Abstract
The process of diffusion in the solid state is one aspect of behaviour in gold thin film systems which has received increased attention as gold layers have had to be made significantly thinner without sacrificing their reliability. This article reviews the characteristics of this process for gold over the various one- and two-layer base metal systems which are in common use by the electronics industry. A number of interesting phenomena are described and related to the service problems which they may cause in various devices.
Similar content being viewed by others
References
R. G. Baker and T. A. Palumbo,Plating, 1971,58, 791–800
A. J. Solomon and M. Antler,Plating, 1970,57, (8), 812–816
M. S. Frant, ‘Plated Metals in Electrical Contacts’, Space Technology Laboratories Symposium on Connectors, Los Angeles, California, November 1962
P. G. Shewmon, ‘Diffusion in Solids’, McGraw-Hill, New York, 1963, 44–45
R. E. Reed-Hill, ‘Physical Metallurgy Principles’, Van Nostrand, Princeton, New Jersey, 1964, 263–264
A. Gangulee,J. Appl. Phys., 1972,43, 867–873
P. S. Willcox and J. R. Cady,Plating, 1974,61, (12), 1117–1124
S. Nakahara and Y. Okinaka,J. Electrochem. Soc., 1976,123, 1284–1289
R. W. Balluffi and J. M. Blakely,Thin Solid Films, 1975,25, 363–392
R. Butz, W. Erley and H. Wagner,Phys. Status Solidi A, 1971,7, K5-K8
R. W. Balluffi,Phys, Status Solidi, 1970,42, 11–34
M. Hansen and K. Anderko, ‘Constitution of Binary Alloys’, Second Edition, McGraw-Hill Book Company Inc., New York, 1958, 199
W. Jost,Z. Phys. Chem., 1932,B-16, 123–128
C. Matano,Jpn. J. Phys., 1934,9, 41–47
T. F. Archbold and W. H. King,Trans. TMS-AIME, 1965,233, 839–841
A.B. Martin, R. D. Johnson and F. Asaro,J. Appl. Phys., 1954,25, 364–369
M. R. Pinnel and J. E. Bennett,Metall. Trans., 1972,3, (7), 1989–1997
P. M. Hall, J. M. Morabito and N. J. Panousis,Thin Solid Films, 1977,41, (3), 341–361
Ch. J. Raub, H. R. Khan and J. Lendvay,Gold Bull, 1976,9, (4), 123–128
C. C. Lo, J. A. Augis and M. R. Pinnel, ‘Proceedings of the 4th International Conference on Thin Film Phenomena’, London, September 1978, in press
H. G. Tompkins and M. R. Pinnel,J. Appl. Phys., 1976,47, (9), 3804–3812
J. A. Borders,Thin Solid Films, 1973,19, 359–368
H. G. Tompkins,J. Electrochem. Soc., 1975,122, 983–987
P. M. Hall and J. M. Morabito,Surf. Sci, 1976,59, 624–630
H. G. Tompkins and M. R. Pinnel,J. Appl. Phys., 1977,48, (7), 3144–3146
M. R. Pinnel, H. G. Tompkins and D. E. Heath,Appl. Surf. Sci., in press
J. H. Thomas III,IEEE Trans. Parts Hybrids Packag., 1976,PHP-12, 255–259
J. H. Thomas III,J. Electrochem. Soc., 1978,125, 898–902
K. N. Tu and B. S. Berry,J. Appl. Phys., 1972,43, (8), 3283–3290
M. R. Pinnel, Bell Laboratories, Columbus, Ohio, unpublished research
P. M. Hall, N. T. Panousis and P. R. Menzel,IEEE Trans. Parts Hybrids Packag., 1975,PHP-11, 202–205
J. E. Reynolds, B. L. Averbach and M. Cohen,Acta Metall., 1957,5, 29–40
M. Hansen and K. Anderko,op. cit., 220
M. R. Pinnel, H. G. Tompkins and D. E. Heath,J. Electrochem. Soc., submitted for publication
M. J. Graham and M. Cohen,J. Electrochem. Soc., 1972,119, 879–882
S. H. Kulpa and R. P. Frankenthal,J. Electrochem. Soc., 1977,124, 1588–1592
M. Antler,Plating, 1970,57, (1), 615–618
M. R. Pinnel and J. E. Bennett,Metall. Trans., 1976,7A, (5), 629–635
L. C. C. Da Silva and R. F. Mehl,J. Met., 1951,3, 155–163
A. Nyilas, G. Betz and M. G. Frohberg,Z. Metallkd., 1973,64, 824–826
A. S. McDonald and G. H. Sistare,Gold Bull., 1978,11, (4), 128–131
J. C. Turn and E. L. Owen,Plating, 1974,61, (11), 1015–1018
G. C. Wilson,Trans. Inst. Met. Finish., 1972,50, 109–113
M. Rao, M. Mitchell and R. Anderson,Solid State Technol., 1974,17, (11), 47–48
J. E. Bennett and H. G. Tompkins,J. Electrochem. Soc., 1976,123, 999–1003
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Pinnel, M.R. Diffusion-related behaviour of gold in thin film systems. Gold Bull 12, 62–71 (1979). https://doi.org/10.1007/BF03216542
Issue Date:
DOI: https://doi.org/10.1007/BF03216542