Shaping the face and the voice of TMS: You can help to ensure all demographics are represented Elizabeth A. Holm Feature 25 October 2011 Pages: 11 - 11
Trends in aluminum materials usage for electronics Robert E. Sanders Jr.David M. Farnsworth Feature 25 October 2011 Pages: 12 - 15
The 12th World Conference on Titanium presents research and applications of “wonder metal” M. Ashraf Imam Features 25 October 2011 Pages: 16 - 23
Magnetic materials and devices: Research and applications Ashutosh Tiwari Magnetic Materials and Devices 25 October 2011 Pages: 24 - 24
Magnetic behavior of CeO2-δ thin films doped with non-magnetic transition metals Paul SlusserDhananjay KumarAshutosh Tiwari Magnetic Materials and Devices 25 October 2011 Pages: 25 - 28
VO2 thin films: Defect mediation in room temperature ferromagnetic switching characteristics Sudhakar NoriT. -H. YangJagdish Narayan Magnetic Materials and Devices 25 October 2011 Pages: 29 - 33
Microemulsion synthesis and magnetic properies of BaAl4Fe8O19 powders H. Y. HeZ. HeQ. Shen Magnetic Materials and Devices 25 October 2011 Pages: 34 - 36
Solidification of electronic materials: An overview André Phillion Electronic Materials Solidification 25 October 2011 Pages: 37 - 37
Solidification of silicon for electronic and solar applications Lars ArnbergMarisa Di SabatinoEivind Øvrelid Electronic Materials Solidification 25 October 2011 Pages: 38 - 42
Reducing impurities of multicrystalline silicon in a unidirectional solidification furnace for solar cells B. GaoS. NakanoK. Kakimoto Electronic Materials Solidification 25 October 2011 Pages: 43 - 46
Impact of processing conditions and solder materials on surface mount assembly defects Rajen S. SidhuRaiyo AspandiarGregorio Murtagian Electronic Materials Solidification 25 October 2011 Pages: 47 - 51
Microstructure formation in Sn-Cu-Ni solder alloys M. FelberbaumT. VenturaA. K. Dahle Electronic Materials Solidification 25 October 2011 Pages: 52 - 55
Lead-free solders: Reliability, an ongoing saga Srinivas Chada Lead-Free Solders 25 October 2011 Pages: 56 - 56
Tin whiskers: An illustrated guide to growth mechanisms and morphologies J. W. Osenbach Nanomaterials: Mechanical Behavior 25 October 2011 Pages: 57 - 60
Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation Eric ChasonNitin JadhavFei Pei Lead-Free Solders 25 October 2011 Pages: 62 - 68
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias I. DuttaP. KumarM. S. Bakir Lead-Free Solders 25 October 2011 Pages: 70 - 77
The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines David F. RaePeter BorgesenEric J. Cotts Lead-Free Solders 25 October 2011 Pages: 78 - 84
A celebration of both quantity AND quality: Symposium honors the prolific career of Randall M. German Lynne Robinson End Notes 25 October 2011 Pages: 88 - 88