Abstract
The intermetallic compounds (IMCs) formed during the reflow and aging of Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes were investigated. After reflow, the thickness of (Cu, Ni, Au)6Sn5 interfacial IMCs in Sn3Ag0.5Cu0.06Ni0.01Ge was similar to that in the Sn3Ag0.5Cu specimen. The interiors of the solder balls in both packages contained Ag3Sn precipitates and brick-shaped AuSn4 IMCs. After aging at 150°C, the growth thickness of the interfacial (Ni, Cu, Au)3Sn4 intermetallic layers and the consumption of the Ni surface-finished layer on Cu the pads in Sn3Ag0.5Cu0.06Ni0.01Ge solder joints were both slightly less than those in Sn3Ag0.5Cu. In addition, a coarsening phenomenon for AuSn4 IMCs could be observed in the solder matrix of Sn3Ag0.5Cu, yet this phenomenon did not occur in the case of Sn3Ag0.5Cu0.06Ni0.01Ge. Ball shear tests revealed that the reflowed Sn3Ag0.5Cu0.06Ni0.01Ge packages possessed bonding strengths similar to those of the Sn3Ag0.5Cu. However, aging treatment caused the ball shear strength in the Sn3Ag0.5Cu packages to degrade more than that in the Sn3Ag0.5Cu0.06Ni0.01Ge packages.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
K. Zeng and K.N. Tu,Mater. Sci. Eng. R 38, 55 (2002).
M. Yamashita, S. Tada, K. Shiokawa, and Fuzi Electric Co., “Solder Alloys,” U.S. patent 6,179,935 B1 (2001).
K. Habu, N. Takeda, H. Watanabe, H. Ooki, J. Abe, T. Saito, Y. Taniguchi, and K. Takayama,Proc. Int. Conf. Electron. Environment, (New York: IEEE, 1999), p. 21.
C.M. Chuang and K.L. Lin,J. Electron. Mater. 33, 1426 (2003).
C.M. Chuang, P.C. Shi, and K.L. Lin,2002 Int. Symp. Electron. Mater. Packag., IEEE, 360 (2002).
C.M. Chuang, P.C. Shi, and K.L. Lin,Proc. Int. Conf. Electron. Mater. Packag., (New York: IEEE, 2002), p. 360.
S.F. Yen, H.M. Wu, and T.H. Chuang,J. Electron. Mater. 35, 310 (2005).
T.H. Chuang, S.Y. Chang, L.C. Tsao, W.P. Weng, and H.M. Wu,J. Electron. Mater. 32, 195 (2003).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Chuang, T.H., Yen, S.F. & Cheng, M.D. Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes. J. Electron. Mater. 35, 302–309 (2006). https://doi.org/10.1007/BF02692450
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF02692450