Abstract
Lead-free soldering is an important part of electronic devices production. New lead-free solders that replace classical Sn-37Pb solder are still under development. Thermodynamic modeling makes the development process faster, cheaper and more environmentally friendly due to predictions of phases stabilities and phases transformations. In this work, the thermodynamic description of quaternary Ag-Bi-Cu-Sn system is presented. The thermodynamic assessment of promising lead-free quaternary solder was prepared using the Calphad approach. A good agreement between available experimental data and calculation was found.
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Acknowledgement
The work was supported by Ministry of Science and Technology (MOST) Taiwan under Grants: 105-2221-E-259-004 and 104-2221-E-259-002.
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Gierlotka, W. Thermodynamic Description of the Quaternary Ag-Bi-Cu-Sn System. J. Electron. Mater. 47, 212–224 (2018). https://doi.org/10.1007/s11664-017-5735-y
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DOI: https://doi.org/10.1007/s11664-017-5735-y