Abstract
Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.
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Zhao, H., Nalagatla, D.R. & Sekulic, D.P. Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface. J. Electron. Mater. 38, 284–291 (2009). https://doi.org/10.1007/s11664-008-0590-5
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DOI: https://doi.org/10.1007/s11664-008-0590-5