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The online version of the original article can be found under doi:10.1007/s11664-017-5672-9.
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Liu, S., Hu, Z., Xiong, J. et al. Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints. J. Electron. Mater. 46, 6737 (2017). https://doi.org/10.1007/s11664-017-5716-1
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DOI: https://doi.org/10.1007/s11664-017-5716-1