Abstract
We examine the mechanical stability of an unconventional Mg2Si thermoelectric generator (TEG) structure. In this structure, the angle θ between the thermoelectric (TE) chips and the heat sink is less than 90°. We examined the tolerance to an external force of various Mg2Si TEG structures using a finite-element method (FEM) with the ANSYS code. The output power of the TEGs was also measured. First, for the FEM analysis, the mechanical properties of sintered Mg2Si TE chips, such as the bending strength and Young’s modulus, were measured. Then, two-dimensional (2D) TEG models with various values of θ (90°, 75°, 60°, 45°, 30°, 15°, and 0°) were constructed in ANSYS. The x and y axes were defined as being in the horizontal and vertical directions of the substrate, respectively. In the analysis, the maximum tensile stress in the chip when a constant load was applied to the TEG model in the x direction was determined. Based on the analytical results, an appropriate structure was selected and a module fabricated. For the TEG fabrication, eight TE chips, each with dimensions of 3 mm × 3 mm × 10 mm and consisting of Sb-doped n-Mg2Si prepared by a plasma-activated sintering process, were assembled such that two chips were connected in parallel, and four pairs of these were connected in series on a footprint of 46 mm × 12 mm. The measured power generation characteristics and temperature distribution with temperature differences between 873 K and 373 K are discussed.
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Acknowledgements
This work was partly supported by a Grant-in-Aid for Scientific Research (A) from the Japanese Ministry of Education, Science, Sports, and Culture, and a Grant-in-Aid for JSPS Fellows awarded by the Japan Society for the Promotion of Science. The authors thank Mr. Alvise Miozzo for his helpful discussions and constructive advice.
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Sakamoto, T., Iida, T., Ohno, Y. et al. Stress Analysis and Output Power Measurement of an n-Mg2Si Thermoelectric Power Generator with an Unconventional Structure. J. Electron. Mater. 43, 1620–1629 (2014). https://doi.org/10.1007/s11664-013-2814-6
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DOI: https://doi.org/10.1007/s11664-013-2814-6