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Liang, J., Dariavach, N., Shangguan, D. (2007). Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_10
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