Abstract
This study investigates the interfacial reactions between Sn-3.0wt.% Ag-0.5wt.%Cu (SAC) and Sn-0.7wt.%Cu (SC) on In/Ni/Cu multilayer substrates using the solid–liquid interdiffusion bonding technique. Samples were reflowed first at 160°C, 180°C, and 200°C for various periods, and then aged at 100°C for 100 h to 500 h. The scalloped Cu6Sn5 phase was formed at the SAC/In/Ni/Cu and SC/In/Ni/Cu interfaces. When the reflowing temperatures were 160°C and 180°C, a ternary Ni-In-Sn intermetallic compound (IMC) was formed when the samples were further aged at 100°C. This ternary Ni-In-Sn IMC could be the binary Ni3Sn4 phase with extensive Cu and In solubilities, or the ternary Sn-In-Ni compound with Cu solubility, or even a quaternary compound. As the reflow temperature was increased to 200°C, only one Cu6Sn5 phase was formed at the solder/substrate interface with the heat treatment at 100°C for 500 h. Mechanical test results indicated that the formation of the Ni-In-Sn ternary IMC weakened the mechanical strength of the solder joints. Furthermore, the solid–liquid interdiffusion (SLID) technique in this work effectively reduced the reflow temperature.
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Acknowledgements
The authors acknowledge the financial support of␣the National Science Council of Taiwan (NSC 96-2218-E-011-079) and Mr. C. Y. Kao for carrying out the EPMA analysis.
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Yen, YW., Liou, WK., Wei, HY. et al. Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates. J. Electron. Mater. 38, 93–99 (2009). https://doi.org/10.1007/s11664-008-0575-4
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DOI: https://doi.org/10.1007/s11664-008-0575-4