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W.R. Johannes and W. Johnson: Int. J. Microcircuits Elec. Packaging, 1994, vol. 17 (2), pp. 135–42.
D.E. Jech and J.L. Sepulveda: Int. Symp. on Microelectronics, Las Vegas, NV, 1997, SPIE Proc. Series 3235, SPIE, pp. 90–96.
P. Yih and D.D.L. Chung: J. Mater. Sci., 1997, vol. 32, pp. 2873–82.
C. Zweben: JOM, 1992, vol. 44(7), pp. 15–22.
R. Kumar, J.J. Stiglich, T.S. Sudarshan, and C.C. Yu: Mater. Manufacturing Processes, 1996, vol. 11, pp. 1029–41.
S. Yamagata, M. Imamura, Y. Hirose, Y. Abe, Y. Takano, and A. Fukui: Int. Symp. on Microelectronics, San Diego, CA, 1998, SPIE Proc. Series 3582, SPIE, pp. 675–80.
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Stolk, J., Manthiram, A. Chemical synthesis and characterization of low thermal expansion-high conductivity Cu-Mo and Ag-Mo composites. Metall Mater Trans A 31, 2396–2398 (2000). https://doi.org/10.1007/s11661-000-0159-2
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DOI: https://doi.org/10.1007/s11661-000-0159-2