Abstract
In this study, the performance of Si wafer machining by employing the die-sinking microelectrical discharge machining technique is reported. Specifically, the machining performance was examined on both high- (1–10 Ω cm) and low-resistivity (0.001–0.005 Ω cm) Si wafers by means of using a range of discharge energies. In this regard, the machining time, material removal rate, surface quality, surface roughness, and material mapping, which are categorized among the important properties in micromachining, have been investigated. In order to analyze the surface properties and to perform the elemental analysis, the scanning electron microscope and energy-dispersive X-ray spectroscopy were used. In contrast, the 3D surface profiler was used to evaluate the roughness of machined surface. The results of this experimental study revealed that the electrical resistivity and discharge energy parameter of microelectrical discharge machining had a great influence on the Si wafer machining performances. The observations in this study indicated a decrease in machining time, high material removal rate, and high surface roughness with an increased discharge energy values. Overall, it was learnt that the minimum amount of energy required to machine Si wafer was 5 μJ for both low and high-resistivity Si. In addition, the highest material removal of 5.842 × 10−5 mm3/s was observed for low-resistivity Si. On the contrary, the best surface roughness, R a, of 0.6203 μm was achieved for high-resistivity Si and it also pointed to a higher carbon percentage after the machining process.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Punturat J, Tangwarodomnukun V, Dumkum C (2014) Surface characteristics and damage of monocrystalline silicon induced by wire-EDM. Appl Surf Sci 320:83–92
Mingbo Q, Zhidong L, Zongjun T, Wei W, Yinhui H (2013) Study of unidirectional conductivity on the electrical discharge machining of semiconductor crystals. Precis Eng 37(4):902–907
Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. CIRP Ann - Manuf Technol 47(1):45–49. https://doi.org/10.1016/S0007-8506(07)62782-6
Chan M, Fonda P, Reyes C, Xie J, Najar H, Lin L, Yamazaki K, Horsley D Micromachining 3D hemispherical features in silicon via micro-EDM. In: Micro Electro Mechanical Systems (MEMS), 2012 I.E. 25th International Conference on, 2012. IEEE, pp 289–292
Weinhold S, Gruner A, Ebert R, Schille J, Exner H Study of fast laser induced cutting of silicon materials. In: SPIE LASE, 2014. International Society for Optics and Photonics, pp 89671J-89671J-89677
Yu Z, Hu X, Rajurkar KP (2006) Influence of debris accumulation on material removal and surface roughness in micro ultrasonic machining of silicon. CIRP Ann - Manuf Technol 55(1):201–204. https://doi.org/10.1016/S0007-8506(07)60398-9
Xiao G, To S, Jelenković E (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Technol 225:439–450
Tang Y, Fuh J, Loh H, Wong Y, Lim Y (2008) Laser dicing of silicon wafer. Surf Rev Lett 15(01n02):153–159
Belyaev A, Polupan O, Dallas W, Ostapenko S, Hess D, Wohlgemuth J (2006) Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers. Appl Phys Lett 88(11):111907
Hung N, Fu Y, Ali MY (2002) Focused ion beam machining of silicon. J Mater Process Technol 127(2):256–260
Reynaerts D, Meeusen W, Van Brussel H (1998) Machining of three-dimensional microstructures in silicon by electro-discharge machining. Sens Actuators, A 67(1):159–165
Ali MSM, Bycraft B, Schlosser C, Assadsangabi B, Takahata K (2011) Out-of-plane spiral-coil inductor self-assembled by locally controlled bimorph actuation. Micro Nano Lett 6(12):1016–1018
Rahul S, Datta S, Biswal BB, Mahapatra SS (2017) Electrical discharge machining of Inconel 825 using cryogenically treated copper electrode: emphasis on surface integrity and metallurgical characteristics. J Manuf Process 26:188–202. https://doi.org/10.1016/j.jmapro.2017.02.020
Suresh Kumar S, Uthayakumar M, Thirumalai Kumaran S, Parameswaran P, Mohandas E, Kempulraj G, Ramesh Babu BS, Natarajan SA (2015) Parametric optimization of wire electrical discharge machining on aluminium based composites through grey relational analysis. J Manuf Process 20(Part 1):33–39. https://doi.org/10.1016/j.jmapro.2015.09.011
AbuZaiter A, Hikmat OF, Nafea M, Ali MSM (2016) Design and fabrication of a novel XYθz monolithic micro-positioning stage driven by NiTi shape-memory-alloy actuators. Smart Mater Struct 25(10):105004
AbuZaiter A, Nafea M, Faudzi AAM, Kazi S, Ali MSM (2016) Thermomechanical behavior of bulk NiTi shape-memory-alloy microactuators based on bimorph actuation. Microsyst Technol 22(8):2125–2131
Ali MSM, AbuZaiter A, Schlosser C, Bycraft B, Takahata K (2014) Wireless displacement sensing of micromachined spiral-coil actuator using resonant frequency tracking. Sensors 14(7):12399–12409
Khalid W, Ali MSM, Dahmardeh M, Choi Y, Yaghoobi P, Nojeh A, Takahata K (2010) High-aspect-ratio, free-form patterning of carbon nanotube forests using micro-electro-discharge machining. Diam Relat Mater 19(11):1405–1410
Dahmardeh M, Ali MSM, Saleh T, Hian TM, Moghaddam MV, Nojeh A, Takahata K (2013) High-power MEMS switch enabled by carbon-nanotube contact and shape-memory-alloy actuator. Phys Status Solidi (a) 210(4):631–638
Anwar MM, Saleh T, Madden JD, Takahata K (2014) Micropatterning polypyrrole conducting polymer by pulsed electrical discharge. Macromol Mater Eng 299(2):198–207
Heeren P, Reynaerts D, Van Brussel H Three-dimensional silicon micromechanical parts manufactured by electro-discharge machining. In: Advanced Robotics, 1997. ICAR'97. Proceedings., 8th International Conference on, 1997. IEEE, pp 247–252
Fonda P, Chan M, Heidari A, Nakamoto K, Sano S, Horsley D, Yamazaki K (2013) The application of diamond-based electrodes for efficient EDMing of silicon wafers for freeform MEMS device fabrication. Procedia CIRP 6:280–285
Reynaerts D, Van Brussel H (1997) Microstructuring of silicon by electro-discharge machining (EDM)—part I: theory. Sensors Actuators A 60(1):212–218
Saleh T, Rasheed AN, Muthalif AG (2015) Experimental study on improving μ-WEDM and μ-EDM of doped silicon by temporary metallic coating. Int J Adv Manuf Technol 78(9–12):1651–1663
Kunieda M, Ojima S (2000) Improvement of EDM efficiency of silicon single crystal through ohmic contact. Precis Eng 24(3):185–190
Unoa Y, Okada A, Okamoto Y, Yamazaki K, Risbud SH, Yamada Y (1999) High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining. Precis Eng 23(2):126–133. https://doi.org/10.1016/S0141-6359(98)00029-4
Yu P-H, Lin Y-X, Lee H-K, Mai C-C, Yan B-H (2011) Improvement of wire electrical discharge machining efficiency in machining polycrystalline silicon with auxiliary-pulse voltage supply. Int J Adv Manuf Technol 57(9–12):991–1001
Zhidong L, Haoran C, Huijun P, Mingbo Q, Zongjun T (2015) Automatic control of WEDM servo for silicon processing using current pulse probability detection. Int J Adv Manuf Technol 76(1–4):367–374
Yeh C-C, Wu K-L, Lee J-W, Yan B-H (2013) Study on surface characteristics using phosphorous dielectric on wire electrical discharge machining of polycrystalline silicon. Int J Adv Manuf Technol 69(1–4):71–80
Murray J, Fay M, Kunieda M, Clare A (2013) TEM study on the electrical discharge machined surface of single-crystal silicon. J Mater Process Technol 213(5):801–809
Song X, Reynaerts D, Meeusen W, Van Brussel H (2001) A study on the elimination of micro-cracks in a sparked silicon surface. Sensors Actuators A 92(1):286–291
Rajurkar K, Sundaram M, Malshe A (2013) Review of electrochemical and electrodischarge machining. Procedia CIRP 6:13–26
Gostimirovic M, Kovac P, Sekulic M, Skoric B (2012) Influence of discharge energy on machining characteristics in EDM. J Mech Sci Technol 26(1):173–179
Qian J, Steegen S, Vander Poorten E, Reynaerts D, Van Brussel H (2002) EDM texturing of multicrystalline silicon wafer and EFG ribbon for solar cell application. Int J Mach Tools Manuf 42(15):1657–1664. https://doi.org/10.1016/S0890-6955(02)00116-5
Acknowledgements
This study is funded by Universiti Teknologi Malaysia under Matching Grant Scheme 00M83 and Research University Grant (GUP 14H31). Noor Dzulaikha Daud acknowledges the financial support from the Ministry of Education Malaysia under MyBrain15 scheme.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Rights and permissions
About this article
Cite this article
Daud, N.D., AbuZaiter, A., Leow, P.L. et al. The effects of the silicon wafer resistivity on the performance of microelectrical discharge machining. Int J Adv Manuf Technol 95, 257–266 (2018). https://doi.org/10.1007/s00170-017-1190-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-017-1190-4