Abstract
We have recently developed a thermodynamic database for micro-soldering alloys which consists of the elements Pb, Bi, Sn, Sb, Cu, Ag, Zn, and In. In this paper, the phase equilibria and the related thermodynamic properties of the Sn-Ag-Cu base alloys are presented using this database, alloy systems being one of the promising candidates for Pb-free solders. The isothermal section diagrams of the Sn-Ag-Cu ternary system were experimentally determined by SEM-EDS, x-ray diffraction and metallographic techniques. Based on the present results as well as the previous data on phase boundaries and thermochemical properties, thermodynamic assessment of this system was carried out. The isothermal and vertical section diagrams, liquidus surface, mass fractions of the phase constitution, etc., were calculated. The predictions of surface energy and viscosity were also investigated. Moreover, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior in some Sn-Ag-Cu base alloys. Calculated results based on the Scheil model were incorporated into a three-dimensional solidification simulation and the prediction of practical solidification procedures was performed.
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Lead Free Solder Project, Final Report, NCMS Report 0401 RE 96 (Ann Arbor, MI: National Center for Manufacturing Science, August 1997).
I. Ohnuma, X.J. Liu, H. Ohtani, and K. Ishida, J. Electron. Mater. 28, 1164 (1999).
I. Ohnuma, X.J. Liu, H. Ohtani, and K. Ishida, Functional Materials, ed. K. Grassie et al. (Weinheim, Germany: Wiley-VCH, 2000), p. 69.
N. Saunders and A.P. Miodownik, CALPHAD (Lausanne, Switzerland: Pergamon, 1998).
U.R. Kattner and W. Boettinger, J. Electron. Mater. 23, 603 (1994).
F.H. Hayes, L. Lukas, G. Effenberg, and G. Petzow, Z. Metallkd. 77, 749 (1986).
J.-H. Shim, C.-S. Oh, B.-J. Lee, and D.-N. Lee, Z. Metallkd. 87, 3 (1996).
A. Dinsdale, CALPHAD 15, 317 (1991).
I. Karakaya and W.T. Thompson, Bull. Alloy Phase Diagrams 9, 144 (1988).
E.Y. Tonkov and I.L. Aptebar, Dokl. Acad. Nauk. SSR 188, 401 (1969).
H. Ohtani, K. Okuda, and K. Ishida, J. Phase Equilibria 16, 416 (1995).
H. Ohtani, M. Miyashita, and K. Ishida, J. Jpn, Inst. Met. 63, 685 (1999).
O. Bauer and O. Vollenbruck, Z. Metallkd. 15, 119 (1923).
M. Hamasumi and Y. Odamura, J. Jpn, Inst. Met. 1, 165 (1937).
X.-J. Liu, C.P. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, to be submitted to J. Alloys and Comp.
B. Sundman, B. Jansson, and T.O. Anderson, CALPHAD 9, 153 (1985).
E. Gebhardt and G. Petzow, Z. Metallkd. 50, 597 (1959).
J.A.V. Butler, Proc. Roy. Soc. A135, 348 (1932).
T. Tanaka and I. Iida, Steel Research 65, 21 (1994).
S. Seetharaman and D. Sichen, Metall. Mater. Trans. B 25B, 589 (1994).
S. Hao, K. Anzai, and E. Niyama, Trans. AFS 103, 41 (1995).
J.H. Vincent, B.P. Richards, D.R. Wallis, I.A. Gunter, M. Warwick, H.A.H. Steen, P.G. Harris, M.A. Whitmore, S.R. Billington, A.C. Harman, and E. Knight, Circuit World 19, 32 (1993).
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Ohnuma, I., Miyashita, M., Anzai, K. et al. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys. J. Electron. Mater. 29, 1137–1144 (2000). https://doi.org/10.1007/s11664-000-0004-9
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DOI: https://doi.org/10.1007/s11664-000-0004-9