Abstract
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
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Yang, F., Li, J.C.M. (2006). Deformation behavior of tin and some tin alloys. In: Lead-Free Electronic Solders. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-48433-4_12
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