., Moradi, F., Heidari, H.: Biointegrated and wirelessly powered implantable brain devices: A review. IEEE Trans. Biomed. Circuits Syst. 14, 343--358 (2020)
Ash, C., Dubec, M., Donne, K., Bashford, T.: Effect of wavelength and beam width on penetration in light-tissue interaction using computational methods. Lasers Med. Sci. 32(8), 1909--1918 (2017)
Ebrazeh, A., Mohseni, P.: 30 pJ/b, 67 Mbps, centimeter-to-meter range data telemetry with an IR-UWB wireless link. IEEE Trans. Biomed. Circuits Syst. 9(3), 362--369 (2015)
Inanlou, F., Kiani, M., Ghovanloo, M.: A 10.2 Mbps pulse harmonic modulation based transceiver for implantable medical devices. IEEE J. Solid State Circuits. 46(6), 1296--1306 (2011)
Kuan, Y., Lo, Y., Kim, Y., Chang, M.F., Liu, W.: Wireless gigabit data telemetry for large-scale neural recording. IEEE J. Biomed. Health Inform. 19(3), 949--957 (2015)
Jiang, D., Cirmirakis, D., Schormans, M., Perkins, T.A., Donaldson, N., Demosthenous, A.: An integrated passive phase-shift keying modulator for biomedical implants with power telemetry over a single inductive link. IEEE Trans. Biomed. Circuits Syst. 11(1), 64--77 (2017)
Leene, L.B., Luan, S., Constandinou, T.G.: A 890fJ/bit UWB transmitter for SoC integration in high bit-rate transcutaneous bio-implants. In: 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), pp. 2271--2274. IEEE (2013)
Chae, M.S., Yang, Z., Yuce, M.R., Hoang, L., Liu, W.: A 128-channel 6 mW wireless neural recording IC with spike feature extraction and UWB transmitter. IEEE Trans. Neural Syst. Rehabil. Eng. 17(4), 312--321 (2009)
Lim, J., Rezvanitabar, A., Degertekin, F.L., Ghovanloo, M.: An impulse radio PWM-based wireless data acquisition sensor interface. IEEE Sensors J. 19(2), 603--614 (2019)
Islam, M.N., Yuce, M.R.: Review of medical implant communication system (mics) band and network. ICT Express. 2(4), 188--194 (2016). Special Issue on Emerging Technologies for Medical Diagnostics
Ghanbari, M.M., Piech, D.K., Shen, K., Faraji Alamouti, S., Yalcin, C., Johnson, B.C., Carmena, J.M., Maharbiz, M.M., Muller, R.: A sub-mm3 ultrasonic free-floating implant for multi-mote neural recording. IEEE J. Solid State Circuits. 54(11), 3017--3030 (2019)
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Szostak, K.M., Feng, P., Mazza, F., Constandinou, T.G. (2023). Distributed Neural Interfaces: Challenges and Trends in Scaling Implantable Technology. In: Thakor, N.V. (eds) Handbook of Neuroengineering. Springer, Singapore. https://doi.org/10.1007/978-981-16-5540-1_11
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