Abstract
Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites.
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Betrabet, H.S., McKinlay, J.K. & McGee, S.M. Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope. J Mater Sci 27, 4009–4015 (1992). https://doi.org/10.1007/BF01105097
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DOI: https://doi.org/10.1007/BF01105097