Abstract
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the joint were evaluated experimentally by performing stable fracture tests at different strain rates employing an optimized tapered double cantilever beam (TDCB) design. The viscoplastic behavior of the solder was characterized in shear, and the constitutive parameters related to the Anand model were determined. A rate-independent cohesive zone damage model was identified to best simulate the interfacial damage progression in the TDCB tests by developing a three-dimensional (3D) finite-element (FE) model and considering the viscoplastic response of the bulk solder. The influence of strain rate on the load capability and failure mode of the joint was clarified by analyzing the experimental and simulation results. It was shown how, at the lower strain rates, the normal stress generated at the interface is limited by the significant creep relaxation developed in the bulk solder and thus is not sufficiently high to initiate interfacial damage, whereas at higher rates, a large amount of the external energy is dissipated into interfacial damage development.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
K.J. Puttlitz and K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (New York: CRC, 2004).
M. Abtew and G. Selvaduray, Mat. Sci. Eng. R-Rep. 27, 95 (2000).
I.E. Anderson, J. Mater. Sci. Mater. Electron. 18, 55 (2007).
S. Wiese and K.J. Wolter, Microelectron. Reliab. 47, 223 (2007).
X. Long, I. Dutta, V. Sarihan, and D.R. Frear, J. Electron. Mater. 37, 189 (2008).
M.A. Matin, J.G.A. Theeven, W.P. Vellinga, and M.G.D. Geers, Microelectron. Reliab. 47, 1262 (2007).
J. Cugnoni, J. Botsis, V. Sivasubramaniam, and J. Janczak-Rusch, Fatigue Fract. Eng. Mater. Struct. 30, 387 (2007).
Y.T. Chin, P.K. Lam, H.K. Yow, and T.Y. Tou, Microelectron. Reliab. 48, 1079 (2008).
D.R. Frear and P.T. Vianco, Metall. Mater. Trans. A 25, 1509 (1994).
M. Kerr and N. Chawla, JOM-J. Min. Met. Mater. Soc. 56, 50 (2004).
J.H.L. Pang, B.S. Xiong, C.C. Neo, X.R. Zhang, and T.H. Low, Electronic Components and Technology Conference, 2003, p. 673.
R.S. Sidhu, X. Deng, and N. Chawla, Metall. Mater. Trans. A 39, 349 (2008).
G.Z. Wang, Z.N. Cheng, K. Becker, and J. Wilde, J. Electron. Packaging 123, 247 (2001).
S.M. Hayes, N. Chawla, and D.R. Frear, Microelectron. Reliab. 49, 269 (2009).
C.K. Shin, Y.J. Baik, and J.Y. Huh, J. Electron. Mater. 30, 1323 (2001).
V. Sivasubramaniam, N.S. Bosco, J. Janczak-Rusch, J. Cugnoni, and J. Botsis, J. Electron. Mater. 37, 1598 (2008).
M.A. Dudek, L. Hunter, S. Kranz, J.J. Williams, S.H. Lau, and N. Chawla, Mater. Charact. 61, 433 (2010).
J.C. Suhling, H.S. Gale, R.W. Johnson, M.N. Islam, T. Shete, P. Lall, M.J. Bozack, J.L. Evans, P. Seto, T. Gupta, and J.R. Thompson, Solder. Surf. Mt. Technol. 16, 77 (2004).
J.J. Sundelin, S.T. Nurmi, T.K. Lepisto, and E.O. Ristolainen, Mater. Sci. Eng. A 420, 55 (2006).
A. Abdul-Baqi, P.J.G. Schreurs, and M.G.D. Geers, Int. J. Solids Struct. 42, 927 (2005).
M.O. Alam, H. Lu, C. Bailey, and Y.C. Chan, Comp. Mater. Sci. 45, 576 (2009).
W.H. Bang, M.W. Moon, C.U. Kim, S.H. Kang, J.P. Jung, and K.H. Oh, J. Electron. Mater. 37, 417 (2008).
D. Bhate, D. Chan, G. Subbarayan, and L. Nguyen, J. Electron. Packag. 130, 21003 (2008).
P. Kumar, I. Dutta, V. Sarihan, D.R. Frear, and M. Renavikar, 11th Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2008, 2008, p. 660.
Q.D. Yang, D.J. Shim, and S.M. Spearing, Microelectron. Eng. 75, 85 (2004).
S.P.V. Nadimpalli and J.K. Spelt, Eng. Fract. Mech. 78, 317 (2011).
A.F. Skipor, S.V. Harren, and J. Botsis, Eng. Fract. Mech. 52, 647 (1995).
P. Towashiraporn, G. Subbarayan, and C.S. Desai, Int. J. Solids Struct. 42, 4468 (2005).
W. Yang, L.E. Felton, and R.W. Messler, J. Electron. Mater. 24, 1465 (1995).
V. Sivasubramaniam, M. Galli, J. Cugnoni, J. Janczak-Rusch, and J. Botsis, J. Electron. Mater. 38, 2122 (2009).
W. Beres, K.K. Koul, and R. Thamburaj, J. Test. Eval. 25, 536 (1997).
J.P. Gallagher, Eng. Fract. Mech. 3, 27 (1971).
T.L. Anderson, Fracture Mechanics: Fundamentals and Applications, 2nd ed. (New York: CRC, 1995).
C.F. Shih, B. Moran, and T. Nakamura, Int. J. Fracture 30, 79 (1986).
S.B. Brown, K.H. Kim, and L. Anand, Int. J. Plast. 5, 95 (1989).
N. Bai, X. Chen, and H. Gao, Mater. Des. 30, 122 (2009).
X. Chen, G. Chen, and M. Sakane, IEEE Trans. Compon. Pack. Technol. 28, 111 (2005).
J.L. Chaboche, F. Feyel, and Y. Monerie, Int. J. Solids Struct. 38, 3127 (2001).
X.P. Xu and A. Needleman, Model. Simul. Mater. Sci. 1, 111 (1993).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Maleki, M., Cugnoni, J. & Botsis, J. On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints. J. Electron. Mater. 40, 2081–2092 (2011). https://doi.org/10.1007/s11664-011-1718-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-011-1718-6