Abstract
The basic principles of Plasma-Enhanced Chemical Vapor Deposition processes are examined along with reactor architectures. Emphasis is given to the chemistry of the discharge and to active species and deposition precursors with the aim of correlating film compositions with discharge internal parameters. The processes for the deposition of films of fluoropolymers, metal containing polymers, SiO2-likes and silicone-likes are examined as case studies.
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d’Agostino, R., Favia, P., Fracassi, F., Lamendola, R. (1992). Plasma-Enhanced Chemical Vapor Deposition. In: Gissler, W., Jehn, H.A. (eds) Advanced Techniques for Surface Engineering. Eurocourses: Mechanical and Materials Science, vol 1. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-0631-5_6
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DOI: https://doi.org/10.1007/978-94-017-0631-5_6
Publisher Name: Springer, Dordrecht
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