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References
S.F. Al-sarawi, D. Abbott, and P.D. Franzon, A review of 3-D packaging technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 21, pp. 2–14 (1998).
E. Harlev, T. Gulakhmedova, I. Rubinovich, and G. Aizenshtein, New method for the preparation of conductive polyaniline solutions: Application to liquid crystal devices, Advanced Materials, 8, pp. 994–997 (1996).
G. Gu, P.E. Buroows, S. Venkatesh, S.R. Forrest, and M.E. Thompson, Vacuum-deposited, nonpolymeric f lexible organic light-emitting devices, Optics Letters, 22, pp. 172–174 (1997).
Z. Chen, B. Cotterell, W. Wang, E. Guenther, and S.J. Chua, A mechanical assessment of flexible optoelectronic devices, Thin Solid Films, 394, pp. 201–205 (2001).
M. Notomi, T. Gotoh, K. Kishimoto, and T. Shibuya, Evaluation of ultra-violet degradation on PP and PC by layering-films exposure test, Transactions of the Japan Society of Mechanical Engineers, Part A, 63, pp. 437–444 (1997).
J.W. Hutchinson and Z. Suo, Mixed mode cracking in layered materials, Advances in Applied Mechanics, 29, pp. 63–191 (1992).
A.G. Evans and J.W. Hutchinson, The thermomechanical integrity of thin films and multilayers, Acta Metallurgica Materialia, 43, pp. 2507–2530 (1995).
A.G. Evans, J.W. Hutchinson, and Y. Wei, Interface adhesion: effects of plasticity and segragation, Acta Metallurgica Materialia, 47, pp. 4093–4113 (1999).
S.W. Russel, S.A. Rafalski, R.L. Spreitzer, J. Li, M. Moinpour, F. Moghadam, and T.L. Alford, Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions, Thin Solid Films, 262, pp. 154–167 (1995).
D.B. Marshall and A.G. Evans, Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interfaced delamination, Journal of Applied Physics, 56, pp. 2632–2638 (1984).
C. Rossington, A.G. Evans, D.B. Marshall, and B.T. Khuri-Yakub, Measurement of adherence of residually stressed thin films by indentaion. II. Experiments with ZnO/Si, Journal of Applied Physics, 56, pp. 2639–2644 (1984).
A.G. Evans and J.W. Hutchinson, On the mechanics of delamination and spalling in compressed films, International Journal of Solids and Structures, 20, pp. 455–466 (1984).
L.G. Rosenfeld, J.E. Ritter, T.J. Lardner, and M.R. Lin, Use of the microindentation technique for determining interfacial fracture energy, Journal of Applied Physics, 67, pp. 3291–3298 (1990).
D.F. Bahr, J.W. Hoehn, N.R. Moody, and W.W. Gerberich, Adhesion and acoustic emission analysis of failures in nitride films with a metal interlayer, Acta Materialia, 45, pp. 5163–5175 (1997).
M.D. Drory and J.W. Hutchinson, Measurement of the adhesion of a brittle film on a ductile substrate by indentation, Proceedings of the Royal Society of London Series A—Mathematical Physical and Engineering Sciences, 452, pp. 2319–2341 (1996).
M.D. Kriese, N.R. Moody, and W.W. Gerberich, Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrate, Acta materialia, 46, pp. 6623–6630 (1998).
M.D. Kriese, D.A. Boismier, N.R. Moody, and W.W. Gerberich, Nonomechanical fracture-testing of thin films, Engineering Fracture Mechanics, 61, pp. 1–20 (1998).
W.W. Gerberich, D.E. Kramer, N.I. Tymiak, A.A. Volinsky, D.F. Bahr, and M.D. Kriese, Nanoindentation-induced defect-interface interactions: phenomena. Methods and limitations, Acta Materialia, 47, pp. 4115–4123 (1999).
H.M. Jensen, The blister test for interface toughness measurement, Engineering Fracture Mechanics, 40, pp. 475–486 (1991).
H.M. Jensen and M.D. Thouless, Effects of residual stresses in the blister test, International Journal of Solids and Structures, 30, pp. 779–795 (1993).
A. Bagchi, G.E. Lucas, Z. Suo, and A.G. Evans, A new procedure for measuring the decohesion energy for thin ductile films on substrates, Journal of Material Research, 9, pp. 1734–1741 (1994).
A. Bagchi and A.G. Evans, Measurements of the debond energy for thin metallization lines on dielectrics, Thin Solid Films, 286, pp. 203–212 (1996).
A.V. Zhuk, A.G. Evans, J.W. Hutchinson, and G.M. Whitesides, The adhesion energy between polymer thin films and self-assembled monolayers, Journal of Material Research, 13, pp. 3555–3565 (1998).
T. Kitamura, T. Shibutani, and T. Ueno, Development of evaluation method for interface strength between thin films and its application on delamination of Cu/TaN in an advanced LSI, Transactions of the Japan Society of Mechanical Engineers, 66, pp. 1568–1573 (2000).
T. Kitamura, H. Hirakata, and T. Itsuji, Delamination strength of Cu thin film characterized by nanoscale stress field near interface edge, Transactions of the Japan Society of Mechanical Engineers, Part A, 68, pp. 119–125 (2002).
T. Kitamura, H. Hirakata, and Y. Yamamoto, Interface strength of tungsten micro-component on silicon substrate by means of AFM, Transactions of the Japan Society of Mechanical Engineers, Part A, 69, pp. 1216–1221 (2003).
K. Nakasa, M. Kato, D. Zhang, and K. Tasaka, Evaluation of delamination strength of thermally sprayed coating by edge-indentation method, Journal of the Society of Material Science, Japan, 47, pp. 413–419 (1998).
D. Zhang, M. Kato, and K. Nakasa, Fracture mechanics analysis of edge-indentation method for evaluation of delamination strength of coating, Journal of the Society of Material Science, Japan, 49, pp. 572–578 (2000).
K.S. Kim and N. Aravas, Elasto-plastic analysis of the peel test, International Journal of Solids and Structures, 24, pp. 417–435 (1988).
G.J. Spies, The peeling test on redux-bonded joints, Journal of Aircraft Engineering, 25, pp. 64–70 (1953).
J.J. Bickerman, Theory of peeling through a hookean solid, Journal of Applied Physics, 28, pp. 1484–1485 (1957).
D.H. Kaeble, Theory and analysis of peel adhesions: mechanism and mechanics, Transaction of Society of Rheology, 3, pp. 161–180 (1959).
D.H. Kaeble, Theory and analysis of peel adhesions: bond stresses and distributions, Transaction of Society of Rheology, 4, pp. 45–73 (1960).
C. Jouwersma, On the theory of peeling, Journal of Polymer Sciences, 45, pp. 253–255 (1960).
S. Yurenka, Peel testing of adhesive bonded metal, Journal of Applied Polymer Science, 6, pp. 136–144 (1962).
J.L. Gardon, Peel adhesion. II. A theoretical analysis, Journal of Applied Polymer Sciences, 7, pp. 643–664 (1963).
E.B. Saubestre, L.J. Durney, J. Haidu, and E. Bastenbeck, The adhesion of electrodeposits to plastics, Plating, 52, pp. 982–1000 (1965).
K. Kendall, The shapes of peeling solid films, Journal of Adhesion, 5, pp. 105–117 (1973).
A.N. Gent and G.R. Hamed, Peel mechanics, Journal of Adhesion, 7, pp. 91–95 (1975).
D.W. Nicholson, Peel mechanics with large bending, International Journal of Fracture, 13, pp. 279–287 (1977).
M.D. Chang, K.L. Devries, and M.L. Williams, The effects of plasticity in adhesive fracture, Journal of Adhesion, 4, pp. 221–231 (1972).
A.N. Gent and G.R. Hamed, Peel mechanics for an elastic-plastic adherent, Journal of Applied Polymer Sciences, 21, pp. 2817–2831 (1977).
A.D. Crocombe and R.D. Adams, Peel analysis using the finite element method, Journal of Adhesion, 12, pp. 127–139 (1981).
A.D. Crocombe and R.D. Adams, An elasto-plastic investigation of the peel test, Journal of Adhesion, 13, pp. 241–267 (1982).
A.G. Atkins and Y.W. Mai, Residual strain energy in elastoplastic adhesive and cohesive fracture, International Journal of Fracture, 30, pp. 203–221 (1986).
K.-S. Kim and J. Kim, Elasto-plastic analysis of the peel test for thin film adhesion, Journal of Engineering Materials and Technology, 110, pp. 266–273 (1988).
A.J. Kinloch, C.C. Lau, and J.G. Williams, The peeling of flexible laminates, International Journal of Fracture, 66, pp. 45–70 (1994).
Y. Wei and J.W. Hutchinson, Interface strength, work of adhesion and plasticity in the peel test, International Journal of Fracture, 93, pp. 315–333 (1998).
Y. Wei and J.W. Hutchinson, Peel test and interfacial toughness, in W. Gerberich and W. Yang, Eds., Interfacial and Nanoscale Failure, Volume 8, Comprehensive Structural Integrity, I. Milne, R.O. Ritchie, and B. Karihaloo, Editors-in-Chief, Elsevier, Amsterdam, 2003, pp. 181–217.
V. Tvergaard and J.W. Hutchins, The influence of plasticity on mixed mode interface toughness, Journal of the Mechanics and Physics of Solids, 41, pp. 1119–1135 (1993).
F. Ma and K. Kishimoto, A continuum interface debonding model and application to matrix cracking of composite, JSME International Journal, Series A, 39, pp. 496–507 (1996).
C. Zhou, W. Yang, and D. Fang, Damage of short-fiber-reinforced metal matrix composite considering cooling and thermal cycling, Journal of Engineering Materials and Technology, 122, pp. 203–209 (2000).
M. Omiya, K. Kishimoto, and W.M. Yang, Interface debonding model and it’s application to the mixed mode interface fracture toughness, International Journal of Damage Mechanics, 11, pp. 263–286 (2002).
I.S. Park and J. Yu, An X-ray study on the mechanical effects of the peel test in a Cu/Cr/polyimide system, Acta Materialia, 46, pp. 2947–2953 (1988).
Y.B. Park, I.S. Park, and J. Yu, Interfacial fracture energy measurements in the Cu/Cr/polyimide system, Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, 266, pp. 261–266 (1999).
Y.B. Park, I.S. Park, and J. Yu, Phase angle in the Cu/polyimide/alumina system, Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, 266, pp. 109–114 (1999).
H.-H. Yu, M.Y. He, and J.W. Hutchinson, Edge effects in thin films, Acta Materialia, 49, pp. 93–107 (2001).
W. Yang and L.B. Freund, Shear stress concentration near the edge of a thin film deposited in a substrate, Brown Technical Report, November 1984.
M. Yanaka, Y. Kato, Y. Tsukahara, and N. Takeda, Effects of temperature on the multiple cracking progress of sub-micron thick glass films deposited on a polymer substrate, Thin Solid Films, 355-356, pp. 337–342 (1999).
B.F. Chen, J. Hwang, G.P. Yu, and J.H. Huang, In situ observation of the cracking behavior of TiN coating on 304 stainless steel subjected to tensile strain, Thin Solid Films, 352, pp. 173–178 (1999).
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Omiya, M., Kishimoto, K., Yang, W. (2007). Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_36
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