Abstract
In this study, we present results of a mathematical model in which the governing equations of electroforming process were solved using a robust finite element solver (COMSOL Multiphysics). The effects of different parameters including applied current density, solution electrical conductivity, electrode spacing, and anode height on the copper electroforming process have been investigated. An electroforming experiment using copper electroforming cell was conducted to verify the developed model. The obtained results show that by increasing the applied current density, the electroforming process takes place faster, thereby resulting in a higher thickness of the electroformed layer. In addition, higher applied current density led to non-uniformity of the coated layer. It was revealed that by increasing electrolytic conductivity from 5 to 20 S/m, the electroformed layer became thicker. By considering three different anode heights, it was found that if the cathode and anode are the same height, the process will be more effective. Finally, it was concluded that there is an optimum value of anode-cathode spacing: above it, energy consumption and plating time are high; while below it, the resultant layer is non-uniform. The present study demonstrates that the developed model can accurately capture the physics of electroforming with a reasonable computational time.
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W. Blum and G. B. Hogaboom, Principles of electroplating and electroforming, McGraw-Hill, New York (1949).
K. Zhai, L. Du, W. Wang, H. Zhu, W. Zhao and W. Zhao, Ultrason. Sonochem., 42, 368 (2018).
L. Yang, T. Atanasova, A. Radisic, J. Deconinck, A. C. West and P. Vereecken, Electrochim. Acta, 104, 242 (2013).
H. Yang and S.-W. Kang, Int. J. Mach. Tool. Manu., 40, 1065 (2000).
T. Kobayashi, J. Kawasaki, K. Mihara and H. Honma, Electrochim. Acta, 47, 85 (2001).
J.-D. Li, P. Zhang, Y.-H. Wu, Y.-S. Liu and M. Xuan, Microsyst Technol., 15, 505 (2009).
Y.-J. Tan and K. Y. Lim, Surf. Coat. Technol., 167, 255 (2003).
C.-W. Park and K.-Y. Park, Results Phys., 4, 107 (2014).
D. R. Gabe, Plat. Surf. Finish., 82, 69 (1995).
J.-M. Yang, D.-H. Kim, D. Zhu and K. Wang, Int. J. Mach. Tool Manu., 48, 329 (2008).
H. Z. Pei, J. Zhang, G. L. Zhang and P. Huang, Adv. Mater. Res., 479, 497 (2012).
L. Tong, Tertiary current distributions on rotating electrodes, Proceedings of the COMSOL Conference (2011).
I. Belov, C. Zanella, C. Edström and P. Leisner, Mater. Design, 90, 693 (2016).
M. Rosales, T. Pérez and J. L. Nava, Electrochim. Acta, 194, 338 (2016).
T. Pérez and J. L. Nava, J. Electroanal. Chem., 719, 106 (2014).
T. Elshenawy, Propellants, Explos., Pyrotech., 41, 69 (2016).
C. Low, E. Roberts and F. Walsh, Electrochim. Acta, 52, 3831 (2007).
M. Eisenberg, C. Tobias and C. Wilke, J. Electrochem. Soc., 101, 306 (1954).
COMSOL Multiphysics, 2017. User’s Guide, Version 5.3a. Comsol Inc.
E. J. Dickinson, H. Ekström and E. Fontes, Electrochem. Commun., 40, 71 (2014).
E. Sabooniha, M. R. Rokhforouz and S. Ayatollahi, Oil GasSci. Technol. - Rev. IFP Energies Nouvelles, 74, 78 (2019).
M. R. Rokhforouz and H. A. Akhlaghi Amiri, Adv. Water Resour., 124, 84 (2019).
A. Shukla and M. Free, Modeling and measuring electrodeposition parameters near electrode surfaces to facilitate cell performance optimization, Department of Metallurgical Engineering, University of Utah (2013).
T. Elshenawy, S. Soliman and A. Hawwas, Def. Technol., 13, 439 (2017).
N. Obaid, R. Sivakumaran, J. Lui and A. Okunade, Modelling the electroplating of hexavalent chromium, COMSOL Conference. Boston2013 (2013).
K. C. Pillai, S. J. Chung and I.-S. Moon, Chemosphere, 73, 1505 (2008).
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Heydari, H., Ahmadipouya, S., Maddah, A.S. et al. Experimental and mathematical analysis of electroformed rotating cone electrode. Korean J. Chem. Eng. 37, 724–729 (2020). https://doi.org/10.1007/s11814-020-0479-4
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DOI: https://doi.org/10.1007/s11814-020-0479-4