Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0–1,000 ppm nickel. The microstructural observations show that increasing the nickel content reduces the volume fraction of primary Sn, thus generating a more-eutectic microstructure. In an attempt to better understand the changes in solderability with Ni additions, fluidity tests were carried out using the Ragone method for small incremental increases in nickel content. The maximum fluidity length was found to vary strongly with nickel content. Additionally, the distribution of nickel within samples was investigated using synchrotron micro X-ray fluorescence.
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Y. Li, K.-S. Moon, C.P. Wong, Science 308, 1419 (2005)
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Mat. Sci. Eng. R 44, 1 (2004)
K. Suganuma, Curr. Opin. Solid. St. M. 5, 55 (2001)
I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, O. Unal, J. Electron. Mater. 30, 1050 (2001)
D.R. Frear, J.W. Jang, J.K. Lin, C. Zhang, JOM 53 (6), 28 (2001)
K. Suganuma, MRS BULL (Nov 2001)
M. Abtew, G. Selvaduray, Mat. Sci. Eng. R 27 (5–6), 95 (2000)
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, J. Electron. Mater. 31, 928 (2002)
S.H. Huh, K.S. Kim, K. Suganuma, Mater. Trans. 42, 739 (2001)
T. Nishimura, in International patent EP1043112 (1999)
T. Nishimura, in US patent US6180055 (1999)
T. Nishimura, Mater. J. 43, 651 (2004)
M.C. Flemings, Solidification Processing (McGraw-Hill, New York 1974)
D.V. Ragone, C.M Adams, H.F. Taylor, Trans. AFS 64, 640 (1956)
K. Nogita, H. Yasuda, K. Yoshida, K. Uesugi, A. Takeuchi, Y. Suzuki, A.K. Dahle, Scripta Mater 55, 787 (2006)
K.-W. Moon, W.J. Boettinger, JOM 56 (4), 22 (2004)
S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, J. Mater. Sci.: Mater. E 18, 19 (2007)
L. Snugovsky, P. Snugovsky, D.D. Perovic, J.W. Rutter, Mater. Sci. Technol. 22 (8), 899 (2006)
C.H. Lin, S.W. Chen, C.H. Wang, J. Electron. Mater. 31, 907 (2002)
C.M. Gourlay, J. Read, K. Nogita, and A.K. Dahle, J. Electron. Mater. doi:10.1007/s11664-007-0248-8
Acknowledgements
The authors would like to thank Nihon Superior Co. Ltd., Japan, for providing the alloys. Fluidity experiments were supported by Mr. Bastian Meylan, The University of Queensland. Synchrotron experiments were performed at SPring-8 supported by the Ministry of Education, Culture, Sports, Science and Technology, Japan (Proposal No. 2006A1645/BL No. 47XU). The authors acknowledge the experimental support with the synchrotron study from Prof. H. Yasuda and Mr␣K.␣Yoshida, Osaka University, and Drs. K. Uesugi, A. Takeuchi, and Y. Suzuki, Japan Synchrotron Radiation Research Institute.
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Ventura, T., Gourlay, C.M., Nogita, K. et al. The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi. J. Electron. Mater. 37, 32–39 (2008). https://doi.org/10.1007/s11664-007-0281-7
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DOI: https://doi.org/10.1007/s11664-007-0281-7