Abstract
An experimental investigation has been performed to determine the effects of different arrangements of obstacles on the cooling of simulated electronic package. The considered simulated electronic package consisted of a channel formed by two parallel plates. The bottom plate is attached with five identical electrically heated square obstacles, which are perpendicular to the mean airflow and arranged with different side-to-side distances. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option and should be avoided. A better thermal performance could be obtained when the side-to-side distances between the obstacles followed a geometric series. For example, at Re=800, the highest temperature of the optimum arrangement could be reduced by 12% compare to the equi-spaced arrangement and the maximum temperature difference among the five obstacles is lower than that of equi-spaced arrangement by 32.1%.
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Received on 17 December 1999
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Chen, S., Liu, Y., Chan, S. et al. Experimental study of optimum spacing problem in the cooling of simulated electronic package. Heat and Mass Transfer 37, 251–257 (2001). https://doi.org/10.1007/s002310000168
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DOI: https://doi.org/10.1007/s002310000168