Abstract
Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.
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Acknowledgements
The authors would like to acknowledge DTA funding from the UK Engineering and Physical Sciences Research Council (EPSRC) through the Innovative Electronics Manufacturing Research Centre (IeMRC) and the support of the Science and Technology Facilities Council for access to processing facilities.
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Tian, Y., Liu, C., Hutt, D. et al. Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection. J. Electron. Mater. 43, 594–603 (2014). https://doi.org/10.1007/s11664-013-2891-6
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DOI: https://doi.org/10.1007/s11664-013-2891-6