Abstract
Multi-wire sawing with diamond wire is used to slice hard and brittle materials such as sapphire, silicon carbide, or silicon into thin wafers. Compared to traditional slicing methods, multi-wire sawing with diamond wire has many advantages, including reduced kerf loss, efficient machining, and improved form accuracy. However, the process is associated with several unexpected problems, including considerable kerf loss and inefficient cutting during the initial cutting step. Thus, materials cannot be constantly removed due to the instability of the cutting performance of the diamond wire. These phenomena are defined as the break-in characteristics of diamond wire. This paper focused on the break-in characteristics of diamond wire and the effects of these characteristics on the cutting performance. In an experiment, a single-wire sawing machine equipped with a monitoring system was used to analyze the horizontal and vertical cutting forces which arose during the cutting process. The cutting performance was evaluated by means of cutting profile measurements. The wires used were analyzed by the newly developed vision measurement system and through scanning electron microscope (SEM) imagery. On the basis of results, it was found that the break-in characteristics of diamond wire are strongly correlated with the wear behaviors of the diamond wire.
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References
Clark WI, Shih AJ, Hardin CW, Lemaster RL, McSpadden SB (2003) Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force. Int J Mach Tool Manu 43:523–532
Möller HJ (2004) Basic mechanisms and models of multi-wire sawing. Adv Eng Mater 6:501–512
Watanabe N, Kondo Y, Ide D, Matsuki T, Takato H, Sakata I (2010) Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire. Prog Photovolt Res Appl 18:485–490
Cichosz P (2008) Economic aspects of cutting with diamond-coated wire. Arch Civ Mech Eng 8:4–14
Liedke T, Kuna M (2011) A macroscopic mathematical model of the wire sawing process. Int J Mach Tool Manu 51:711–720
Kim H, Kim D, Kim C, Jeong H (2013) Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires. CIRP Ann-Manuf Technol 62:335–338
Chiba Y, Tani Y, Enomoto T, Sato H (2003) Development of a high-speed manufacturing method for electroplated diamond wire tools. CIRP Ann-Manuf Technol 52:281–284
Suwabe H, Kinoshita Y, Ishikawa K (2007) Development and cutting characteristics of a thin diamond wire tool. J Jpn Soc Abras Technol 51:351–356
Enomoto T, Tani Y, Takehara T (2002) Development of a resinoid diamond wire tool utilizing ultraviolet curing resin. J Jpn Soc Precis Eng 68:148–1485
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Lee, S., Kim, H., Kim, D. et al. Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing. Int J Adv Manuf Technol 87, 1–8 (2016). https://doi.org/10.1007/s00170-015-7984-3
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DOI: https://doi.org/10.1007/s00170-015-7984-3