Abstract
A low-temperature solid-state bonding technology using silver-coated Cu microcones and Sn-3.0Ag-0.5Cu (wt.%) solder for three-dimensional (3D) packaging is presented. Electroless silver coating on the surfaces of copper microcones effectively reduces oxide layer growth and significantly enhances the solder joint shear strength from an average of 33.5 MPa to 43.4 MPa. Low-temperature thermocompression bonding at 463 K in ambient air was achieved using silver-coated Cu microcones, with no voids found along the bonded interface. Microscopic observation revealed that the microcones were completely inserted into the soft solder. Probable mechanisms for this bonding process are proposed and discussed.
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J. Kim and C.C. Lee, Mater. Sci. Eng. A 448, 345 (2007).
Y.-S. Chien, Y.-P. Huang, R.-N. Tzeng, M.-S. Shy, T.-H. Lin, K.-H. Chen, C.-T. Chuang, W. Hwang, J.-C. Chiou, C.-T. Chiu, H.-M. Tong, and K.-N. Chen, In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, May 28, 2013–May 31, 2013, (Las Vegas: Institute of Electrical and Electronics Engineers Inc., 2013), p. 1146.
A. He, T. Osborn, S.A.B. Allen, and P.A. Kohl, Electrochem. Solid-State Lett. 9, 192 (2006).
R.I. Made, C.L. Gan, L. Yan, K.H.B. Kor, H.L. Chia, K.L. Pey, and C.V. Thompson, Acta Mater. 60, 578 (2012).
C.-T. Ko, and K.-N. Chen, Microelectron. Reliab. 52, 302 (2012).
B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoukatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst, and E. Beyne, In 2006 International Electron Devices Meeting, IEDM, December 10, 2006–December 13, 2006, (Institute of Electrical and Electronics Engineers Inc.: San Francisco, CA, 2006), IEEE Electron Devices Society.
E.-J. Jang, S. Hyun, H.-J. Lee, and Y.-B. Park, J. Electron. Mater. 38, 2449–2454 (2009).
W. Zhang, X. Feng, H. Cao, H. Anmin, and M. Li, Appl. Surf. Sci. 258, 8814–8818 (2012).
Z. Chen, T. Luo, T. Hang, M. Li, and H. Anmin, ECS Solid State Lett. 1, P7 (2012).
Z. Chen, T. Luo, T. Hang, M. Li, and H. Anmin, CrystEngComm 15, 10490 (2013).
L. Qin, Z. Chen, W. Zhang, H. Anmin, and M. Li, Appl. Surf. Sci. 268, 368 (2013).
R. Berriche, R. Lowry, and M. I. Rosenfield, in International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. IEEE (1999).
J. Li, W. Mayer, and E.G. Colgan, J. Appl. Phys. 70, 2820 (1991).
G.G. Jernigan, and G.A. Somorjai, J. Catal. 147, 567 (1994).
W. Zhang, Y. Zheyin, Z. Chen, and M. Li, Mater. Lett. 67, 327 (2012).
Q. Zhao, H. Anmin, M. Li, and J. Sun, Microelectron. Reliab. 53, 321 (2013).
T.N. Rhodin Jr, J. Am. Chem. Soc. 72, 5102 (1950).
W.E. Campbell, and U.B. Thomas, Trans. Electrochem. Soc. 76, 303 (1939).
M. Sanchez, J. Rams, and A. Urena, Oxid. Metals 69, 327 (2008).
W. Geng, Z. Chen, H. Anmin, and M. Li, Mater. Lett. 78, 72 (2012).
Y. Huang, T. Hang, H. Anmin, Z. Chen, L. Qin, and M. Li, J.␣Alloy. Compd. 582, 408 (2014).
Ž. Marinković, and V. Simić, Thin Solid Films 217, 26 (1992).
B.F. Dyson, J. Appl. Phys. 37, 2375 (1966).
K. Suzuki, S. Kano, M. Kajihara, N. Kurokawa, and K.␣Sakamoto, Mater. Trans. 46, 969 (2005).
H.-T. Lee and Y.-H. Lee, Mater. Sci. Eng. A 419, 172 (2006).
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Hu, F., Yang, S., Wang, H. et al. Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding. J. Electron. Mater. 44, 4516–4524 (2015). https://doi.org/10.1007/s11664-015-3930-2
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DOI: https://doi.org/10.1007/s11664-015-3930-2