Abstract
Interest in silicides as advanced materials for high-performance applications has focused significant attention on the processing of these materials. In recent years, various processing methodologies have been evaluated. This article provides a comprehensive review of reactive processing techniques and the results of various investigations.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
A.K. Vasudevan and J.J. Petrovic,Mater. Sci. & Eng., A155 (1992), p. 1.
S.P. Murarka,Silicides for VLSI Applications (New York: Academic Press), 1983.
P.J. Meschter and D.S. Schwartz,JOM, 41 (11) (1989), pp. 52–55.
R. Rosenkranz, G. Frommeyer, and W. Smarsly,Mater. Sci. & Eng., A152 (1992), p. 288.
R.R. Rice,Ceram. Eng. Sci. Proc., 11 (1990), p. 1226.
R. Tiwari, H. Herman, and S. Sampat,High Temperature Ordered Intermetallic Alloys IV. ed. L. A. Johnson, D.P. Pope, and J.O. Stiegler (Pittsburgh, PA: MRS, 1991).
R.G. Castro et al.,Scripta Met. Mater, 26 (1992), p. 207.
Y.L. Jeng, J. Wolfenstine, and E.J. Lavernia,Scripta Met. Mater., 28 (1993), p. 453.
R.A. Rapp, A. Ezis, and G.I. Yurek,Met. Trans. 4 (1973), p. 1283.
G.I. Yurek, R.A. Rapp, and J.P. Hirth,Met. Trans., 10A (1979), p. 591.
C. Tangchitvittaya, J.P. Hirth, and R.A. Rapp,Met Trans., 13A (1982), p. 585.
C.R. Kao, J. Woodford, and Y.A. Chang,Mater Sci. & Eng., A195 (1995), p. 29.
C.H. Henager, Jr., J.L. Brimhall, and J.P. Hirth,Scripta Met. Mater., 26 (1992), p. 585.
C.H. Henager, Jr., J.L. Brimhall, and J.P. Hirth,Mater. Sci. & Eng., A155 (1992), p. 109.
C.H. Henager, Jr., and J.L. Brimhall,Scripta Met. Mater., 26 (1993), p. 1597.
C.H. Henager Jr., J.L. Brimhall, and L.N. Brush,Mater Sci. & Eng., A195 (1995), p. 65.
C.C. Koch,Ann. Rev. Mater. Sci., 19 (1989), p. 121.
C. Survanarayana,Bibliography on Mechanical Alloying and Milling, (Cambridge, U. K.: Cambridge International Science Publishing, 1995).
G. Le Caer et al.,J. Mater. Sci., 25 (1990), p. 4726.
D.L. Zhang and T.B. Massalski,J. Mater. Res., 9 (1994), p. 53.
R.K. Viswanadham, S.K. Mannan, and S. Kumar,Scripta Met. Mater., 22 (1988), p. 1011.
K.S. Kumar and S.K. Mannan,High Temperature Ordered Intermetallic Alloys III, ed. C.T. Liu et al. (Pittsburgh, PA: MRS, 1992), p. 415.
J. Kajuch, J.D. Rignev, and J.J. Lewandowski,Mater. Sci. & Eng., A155 (1992), p. 59.
J. Kajuch and K. Vedula,Advances in Powder Metallurgy, (1990), p. 187.
M. Atzmon,Solid State Powder Processing, ed. A.H. Clauer and J.J. Barbadillo (Warrendale, PA: TMS, 1990), p. 173.
S. Patankar, S-Q. Xiao, and J.J. Lewandowski,J. Mater. Res., 8 (1993), p. 1311.
E. Ma et al.,J. Mater. Res., 8 (1993), p. 1836.
R.B. Schwarz et al.,Mater. Sci. & Eng., A155 (1992), p. 75.
G.T. Fei et al.,J. of Alloys and Compounds, 229 (1995), p. 280.
S. Jayashankar and M.J. Kaufman,J. Mater. Res., 8 (1993), p. 1428.
S. Jayashankar and M.J. Kaufman,Scripta Met. Mater., 26 (1992), p. 1245.
A. Calka et al.,J. Mater. Sci. Lett., 10 (1991), p. 734.
K. Omura and H. Miura,Appl. Phys. Lett., 60 (1992), p. 1433.
I’ Okadome, K. Unno, and T. Arakawa,J. Mater. Sci., 30 (1995), p. 1807.
A.G. Merzhanov and I.P. Borovinskaya,Combust. Sci. and Tech., 10 (1975), p. 195.
A.G. Merzhano,Combustion and Plasma Synthesis of High Temperature Materials, ed. Z.A. Munir and J.B. Holt (New York: VCH, 1992), p. 1.
Z.A. Munir,Ceram. Bull., 67 (1988), p. 342.
Z.A. Munir and V. Anselmi-Tamburini,Mater. Sci. Rep., 3 (1989), p. 277.
S.B. Bhaduri, Z.B. Qian, and R. Radhakrishnan,Scripta Met. Mater., 30 (1994), p. 179.
A.R. Sarkisiyan et al.,Comb. Expl. Shock Waves, 15 (1979), p. 310.
T.S. Azatyan et al.,Comb. Expl. Shock Waves, 15 (1979), p. 35.
V.I. Itin et al.,Sov. Phy. Journal, 18 (1976), p. 408.
S.B. Bhaduri, R. Radhakrishnan, and S. Wojcicki,Advances in Powder Metallurgy, vol 9, ed. J.M. Capus and R.M. German (Princeton, NJ: APMI, 1992) p. 369.
S.C. Deevi,Mater. Sci. and Eng., A149 (1992), p. 241.
S.C. Deevi,J. Mater. Sci., 26 (1991), p. 3343.
S. Zhang and Z.A. Munir,J. Mater. Sci, 26 (1991), p. 3685.
S.B. Bhaduri, R. Radhakrishnan, and Z.B. Qian,Scipta Met. Mater., 29 (1993), p. 1089.
J. Trambukis and Z.A. Munir,J. Am. Cer. Soc., 73 (1990), p. 1240.
A.K. Bhattacharya,J. Am. Cer. Soc, 74 (1991), p. 2707.
J. Subrahmanyam and R. Mohan Rao,J. Am. Cer. Soc, 78 (1995), p. 487.
J. Subrahmanyam and R. Mohan Rao,Mater. Sci. and Eng., A183 (1994), p. 205.
J.M. Brupbacher, L. Christodoulou, and D.C. Nagle, U.S. patent 4,710. 348 (187).
R.M. Aikin, Jr.,Ceram. Eng. Sci. Proc., 12 (1991), p. 1643.
J. Cool et al.,Eng. Sci. Proc, 12 (1991), p. 1656.
E.W. Lee et al.,JOM, 43 (3) (1991), p. 54–57.
S. Gedavanishvilli and Z.A. Munir,Scripta Met. Mater., 31 (1994), p. 741.
A. Feng and Z.A. Munir,J. Appl. Phys., 76 (1994), p. 1927.
I.J. Shon and Z.A. Munir,Mater. Sci. and Eng., A202 (1995), p. 256.
D.A. Hardwick, P.L. Martin, and R.J. Moores,Scripta Met. Mater., 27 (1992), p. 391.
P.S. DeCarli and J.C. Jamison,Science, 133 (1961), p. 1821.
N.N. Thadhani,J. Appl. Phys., 76 (1994), p. 2129.
E. Dunbar et al.,Proc. A/RAPT/APS High Pressure Science and Technology Conference, ed. S.C. Schmidt (New York: AIP Press, 1994).
M.A. Meyers et al.,Mater. Sci and Eng., A201 (1995), p. 150.
L.H. Yu and M.A. Meyers,J. Mater. Sci., 26 (1991), p. 601.
K.S. Vecchio, L.H. Yu, and M.A. Meyers,Acta Met. Mater., 42 (1994), p. 701.
M.A. Meyers, L.H. Yu, and K.S. Veechio,Acta Met. Mater, 42 (1994), p. 715.
S.C. Deevi and N.N. Thadhani,Mater. Sci. and Eng., A192/193 (1995), p. 604.
B.R. Krueger, A.H. Muntz, and T. Vreeland, Jr.,Met. Trans. A, 23A (1992), p. 55.
N.N. Thadhani, private communication.
E. Dunbar, N.N. Hadhani, and R.A. Graham,J. Mater. Sci., 28 (1993), p. 2903.
H.O. Pierson,Handbook of Chemical Vapor Deposition (New Jersey: Noyes Publications, 1992).
A. Sherman,Chemical Vapor Deposition for Microelectronics—Principles, Technology and Applications (New Jersey: Noyes Publications, 1992).
W.S. Cheng and C.Y. Lee,J. Mater Sci. Lett., 13 (1994), p. 1204.
G.J. Reynolds, G.B. Cooper III, and P.I. Gaczi,J. Appl. Phys., 65 (1989), p. 3212.
K. Saito et al.,J. Electrochem. Soc., 141 (1994), p. 1879.
S. Inoue et al.,J. electrochem. Soc., 130 (1983), p. 1603.
S.G. Telford et al.,Appl. Phys. Lett., 62 (1993), p. 1766.
D. Dobkin et al.,J. Electrochem. Soc., 137 (1990), p. 1623.
R.S. Nowicki et al.,J. Vac. Sci. and Tech. A9 (1991), p. 1073.
K. Saito et al.,J. Electrochem. Soc., 141 (1993), p. 513.
K. Saito, T. Amazawa, and Y. AritaJap. J of Appl. Phys., 29 (1990), p. L185.
S. McClatchie, H. Thomas, and D.V. Morgan,Appl. Surf. Sci., 73 (1993), p. 58.
T. Hara, T. Miyamoto, and T. Yokoyama,J. Electrochem. Soc., 136 (1989), p. 1177.
T. Hara et al.,J. Electrochem. Soc., 137 (1990), p. 2955.
S.G. Telford et al.,J. Electrochem. Soc., 140 (1993), p. 3689.
Additional information
R. Radhakrishnan earned his M.S. in metallurgical engineering from the University of Idaho in 1994. He is currently pursuing his Ph.D. in metallurgical engineering at the University of Idaho.
S. Bhaduri earned his Ph.D. in materials science and engineering from the State University of New York at Stony Brook in 1981. He is currently an associate professor of metallurgy at the University of Idaho.
C.H. Henager, Jr., earned his Ph.D. in metallurgical engineering from the University of Washington in 1983. He is currently a staff scientist at Battelle Pacific Northwest National Laboratories.
Rights and permissions
About this article
Cite this article
Radhakrishnan, R., Bhaduri, S. & Henager, C.H. The reactive processing of silicides. JOM 49, 41–45 (1997). https://doi.org/10.1007/BF02914631
Issue Date:
DOI: https://doi.org/10.1007/BF02914631