Abstract
The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.
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Kim, J., Myung, WR. & Jung, SB. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB. J. Electron. Mater. 45, 5895–5903 (2016). https://doi.org/10.1007/s11664-016-4803-z
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DOI: https://doi.org/10.1007/s11664-016-4803-z