Abstract
Solidification of eutectic Sn-Ag solder, with and without Cu6Sn5 composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientation, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu6Sn5 particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to solder joints with more load carrying area.
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C.M. Miller, I.E. Anderson, and S. F. Smith, J. Electron. Mater. 23, 595 (1994).
M. McCormack, S. Jin, and G.W. Kammlott, IEEE Trans. Components, Packaging and Manufacturing Technology, Part A 17, 452 (1994).
C.G. Kue, S.M.L. Sastry, and K.L. Jerina, Proc. First Int. Conf. Microstructures and Mechanical Properties of Aging Materials, ed. P.K. Liaw et al. (Warrendale, PA: TMS, 1993), p. 409.
R.B. Clough, R. Patel, J.S. Hwang, and G. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1256.
M.A. Wasynczuk and G.K. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1245.
A.W. Gibson, S.L. Choi, K.N. Subramanian, and T.R. Bieler, Design and Reliability of Solders and Solder Joints, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 97.
S.L. Choi, A.W. Gibson, J.L. McDougall, T.R. Bieler, and K.N. Subramanian, Design and Reliability of Solders and Solder Joints, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 241.
Z. Mei, J.W. Morris, Jr., M.C. Shiniamo, and T.S.E. Summers, J. Electron. Mater. 20, 599 (1991).
Z. Mei and J.W. Morris Jr., Trans. ASME, 114 (New York: ASME, 1992), pp. 104–108.
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Sigelko, J., Choi, S., Subramanian, K.N. et al. Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements. J. Electron. Mater. 28, 1184–1188 (1999). https://doi.org/10.1007/s11664-999-0155-2
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DOI: https://doi.org/10.1007/s11664-999-0155-2