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Received: 8 Dezember 1997/Accepted: 5 January 1998
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Shi, F., Zhao, B. Modeling of chemical-mechanical polishing with soft pads . Appl Phys A 67, 249–252 (1998). https://doi.org/10.1007/s003390050766
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DOI: https://doi.org/10.1007/s003390050766