Editorial board
Honorary Editors-in-Chief
Kuang-Di Xu, Honorary Chairman of the Governing Board of Chinese Academy of Engineering, China
Ji Zhou, President of Chinese Academy of Engineering, China
Editor-in-Chief
Hong-Jie Luo, Shanghai University, China
Executive Editor-in-Chief
Andrew Y C Nee, National University of Singapore, Singapore
Associate Editors-in-Chief
Jin-Wu Qian, Shanghai University, China
Wen-Cong Lu, Shanghai University, China
Jian-Hua Zhang, Shanghai University, China
Members of Editorial Board
Sung-Hoon Ahn, Seoul National University, Korea
Daniel Brissaud, University of Grenoble, France
Erhan Budak, Sabanci University, Turkey
Xun Cao, Shanghai Institute of Ceramics, China
Kuo-chih Chou, University of Science and Technology Beijing, China
Coddet Christian, University of Technology Belfort-Montbéliard, France
Paul P. Conway, Loughborough University, UK
Han Ding, Huazhong University of Science and Technology, China
Wen-Feng Ding, Nanjing University of Aeronautics and Astronautics, China
Joost Duflou, KU Leuven, Belgium
Feng-Zhou Fang, Tianjin University, China
Livan Fratini, University of Palermo, Italy
Min-Rui Fei, Shanghai University, China
Ming-Wang Fu, The Hong Kong Polytechnic University, Hong Kong, China
Hitomi Yamaguchi Greenslet, University of Florida, USA
Jiang Guo, Dalian University of Technology, China
Qing-Long Han, Swinburne University of Technology, Australia
Nobuyuki Iwatsuki, Tokyo Institute of Technology, Japan
Masanori Kunieda, The University of Tokyo, Japan
Han-Xiong Li, City University of Hong Kong, China
Heng Li, Northwestern Polytechnical University, China
Johan Liu, Chalmers University of Technology, Sweden
Ke Lu, Institute of Metal Research, Chinese Academy of Sciences, China
Wen-Cong Lu, Shanghai University, China
Hong-Jie Luo, Shanghai University, China
Eric Lutters, University of Twente, Holland
Zhao-Ping Lü, University of Science and Technology Beijing, China
Dimitris Mourtzis, University of Patras, Greece
Andrew Y C Nee, National University of Singapore, Singapore
Uday B. Pal, Boston University, USA
Jin-Wu Qian, Shanghai University, China
Mani Ratnam, Universiti Sains Malaysia, Malaysia
Ramana G. Reddy, University of Alabama, USA
Rajkumar Roy, Cranfield University, UK
Jin-You Shao, Xi’an Jiaotong University, China
Wilfried Sihn, Vienna University of Technology (TU Wien), Austria
John W. Sutherland, Purdue University, USA
Manoj Kumar Tiwari, Indian Institute of Technology, India
Da-Wei Tu, Shanghai University, China
Ke-Sheng Wang, Norwegian University of Science and Technology, Norway
Shao-Rong Xie, Shanghai University, China
Cai-Hua Xiong, Huazhong University of Science and Technology, China
Xun Willian Xu, University of Auckland, New Zealand
Ying-jie Yu, Shanghai University, China
Matthew Yuen, Hong Kong University of Science and Technology, China
Qi-Jie Zhai, Shanghai University, China
Jian-Hua Zhang, Shanghai University, China
Jie-Yu Zhang, Shanghai University, China
Li-Feng Zhang, University of Science and Technology Beijing, China
Liang-Chi Zhang, Southern University of Science and Technology, China
Wen-Jun Zhang, University of Saskatchewan, Canada
Xiang-Yang Zhu, Shanghai Jiao Tong University, China
Adviser of Editorial Board
Shi-Qiang Dai, Shanghai University, China