Abstract
Electronics, such as printed circuit board (PCB), transistor, radio frequency identification (RFID), organic light emitting diode (OLED), solar cells, electronic display, lab on a chip (LOC), sensor, actuator, and transducer etc. are playing increasingly important roles in people’s daily life. Conventional fabrication strategy towards integrated circuit (IC), requesting at least six working steps, generally consumes too much energy, material and water, and is not environmentally friendly. During the etching process, a large amount of raw materials have to be abandoned. Besides, lithography and microfabrication are typically carried out in “Cleanroom” which restricts the location of IC fabrication and leads to high production costs. As an alternative, the newly emerging ink-jet printing electronics are gradually shaping modern electronic industry and its related areas, owing to the invention of a series of conductive inks composed of polymer matrix, conductive fillers, solvents and additives. Nevertheless, the currently available methods also encounter some technical troubles due to the low electroconductivity, complex sythesis and sintering process of the inks. As an alternative, a fundamentally different strategy was recently proposed by the authors’ lab towards truly direct writing of electronics through introduction of a new class of conductive inks made of low melting point liquid metal or its alloy. The method has been named as direct writing of electronics based on alloy and metal (DREAM) ink. A series of functional circuits, sensors, electronic elements and devices can thus be easily written on various either soft or rigid substrates in a moment. With more and more technical progresses and fundamental discoveries being kept made along this category, it was found that a new area enabled by the DREAM ink electronics is emerging, which would have tremendous impacts on future energy and environmental sciences. In order to promote the research and development along this direction, the present paper is dedicated to draft a comprehensive picture on the DREAM ink technology by summarizing its most basic features and principles. Some important low melting point metal ink candidates, especially the room temperature liquid metals such as gallium and its alloy, were collected, listed and analyzed. The merits and demerits between conventional printed electronics and the new direct writing methods were comparatively evaluated. Important scientific issues and technical strategies to modify the DREAM ink were suggested and potential application areas were proposed. Further, digestions on the impacts of the new technology among energy, health, and environmental sciences were presented. Meanwhile, some practical challenges, such as security, environment-friendly feature, steady usability, package, etc. were summarized. It is expected that the DREAM ink technology will initiate a series of unconventional applications in modern society, and even enter into peoples’ daily life in the near future.
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References
Harrop P, Das R. Player and Opportunities 2012–2022. FRID Market Research Report. 2012
Sun Y G, Rogers J A. Inorganic semiconductors for flexible electronics. Advanced Materials, 2007, 19(15): 1897–1916
Leenen M A M, Arning V, Thiem H, Steiger J, Anselmann R. Printable electronics: Flexibility for the future. Physical Status Solidi A, 2009, 206(4): 588–597
Cui Z. Printed Electronics: Materials, Technologies and Applications. Beijing: Higher Education Press, 2012 (in Chinese)
Gao Y X, Li H Y, Liu J. Direct writing of flexible electronics through room temperature liquid metal ink. PLoS One, 2012, 7(9): e45485
Li H Y, Yang Y, Liu J. Printable tiny thermocouple by liquid metal gallium and its matching metal. Applied Physics Letters, 2012, 101(7): 073511
Liu J, Li H Y. A liquid metal based printed circuit board and its fabrication method. China Patent 201110140156. 6, 2011
Gao Y X, Li H Y, Liu J, Yan X M. Liquid metal ink enabled direct writing of functional circuits: A super-simple way for alternative electronics, 2012, in review
Liu J. Printable semiconductive device and its fabrication method. China Patent 2012103572802, 2012
Liu J, Li H Y. A thermal energy harvesting device and its fabrication method. China Patent 201210241718.0, 2012
Liu J. Piezoelectric thin film electricity generator and its fabrication method, China Patent 2012103225845, 2012
Liu J. Liquid metal ink printed microfluidic lab on paper and its fabrication method. China Patent 2012103625068, 2012
Liu J. Printable solar cell and its fabrication method. China Patent 2012103224715, 2012
Horikawa T, Mikami N, Makita T, Tanimura J, Kataoka M, Sato K, Nunoshita M. Dielectric properties of (Ba, Sr)TiO3 thin films deposited by RF sputtering. Journal of Applied Physics, 1993, 32(1): 4126–4130
Sun X W, Kwok H S. Optical properties of epitaxially grown zinc oxide films on sapphire by pulsed laser deposition. Journal of Applied Physics, 1999, 86(1): 408–411
Carcia P F, McLean R S, Reilly M H, Nunes G. Transparent ZnO thin-film transistor fabricated by RF magnetron sputtering. Applied Physics Letters, 2003, 82(7): 1117–1119
Gross M, Linse N, Maksimenko L, Wellmann P J. Conductance enhancement mechanisms of printable nanoparticulate indium tin oxide (ITO) Layers for Application in Organic Electronic Devices. Advanced Engineering Materials, 2009, 11(4): 295–301
Russo A, Ahn B Y, Adams J J, Duoss E B, Bernhard J T, Lewis J A. Pen-on-paper flexible electronics. Advanced Marerials, 2011, 23(30): 3426–3430
Cho J H, Lee J, Xia Y, Kim B, He Y, Renn MJ, Lodge T P, Frisbie C D. Printable ion-gel gate dielectrics for low-voltage polymer thin-film transistors on plastic. Nature Materials, 2008, 7(11): 900–906
Aernouts T, Vanlaeke P, Geens W, Poortmans J, Heremans P, Borghs S, Mertens R, Andriessen R, Leenders L. Printable anodes for flexible organic solar cell modules. Thin Solid Films, 2004, 451–452: 22–25
Arias A C, Ready S E, Lujan R, Wong W S, Paul K E, Salleo A, Chabinyc M L, Apte R, Street R A, Wu Y, Liu P, Ong B. All jetprinted polymer thin-film transistor active-matrix backplanes. Applied Physics Letters, 2004, 85(15): 3304–3306
Li B, Santhanam S, Schultz L, Jeffries-EL M, Iovu M C, Sauvé G, Cooper J, Zhang R, Revelli J C, Kusne A G, Snyder J L, Kowalewski T, Weiss L E, McCullough R D, Fedder G K, Lambeth D N. Inkjet printed chemical sensor array based on polythiophene conductive polymers. Sensors and Actuators B, Chemical, 2007, 123(2): 651–660
Nur H M, Song J H, Evans J R G, Edirisinghe M J. Ink-jet printing of gold conductive tracks. Materials in Electronics, 2002, 13(4): 213–219
Lee H H, Chou K S, Huang K C. Inkjet printing of nanosized silver colloids. Nanotechnology, 2005, 16(10): 2436–2441
Woo K, Kim D, Kim J S, Lim S, Moon J. Ink-jet printing of Cu-Ag-based highly conductive tracks on a transparent substrate. Langmuir, 2009, 25(1): 429–433
Smith P J, Shin D Y, Stringer J E, Derby B, Reis N. Direct ink-jet printing and low temperature conversion of conductive silver patterns. Journal of Materials Science, 2006, 41(13): 4153–4158
Kim D, Jeong S, Park B K, Moon J. Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions. Applied Physics Letters, 2006, 89(26): 264101
Kim D, Moon J. Highly Conductive ink jet printed films of nanosilver particles for printable electronics. Electrochemical and Solid-State Letters, 2005, 8(11): 30–33
Kim Y, Lee B, Yang S, Byun I, Jeong I, Cho S M. Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing. Current Applied Physics, 2012, 12(2): 473–478
Tang X F, Yang Z G, Wang W J. A simple way of preparing highconcentration and high-purity nano copper colloid for conductive ink in inkjet printing technology. Colloid and Surfaces A. Physicochemical and Engineering Aspects, 2010, 360(1–3): 99–104
Park B K, Kim D, Jeong S, Moon J, Kim J S. Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films, 2007, 515(19): 7706–7711
Lee B, Kim Y, Yang S, Jeong I, Moon J. A low-cure-temperature copper nano ink for highly conductive printed electrodes. Current Applied Physics, 2009, 9(2): 157–160
Kordás K, Mustonen T, Tóth G, Jantunen H, Lajunen M, Soldano C, Talapatra S, Kar S, Vajtai R, Ajayan P M. Inkjet printing of electrically conductive patterns of carbon nanotubes. Small, 2006, 2(8–9): 1021–1025
Denneulin A, Bras J, Carcone F, Neuman C, Blayo A. Impact of ink formulation on carbon nanotube network organization within inkjet printed conductive films. Carbon, 2011, 49(8): 2603–2614
Huang D, Liao F, Molesa S, Redinger D, Subramanian V. Plasticcompatible low resistance printable gold nanoparticle conductors for flexible electronics. Journal of the Electrochemical Society, 2003, 150(7): 412–417
Kaempgen M, Chan C K, Ma J, Cui Y, Gruner G. Printable thin film supercapacitors using single-walled carbon nanotubes. Nano Letters, 2009, 9(5): 1872–1876
Maksimenko I, Kilian D, Mehringer C, Voigt M, Peukert W, Wellmann P J. Fabrication, charge carrier transport, and application of printable nanocomposites based on indium tin oxide nanoparticles and conducting polymer 3,4-ethylenedioxythiophene/polystyrene sulfonic acid. Journal of Applied Physics, 2011, 110(10): 104301–104308
Sekitani T, Nakajima H, Maeda H, Fukushima T, Aida T, Hata K, Someya T. Stretchable active-matrix organic light-emitting diode display using printable elastic conductors. Nature Materials, 2009, 8(6): 494–499
Lee D H, Chang Y J, Herman G S, Chang C H. A general route to printable high-mobility transparent amorphous oxide semiconductors. Advanced Materials, 2007, 19(6): 843–847
Fortuna S A, Wen J G, Chun I S, Li X. Planar GaAs nanowires on GaAs (100) substrates: Self-aligned, nearly twin-defect free, and transfer-printable. Nano Letters, 2008, 8(12): 4421–4427
Panthani MG, Akhavan V, Goodfellow B, Schmidtke J P, Dunn L, Dodabalapur A, Barbara P F, Korgel B A. Synthesis of CulnS2, CulnSe2, and Cu(InxGa(1−x))Se2 (CIGS) nanocrystal “inks” for printable photovoltaics. Journal of the American Chemical Society, 2008, 130(49): 16770–16777
Guillemles J F, Kronik L, Cahen D, Rau U, Jasenek A, Schock HW. Stability issues of Cu(In,Ga)Se2-based solar cells. Journal of Chemical Physics B, 2000, 104(20): 4849–4862
Volkman S K, Mattis B A, Molesa S E, Lee J B, de la Fuente Vornbrock A, Bakhishev T, Subramanian V. A novel transparent air-stable printable n-type semiconductor technology using ZnO nanoparticles. In: IEEE International Electron Devices Meeting. Berkeley, USA, 2004, 769–772
Dasgupta S, Gottschalk S, Kruk R, Hahn H. A nanoparticulate indium tin oxide field-effect transistor with solid electrolyte gating. Nanotechnology, 2008, 19(43): 435203.1–435203.6
Jeong J A, Kim H K. Characteristics of inkjet-printed nano indium tin oxide particles for transparent conducting electrodes. Current Applied Physics, 2010, 10(4): 105–108
Gross M, Linse N, Maksimenko I, Wellmann P J. Conductance enhancement mechanisms of printable nanoparticulate indium tin oxide (ITO) layers for application in organic electronic devices. Advanced Engineering Materials, 2009, 11(4): 295–301
Allen M L. Nanoparticle sintering methods and applications for printed electronics. Dissertation for the Doctoral Degree. Espoo, Finland: Aalto University, 2011
Siden J, Fein M K, Koptyug A, Nilsson H E. Printed antennas with variable conductive ink layer thickness. IET Microwaves, Antennas and Propagation, 2007, 1(2): 401–407
Yan H, Chen Z H, Zheng Y, Newman C, Quinn J R, Dötz F, Kastler M, Facchetti A. A high-mobility electron-transporting polymer for printed transistors. Nature, 2009, 457(7230): 679–686
Pudas M, Hagberg J, Leppävuori S. Gravure offset printing of polymer inks for conductors. Progress in Organic Coatings, 2004, 49(4): 324–335
Shaheen S E, Radspinner R, Peyghambarian N, Jabbour G E. Fabrication of bulk heterojunction plastic solar cells by screen printing. Applied Physics Letters, 2001, 79(18): 2996–2998
Pardo D A, Jabbour G E, Peyghambarian N. Application of screen printing in the fabrication of organic light-emitting devices. Advanced Materials, 2000, 12(17): 1249–1252
Ito S, Chen P, Comte P, Nazeeruddin M K, Liska P, Péchy P, Grätzel M. Fabrication of screen-printing pastes from TiO2 powders for dye-sensitised solar cells. Progress in Photovoltaics: Research and Applications, 2007, 15(7): 603–612
Bao Z N, Rogers J A, Katz H E. Printable organic and polymeric semiconducting materials and devices. Journal of Materials Chemistry, 1999, 9(9): 1895–1904
Renn M J. Direct Write System. US7270844 B2. 2007
Martin G D, Hoath S D, Hutchings I M. Inkjet printing—The physics of manipulating liquid jets and drops. Journal of Physics: Conference Series, 2008, 105(1): 012001
Mette A, Richter P L, Hörteis M, Glunz S W. Metal aerosol jet printing for solar cell metallization. Progress in Photovoltaics: Research and Applications, 2007, 15(7): 621–627
Ahn B Y, Duoss E B, Motala M J, Guo X, Park S I, Xiong Y, Yoon J, Nuzzo R G, Rogers J A, Lewis J A. Omnidirectional printing of flexible, stretchable, and spanning silver microelectrodes. Science, 2009, 323(5921): 1590–1593
Kahn B E. The M3D aerosol jet system, an alternative to inkjet printing for printed electronics. Organic and Printed Electronics, 2007, 1: 14–17
Hon K K B, Li L, Hutchings I M. Direct writing technology—Advances and developments. Manufacturing Technology, 2008, 57(2): 601–620
Perelaer J, De Laat A W M, Hendriks C E, Schubert U S. Inkjetprinted silver tracks: Low temperature curing and thermal stability investigation. Journal of Materials Chemistry, 2008, 18(27): 3209–3215
Allen M L, Aronniemi M, Mattila T, Alastalo A, Ojanperä K, Suhonen M, Seppä H. Electrical sintering of nanoparticle structures. Nanotechnology, 2008,19(17): 175201.1–175201.4
Ko S H, Pan H, Grigoropoulos C P, Luscombe C K, Fréchet J M J, Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34), 345202.1–345202.8
Perelaer J, de Gans B J, Schubert U S. Ink-jet printing and microwave sintering of conductive silver tracks. Advanced Materials, 2006, 18(16): 2101–2104
Perelaer J, Klokkenburg M, Hendriks C E, Schubert U S. Microwave flash sintering of inkjet-printed silver tracks on polymer substrates. Advanced Materials, 2009, 21(47): 4830–4834
Magdassi S, Grouchko M, Berezin O, Kamyshny A. Triggering the sintering of silver nanoparticles at room temperature. ACS Nano, 2010, 4(4): 1943–1948
Wakuda D, Kim C J, Kim K S, Suganuma K. Room temperature sintering mechanism of Ag nanoparticle paste. In: Proceedings of the 2nd Electronics System-Integration Technology Conference. Greenwich, 2008, 909–914
Zapka W, Voil W, Loderer C, Lang P. Low temperature chemical post-treatment of inkjet printed nano-particle silver inks. In: International Conference on Digital Printing Technologies and Digital Fabrication. Pittsburgh: NIP24, 2008, 9: 906–911
Munir Z A, Anselmi-Tamburini U, Ohyanagi M. The effect of electric field and pressure on the synthesis and consolidation of materials: A review of the spark plasma sintering method. Journal of Materials Science, 2006, 41(3): 763–777
Ko S H, Pan H, Grigoropoulos C P, Luscombe C K, Fréchet J M J, Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34): 345202
Thostenson E T, Chou TW. Microwave processing: Fundamentals and applications. Composites. Part A, Applied Science and Manufacturing, 1999, 30(9): 1055–1071
Li H Y, Liu J. Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20–42
Ma K Q, Liu J. Heat-driven liquid metal cooling device for the thermal management of a computer chip. Journal of Physics. D, Applied Physics, 2007, 40(15): 4722–4729
Liu J, Zhou Y X, Lv Y G, Li T. Liquid metal based miniaturized chip-cooling device driven by electromagnetic pump. In: ASME 2005 International Mechanical Engineering Congress and Exposition. Orlando, USA, 2005: 501–510
Deng Y G, Liu J. Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices. Heat and Mass Transfer, 2010, 46(11–12): 1327–1334
Deng Y G, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788–791
Liu J, Zhou Y X. A computer chip cooling method which uses low melting point metal and its alloys as the cooling fluid. China Patent02131419.5, 2002
Deng Z S, Liu J. Capacity evaluation of a MEMS based micro cooling device using liquid metal as coolant. In: The 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhuhai, China.2006, 1311–1315
Deng Y G, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs. ASME Journal of Electronic Packaging, 2010, 132(3): 031009
Plevachuk Y, Sklyarchuk V, Yakymovych A, Svec P, Janickovic D, Illekova E. Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys. Journal of Materials Science Materials in Electronics, 2011, 22(6): 631–638
Li P P, Liu J. Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal. ASME Journal of Electronic Packaging, 2011, 133(4): 041009
Deng Y G, Liu J, Zhou Y X. Liquid metal based mini/micro channel cooling device. In: ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels June. Pohang, South Korea, 2009, 253–259
Jia D W, Liu J, Zhou Y. Harvesting human kinematical energy based on liquid metal magnetohydrodynamics. Physics Letters. [Part A], 2009, 373(15): 1305–1309
Dai D, Zhou Y X, Liu J. Liquid metal based thermoelectric generation system for waste heat recovery. Renewable Energy, 2011, 36(12): 3530–3536
Li P P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106-1–094106-3
Ge H S, Liu J. Phase change effect of low melting point metal for an automatic cooling of USB flash memory. Frontiers in Energy, 2012, 6(3): 207–209
Islam R A, Chan Y C, Jillek W, Islam S. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectronics Journal, 2006, 37(8): 705–713
Wang H, Xue S B, Chen W X, Zhao F. Effects of Ga-Ag, Ga-Al and Al-Ag additions on the wetting characteristics of Sn-9Zn-X-Y lead-free solders. Journal of Materials Science: Materials in Electronics, 2009, 20(12): 1239–1246
Fu C C, Chen C C. Investigations of wetting properties of Ni-Vand Ni-Co alloys by Sn, Sn-Pb, Sn-Cu, and Sn-Ag-Cu solders. Journal of the Taiwan Institute of Chemical Engineers, 2011, 42(2): 350–355
Zhao N, Pan XM, Yu D Q, Ma H T, Wang L. Viscosity and surface tension of liquid Sn-Cu lead-free solders. Journal of Electronic Materials, 2009, 38(6): 828–833
Noor E E M, Sharif N M, Yewa C K, Ariga T, Ismail A B, Hussain Z. Wettability and strength of In-Bi-Sn lead-free solder alloy on copper substrate. Journal of Alloys and Compounds, 2010, 507(1): 290–296
Zhang Y, Liang T X, Jusheng M A. Phase diagram calculation on Sn-Zn-Ga solders. Journal of Non-Crystalline Solids, 2004, 336(2): 153–156
Ma K Q, Liu J, Xiang S H, Xie K W, Zhou Y X. Study of thawing behavior of liquid metal used as computer chip coolant. International Journal of Thermal Sciences, 2008, 48(5): 964–974
Chentsov V P, Shevchenko V G, Mozgovoi A G, Pokrasin M A. Density and surface tension of heavy liquid metal coolants: Gallium and indium. Inorganic Materials: Applied Research, 2011, 2(5): 468–473
Gao Y X, Liu J. Gallium-based thermal interface material with high compliance and wettability. Applied Physics: A, Materials Science & Processing, 2012, 107(3): 701–708
Thostenson E T. The determination of the viscosity of liquid gallium over an extended range of temperature. Proceedings of the Physical Society, 1936, 48(2): 299–311
Shalaby R M. Influence of indium addition on structure, mechanical, thermal and electrical properties of tin-antimony based metallic alloys quenched from melt. Journal of Alloys and Compounds, 2009, 480(2): 334–339
Park H S, Cao L F, Dodbiba G, Fujita T. Preparation and properties of silica-coated ferromagnetic nano particles dispersed in a liquid gallium based magnetic fluid. In: The 11th International Conference on Electrorheological Fluids and Magnetorheological Suspensions. Dresden, Germany, 2008
Ito R, Dodbiba G, Fujita T. MR fluid of liquid gallium dispersing magnetic particles. International Journal of Modern Physics B, 2005, 19(7–9): 1430–1436
Shi Y, Tian J, Hao H, Xia Z, Lei Y, Guo F. Effects of small amount addition of rare earth Er on microstructure and property of Sn-Ag-Cu solder. Journal of Alloys and Compounds, 2008, 453(1,2): 180–184
Deng Y G, Liu J. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device. Applied Physics: A, Materials Science & Processing, 2009, 95(3): 907–915
Lau J H, Wong C P, Lee N C, Lee R. Electronics Manufacturing: with Lead-Free, Halogen-Free and Conductive-Adhesive Materials. New York: McGraw Hill, 2002
Indium Corporation of America, Europe and Asia. Solder alloy chart. http://www.indium.com/products/, accessed on July, 2012
Hamadaa N, Uesugib T, Takigawab Y, Higashi K. Effects of Zn addition and aging treatment on tensile properties of Sn-Ag-Cu alloys. Journal of Alloys and Compounds, 2010, 527(25): 226–232
Laurila T, Vuorinen V, Paulasto-Kröckel M. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering. Materials Science and Engineering: Reports, 2010, 68(1,2): 1–38
Ahmed M, Fouzder T, Sharif A, Gain A K, Chan Y C. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectronics and Reliability, 2010, 50(8): 1134–1141
Yusof M S, Gethin D T. Investigation of carbon black ink on fine solid line printing in flexography for electronic application. China Printing and Packing Study, 2011, 3(3): 74–76
Shin D Y, Jungb M, Chun S. Resistivity transition mechanism of silver salts in the next generation conductive ink for a roll-to-roll printed film with a silver network. Journal of Materials Chemistry, 2012, 22(23): 11755–11764
Ma K Q, Liu J. Nano liquid-metal fluid as ultimate coolant. Physics Letters [Part A], 2007, 361(3): 252–256
Argoitia A, Hayman C C, Angus J C, Wang L, Dyck J S, Kash K. Low pressure synthesis of bulk, polycrystalline gallium nitride. Applied Physics Letters, 1996, 70(2): 179–181
Stevenson R. The world’s best gallium nitride. http://spectrum.ieee.org/semiconductors/materials/the-worlds-best-gallium-nitride, accessed on July, 2012
Zhang J J, Huang Y. Preparation and optical properties of AgGaS2 nanofilms. Crystal Research and Technology, 2011, 46(5): 501–506
Moss S J, Ledwith A. The Chemistry of the Semiconductor Industry. New York: Chapman and Hall, 1987
Smart L, Moore E. Solid State Chemistry: An Introduction. 3rd ed. Boca Raton: Taylor and Francis CRC Press, 2005
Dong Y J, Peng Q, Wang R J, Li Y. Synthesis and characterization of an open framework ballium selenide: Ga4Se7(en)2·(enH)2. Inorganic Chemistry, 2003, 42(6): 1794–1796
Creative Times. Can printed electronics save the music industry? http://www.creativetimes.co.uk/articles/can-printed-electronicssave-the-music-industry, accessed on July, 2012
Kunnari E, Valkama J, Keskinen M, Mansikkamäki P. Environmental evaluation of new technology: Printed electronics case study. Journal of Cleaner Production, 2009, 17(9): 791–799
Yang Y L, Chuang MC, Lou S L, Wang J. Thick-film textile-based amperometric sensors and biosensors Affiliation Information. Analyst (London), 2010, 135(6): 1230–1234
Malzahn K, Windmiller J R, Valdés-Ramírez G, Schöning M J, Wang J. Wearable electrochemical sensors for in situ analysis in marine environments. Analyst (London), 2011, 136(14): 2912–2917
California Institute for Telecommunications and Information Technology. Flexible, printable sensors detect underwater hazards. http://www.calit2.net/newsroom/article.php?id=1870, accessed on July, 2012
Wu C M L, Yu D Q, Law C M T, Wang L. Properties of lead-free solder alloys with rare earth element additions. Materials Science and Engineering: Reports, 2004, 44(1): 1–44
Chen K I, Cheng S C, Wu S, Lin K L. Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy. Journal of Alloys and Compounds, 2006, 416(1–2): 98–105
Hung F Y, Wang C J, Huang S M, Chen L H, Lui T S. Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders. Journal of Alloys and Compounds, 2006, 420(1,2): 193–198
El-Daly A A, Swilem Y, Hammad A E. Creep properties of Sn-Sb based lead-free solder alloys. Journal of Alloys and Compounds, 2009, 471(1–2): 98–104
Zhang J S, Chan Y C, Wu Y P, Xi H J, Wu F S. Electromigration of Pb-free solder under a low level of current density. Journal of Alloys and Compounds, 2008, 458(1–2): 492–499
Zhang Y, Liang T X, Jusheng M A. Phase diagram calculation on Sn-Zn-Ga solders. Journal of Non-Crystalline Solids, 2004, 336(2): 153–156
Zhou J, Sun Y S, Xue F. Properties of low melting point Sn-Zn-Bi solders. Journal of Alloys and Compounds, 2005, 397(1–2): 260–264
Chriašteľová J, Ožvold M. Properties of solders with low melting point. Journal of Alloys and Compounds, 2008, 457(1–2): 323–328
Plevachuk Y, Sklyarchuk V, Yakymovych A, Svec P, Janickovic D, Illekova E. Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys. Journal of Materials Science Materials in Electronics, 2011, 22(6): 631–638
Plevachuk Y, Sklyarchuk V, Hoyer W, Kaban I. Electrical conductivity, thermoelectric power and viscosity of liquid Snbased alloys. Journal of Materials Science, 2006, 41(14): 4632–4635
Plevachuk Y, Mudry S, Sklyarchuk V, Yakymovych A, Klotz U E, Roth M. Viscosity and electrical conductivity of liquid Sn-Ti and Sn-Zr alloys. Journal of Materials Science, 2007, 42(20): 8618–8621
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Dr. Jing Liu is a professor with the Department of Biomedical Engineering of Tsinghua University (THU) and the Technical Institute of Physics and Chemistry, Chinese Academy of Sciences (CAS). He received his B.E. degree in Power Engineering and Control and B.S. degree in Physics in 1992, and Ph.D. in Thermal Science in 1996 from THU. He then served as assistant professor at THU, a postdoctoral research associate at Purdue University, and a senior visiting scholar at Massachusetts Institute of Technology. He has been a professor with the CAS since July 1999 and a professor with THU since August 2008. Dr. Liu has authored nine popular books on cutting edge frontiers in energy and bioengineering areas (among which Micro/Nano Scale Heat Transfer has been reprinted five times), fourteen invited book chapters, over three hundred peer reviewed journal papers, and about seventy international conference presentations or invited lectures. He holds more than 100 patents.
Prof. Liu’s research interests include microenergy, mobile health technology, thermal management, bioheat and mass transfer, and micro/nano fluidics. He contributed significantly to the bioheat transfer area through numerous conceptual innovation, methodology development and technical inventions and is a world-renowned expert in this area. His work is also fully reflected in energy and related areas, where he pioneered a series of non-conventional technologies especially the liquid metal based thermal management, waste heat recovery, electricity generation and direct writing electronics etc. Dr. Liu is a recipient of 2010-2011 Best Paper of the Year Award from ASME Journal of Electronic Packaging, the National Science Fund for Distinguished Young Scholars of China, National Science and Technology Award for Chinese Young Scientist, Mao Yi-Sheng Science and Technology Award for Beijing Youth, and five times highest teaching award from CAS etc.
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Zhang, Q., Zheng, Y. & Liu, J. Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences. Front. Energy 6, 311–340 (2012). https://doi.org/10.1007/s11708-012-0214-x
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DOI: https://doi.org/10.1007/s11708-012-0214-x