Abstract
Continuous efforts in replacing Sn-Pb eutectic solder have been attempted. Sn-Bi alloys are candidates as lead-free solders for low temperature soldering due to its adequate cost and general consistency. Additions of Cu within these alloys can improve the ductility, mechanical strength and wettability. Nevertheless, a deeper study considering the characterization of the as-soldered ternary Sn-40wt%Bi-0.7wt%Cu microstructures remains still to be performed. Thus, the present experiments were carried out by directional solidification (DS) of the Sn-40Bi-0.7Cu with a view to establish experimental interrelations involving solidification thermal parameters (growth rate — Vl and cooling rate — ṪL) with some microstructure features (λ2). The experimental relations obtained for this alloy have been compared with those already determined for the binary Sn-0.7wt.%Cu and Sn-40wt.%Bi alloys. The microstructures from the bottom to the top along the Sn-Bi-Cu alloy were entirely dendritic. Further, a Hall-Petch equation is proposed relating HV to λ2 for the Sn-40Bi-0.7Cu alloy.
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Silva, B.L., Spinelli, J.E. (2015). Dependence of Hardness on Microstructure of a Directionally Solidified Sn-40wt.%Bi-0.7wt.%Cu Alloy. In: Nastac, L., et al. Advances in the Science and Engineering of Casting Solidification. Springer, Cham. https://doi.org/10.1007/978-3-319-48117-3_45
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DOI: https://doi.org/10.1007/978-3-319-48117-3_45
Publisher Name: Springer, Cham
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