Abstract
Two kinds of Sn-3.5Ag eutectic solder ribbons of 0.13 mm thickness were prepared by a casting–rolling process and a rapid solidification process. The microstructure, phase constitution, melting characteristics, wetting behavior and soldering strength were compared using optical microscopy, scanning electron microscopy, x-ray diffraction, energy dispersive spectroscopy, differential scanning calorimetry and a MTS ceramic testing system. The results show that the microstructure of rapidly solidified solder is finer and more uniform, and the eutectic structure has a higher solid solubility and more homogeneous distribution of Ag in a Sn matrix. The solidus and liquidus temperature decreased, resulting in a 3.3% reduction of pasty range. In addition, the wettability and shear strength of the solder joints increased by 13.2% and 7.9%, respectively.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
Change history
16 August 2017
An erratum to this article has been published.
References
M. Sobhy, A.M. El-Refai, M.M. Mousa, and G. Saad, Mater. Sci. Eng. A 646, 82 (2015).
G. Chen, F. Wu, C. Liu, V.V. Silberschmidt, and Y.C. Chan, J. Alloys Compd. 656, 500 (2016).
M. Abtew and G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000).
E.H. Amalu and N.N. Ekere, J. Mater. Process. Technol. 212, 471 (2012).
W.R. Osório, D.R. Leiva, L.C. Peixoto, L.R. Garcia, and A. Garcia, J. Alloys Compd. 562, 194 (2013).
K.S. Kim, S.H. Huh, and K. Suganuma, Mater. Sci. Eng. A 333, 106 (2002).
E.J. Lavernia and T.S. Srivatsan, J. Mater. Sci. 45, 287 (2010).
H. Jones, Mater. Sci. Eng. A 304, 11 (2001).
R.M. Shalaby, J. Alloys Compd. 505, 113 (2010).
M. Kamal and E.S. Gouda, Mater. Manuf. Process. 21, 736 (2006).
J. Shen, Y.C. Liu, and J.Y. Han, Trans. Nonferrous Met. Soc. China 16, 59 (2006).
I. Dutta, C. Park, and S. Choi, Mater. Sci. Eng. A 379, 401 (2004).
T. Luo, Z. Chen, A. Hu, and M. Li, Mater. Sci. Eng. A 556, 885 (2012).
Q.K. Zhang, W.M. Long, X.Q. Yu, Y.Y. Pei, and P.X. Qiao, J. Alloys Compd. 622, 973 (2015).
J. Shen, Y. Liu, Y. Han, and H. Gao, Rare Met. 25, 365 (2006).
H.T. Lee and Y.F. Chen, J. Alloys Compd. 509, 2510 (2011).
U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994).
J. Shen, Y.C. Liu, H.X. Gao, C. Wei, and Y.Q. Yang, J. Electron. Mater. 34, 1591 (2005).
M.J. Aziz, J. Appl. Phys. 53, 1158 (1982).
X.Y. Li, F.Q. Zu, W.L. Gao, X. Cui, L.F. Wang, and G.H. Ding, Appl. Surf. Sci. 258, 5677 (2012).
H.T. Ma, J. Wang, L. Qu, N. Zhao, and A. Kunwar, J. Electron. Mater. 42, 2686 (2013).
T. Young, Philos. Trans. R. Soc. Lond. 95, 65 (1805).
Acknowledgement
The authors would like to express their thanks to the National Natural Science Foundation of China (Grant No. 51475345).
Author information
Authors and Affiliations
Corresponding author
Additional information
The original version of this article has been corrected as reflected in the erratum: In the third paragraph of the Introduction, Ag3Snm is corrected as Ag3Sn.
An erratum to this article is available at https://doi.org/10.1007/s11664-017-5716-1.
Rights and permissions
About this article
Cite this article
Liu, S., Hu, Z., Xiong, J. et al. Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints. J. Electron. Mater. 46, 6373–6380 (2017). https://doi.org/10.1007/s11664-017-5672-9
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-017-5672-9