Electroluminescence and lasing properties of highly Bi-doped PbTe epitaxial layers grown by temperature difference method under controlled vapor pressure Wataru TamuraArata YasudaJun-Ichi Nishizawa Regular Issue Paper Pages: 39 - 42
Palladium as a contact material for InSb semiconductors—The In-Pd-Sb phase diagram Christoph LuefHans FlandorferHerbert Ipser Regular Issue Paper Pages: 43 - 51
Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating Chi-Won HwangJung-Goo LeeHirotaro Mori Regular Issue Paper Pages: 52 - 62
The wettability and microstructure of Sn-Zn-RE alloys C. M. L. WuC. M. T. LawL. Wang Regular Issue Paper Pages: 63 - 69
Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems Thomas StudnitzkyRainer Schmid-Fetzer Regular Issue Paper Pages: 70 - 80
Thermodynamic modeling of the Au-In-Sb ternary system H. S. LiuC. L. LiuK. Ishida Regular Issue Paper Pages: 81 - 88
Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology Chien-Sheng HuangJenq-Gong DuhJyh-Hwa Wang Regular Issue Paper Pages: 89 - 94
Wetting interaction between Sn-Zn-Ag solders and Cu Kwang-Lung LinChia-Ling Shih Regular Issue Paper Pages: 95 - 100
Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications S. H. FanY. C. Chan Regular Issue Paper Pages: 101 - 108