Abstract
Thermal fluctuation experienced by an electronics package during normal operation causes strains, and in turn stresses, in the solder joints. These result from differences in coefficient of thermal expansion between the various components of the package; see, for example, Figure 15-1. The thermal fluctuation can be produced by heat dissipated in the electronic components or by environmental temperature changes. The repetition of such fluctuations produces cyclic strains and stresses, which ultimately lead to the failure of the solder joints in fatigue.
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Hacke, P.L., Sprecher, A.F., Conrad, H. (1993). Thermomechanical Fatigue of 63Sn-37Pb Solder Joints. In: Lau, J.H. (eds) Thermal Stress and Strain in Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7767-2_15
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DOI: https://doi.org/10.1007/978-1-4684-7767-2_15
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