Abstract
The harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. At present, Sn-Pb eutectic and other Pb-containing solders find widespread use in printed circuit board assembly. Several Pb-free solder alloys which appear to have the potential for replacing Sn-Pb solders are receiving increased attention from the electronic assembly community. Recently, numerous studies have been published detailing the wetting characteristics, tensile and shear strength, and creep and low-cycle fatigue properties of these alloys. It is the purpose of this paper to review these results and assess the suitability of the solders for electronic packaging from the viewpoints of process technology and reliability.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Binary Alloy Phase Diagrams, ed. T.B. Massalski, (Materials Park, OH: American Society for Metals, 1987), p. 1848.
B. Roos-Kozel,Surface Mount Technology Tech. Mono. 6984- 002 (Silver Spring, MD: ISHM, 1986), p.115.
D. Romm and N. McLellan,Surface Mount Tech. Jan. 35 (1993).
D. Heller, J. Leonard and J. Neville,Elec. Packg. & Prod. Dec. 58 (1992).
M. Warwick,Circuits Assembly June, 60 (1992).
L. Matienzo, F. Emmi and R. Johnson,Principles of Electronic Packaging, ed., D. Seraphim, (McGraw-Hill, 1989), p. 731.
S. Pattanaik and V. Raman,Proc. Mat. Dev. in Microelec. Packg. Conf. (Materials Park, OH: ASM Intl., 1991), p. 251.
R. N. Wild,Proc. Inter. NEPCON Conf. Briton, 1971, p. 81.
J.R. Getten and R. Senger,IBM J. Res. Devel. 26, 379 (1982).
D. Lazzarini and F. Sarnacki, Water Solubile Fluxes, U. S. Patent, 4,000,016, Dec. 28, 1976.
H. Gudul and R. Calson,Elec. Packg. & Prod. Sept., 29 (1992).
J. Phillips and K. Stillahn,Elec. Packg. & Prod. Feb., 78 (1992).
C. Mackay and W. von Voss,Mater. Sci. and Tech. 1 (3) 240 (1985).
M. Ackroyd et al.,Metals Tech. Feb., 73 (1975).
D.M. Jarboe,Thermal Fatigue Evaluation of Solder Alloys, NTIS, U. S. Dept. of Commerce, BDX-613-2341, Feb. 1980.
P. Vianco and D. FrearJOM, July, 14 (1993).
L. Felton et al.,JOM July, 28 (1993).
Z. Mei and J. Morris, Jr.,J. Electron. Mater. 21, 599 (1992).
J. Seyyedi,J. Elec. Packg. 115, 305 (1993).
D. Tribula and J.W. Morris, Jr.,J. Elec. Packag., Trans. ASME 112, 87 (1990).
Z. Mei and J. Morris, Jr.,J. Electron. Mater. 21, 401 (1992).
F. Ojebuoboh,JOM 44, (4) 46 (1992).
N. Koopman et al.,Microelectronics Packaging Handbook, ed., R. Tummala (Van Nostrand Reinhold, 1989), p. 361.
J.S. Corbin,IBM J. Res. Devel. 37, (5), 585 (1993).
M.D. Ries et. al.,IBM J. Res. Devel. 37 (5), 597 (1993).
S. Konecke, private communication, Loral Co., Manassas, MD.
H. Hattori et al., U. S. Patent, 4,480,261, Oct. 30, 1984.
T. Lombardi et al.,IBM Tech. Discl. Bull. 34 (7A) 308 (1991).
L. Rice and A. Roberti,IBM Tech. Discl. Bull. 26 (11) 6092 (1984).
C.J. Thwaites,Brazing and Soldering (11) 22 (1986).
J. Fischer et al.,Proc. Nat. Elec. Pack. & Prod. Conf. 2, 1056 (1992).
S.J. Nightingale and O. Hudson,Tin Soldiers, (British Non- Ferrous Metals Res. Assn. Monograph, 1942), p. 1.
R. J. Klein Wassink,Soldering in Electronics (Electrochemical Pub. Ltd., 1989), p. 123.
W.A. Baker,J. Inst. Metals 65, 277 (1939).
W. Allen and J. Perepezko,Script Met. 24, 2215 (1990).
H. H. Manko,Solders and Soldering, 3rd ed. (McGraw-Hill, 1992) pp. 128, 143.
B. Predel and W. Schwermann,J. Inst. Metals, 99,169 (1971).
S.K. Kang,Met. Trans. 12B, 620 (1981).
W. Tomlinson and A. Fullylove,J. Mat. Sci. 27, 5777 (1992).
M. Harada and R. Satoh,IEEE Trans. CHMT 13 (4), 736 (1990).
T. Ogashiwa et al.,Jpn. J. Appl. Phys. 31,761, Part 1, (1992).
O. Chirino and R. Romanosky,IBM Tech. Discl. Bull. 23 (8), 3620(1981).
R. Herdzik and N. Koopman,IBM Tech. Discl. Bull. 20 (4), 1394(1977).
M. McCormack et al.,Appl. Phys. Lett. 63 (1), 15 (1993).
B.R. Allenby et al.,Proc. Surface Mount Int., San Jose, CA, Aug. 1992, Vol.1, p.l.
J.T. Yeh,Met. Trans. A 13A, 1547 (1982).
K. Fujiwara and M. Ashai,IEEE Trans. Comp. Hybrd. & Mfg. Tech., CHMT-10, 263 (1987).
C.E. White,Adv. Mat. and Proc, Metal Progress, Dec, 69 (1986).
R. Darveaux and I. Turlik,Proc. IEEE 2nd Intersociety Conf. on Thermal Phenomena in Electronic Systems, Las Vegas, NV, May 1990, p. 40.
L.S. Goldman et al.,IEEE Trans. Parts. Hybrd. & Pkg. PHP- 13, Sept., 25 (1977).
R.T. Howard,IBM J. Res. Devel. 26, 372 (1982).
K.J. Puttlitz,IEEE Trans. Comp. Hybrd. & Mfg. Tech. 13,188 (1990).
R. Wild,INTERNEPCON Brighton, England, October 1975.
Indium Corporation of America, Utica, NY 13503.
H. Rack and J. Maurin,J. Testing and Eval. 2, 351 (1974).
L. Wilson and R. Buckner,Trans. ASM 57, 346 (1964).
W. Reichenecker,ME June, 12 (1983).
W.J. Tomlinson and I. Collier,J. Mater. Sci. 22 (1987).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Kang, S.K., Sarkhel, A.K. Lead (Pb)-free solders for electronic packaging. J. Electron. Mater. 23, 701–707 (1994). https://doi.org/10.1007/BF02651362
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02651362