Abstract
In order to verify the heat dissipation effect of the new material foam metal copper, the foam metal copper is welded in the common liquid cooling radiator channel to form a liquid cooling heat dissipation module based on foam copper. Compared with the ordinary liquid-cooled radiator and liquid-cooled radiator with foamed copper, it can be seen that the performance of radiator with foam copper is better than the ordinary radiator, the thermal resistance of channel-type liquid-cooled radiator can be reduced by 17% and the temperature rise can be reduced by 4.5 °C. Under the condition of low-pressure and low-speed liquid supply, the temperature rise can be reduced more obviously and the energy efficiency ratio is higher. In the testing process of liquid-cooled radiator, the actual heat transfer performance increases with the liquid supply flow rate. However, the change of temperature rise tends to flatten when the liquid supply flow rate increases to a certain extent. As a result, it is appropriate to control the liquid supply flow rate in order to ensure heat dissipation effect and take into account the efficiency ratio at the same time.
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Wang, X., Huang, G., Chen, N., Jing, C. (2021). The Liquid Cooling Technique Based on Foam Metal Copper. In: WU, C.H., PATNAIK, S., POPENTIU VLÃDICESCU, F., NAKAMATSU, K. (eds) Recent Developments in Intelligent Computing, Communication and Devices. ICCD 2019. Advances in Intelligent Systems and Computing, vol 1185. Springer, Singapore. https://doi.org/10.1007/978-981-15-5887-0_11
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DOI: https://doi.org/10.1007/978-981-15-5887-0_11
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