Abstract
The formation and growth behavior of intermetallic compound (IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu (SAC305) solder joint during soldering and aging were investigated. The soldering was performed at 250 °C for 10 min, followed by air cooling and aging treatment at 150 °C up to 15 days. The results show that the scallop-like Cu6Sn5 IMC layer and planar-like Cu3Sn formed between solder and Cu substrate during soldering and aging. The Ni3P and (Ni,Cu)3Sn4 compounds were formed between electroless Ni-W-P layer and solder, and Cu substrate was not damaged and kept a smooth interface. When the isothermal aging treatment was applied, the total thickness of IMCs which formed at the SAC305/Cu and SAC305/Ni-W-P/Cu interface increased with increasing aging time. Kirkendall voids emerged at the Cu3Sn and the Ni3P layers, but the voids emerged at the Ni3P layer in the form of crack. The amount of Kirkendall voids increased and the crack elongated with increasing aging time. The Cu6Sn5 and (Ni,Cu)3Sn4 grains grew by merging adjacent grains. In the process of growth, the growing interfacial compounds filled the free space, and new columnar dendrite grain of (Ni,Cu)3Sn4 constantly generated during aging treatment. After 15 days aging, the Ni-W-P barrier layer was still remained, which indicated that the Ni-W-P layer can be a good barrier layer between the solder alloys and Cu substrate.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Kumar Aditya, Chen Zhong, Mhaisalkar SG, et al. Effect of Ni–P Thickness on Solid–state Interfacial Reactions between Sn–3.5Ag Solder and Electroless Ni–P Metallization on Cu Substrate[J]. Thin Solid Films, 2006, 504, 410–415
Hu Xiaowu, Ke Zunrong. Growth Behavior of Interfacial Cu–Sn Intermetallic Compounds of Sn/Cu Reaction Couples During Dip Soldering and Aging [J]. Journal of Materials Science: Materials in Electronics, 2014, 25, 936–945
Hu X, Li Y, Min Z. Interfacial Reaction and Growth Behavior of IMCs Layer between Sn–58Bi Solders and a Cu Substrate[J]. J. Mater. Sci. Mater. Electron, 2013, 24: 2 027–2 034
Hu X, Li Y, Min Z. Interfacial Reaction and IMC Growth between Bi–containing Sn0.7Cu Soldiers and Cu Substrate During Soldering and Aging[J]. J. Alloy Compd., 2014, 582: 341–347
Yoon Jeong–Won, Jung Seung–Boo. Growth Kinetics of(Ni,Cu)3Sn4 and Ni3P Layer between Sn–3.5Ag Solder and Electroless Ni–P Substrate[ J]. Journal of Alloys and Compounds, 2004, 376: 105–110
Thawatchai Plookphol, Sirikul Wisutmethangoon, Sarawut Gonsrang. Influence of Process Parameters on SAC305 Lead–free Solder Powder Produced by Centrifugal Atomization[J]. Powder Technology, 2011, 214: 506–512
Liu Mei Lee, Habsah Haliman, Ahmad Azmin Mohamad. Interfacial Reaction of a Sn–3.0Ag–0.5Cu Thin Film During Solder Reflow[J]. Soldering & Surface Mount Technology, 2013, 251: 15–23
Zhou M B, Ma X & Zhang X P. Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn–3.0Ag–0.5Cu Solder Balls and Sn–3.0Ag–0.5Cu/Cu Joints[J]. Journal of Elec. Mater., 2012, 41: 3 169–3 178
Ying Yang, J N Balaraju, Ser Choong Chong, et al. Significantly Retarded Interfacial Reaction between an Electroless Ni–W–P Metallization and Lead–free Sn–3.5Ag Solder[J]. Journal of Alloys and Compounds, 2013, 565: 11–16
Lu G, Zangari G. Study of the Electroless Deposition Process of Ni–P–based Ternary Alloys [J]. Journal of The Electrochemical Society, 2003(150): C777–C786
Balaraju J N, Sankara Narayanan T S N, Seshadri S K. Structure and Phase Transformation Behaviour of Electroless Ni–P Composite Coatings[ J]. Materials Research Bulletin, 2006, 41: 847–860
Wang J, Zhang L G, Liu H S, et al. Interfacial Reaction between Sn–Ag Alloys and Ni Substrate[J]. Journal of Alloys and Compounds, 2008, 455: 159–163
Strandlund H, Larsson H. Prediction of Kirkendall Shift and Porosity in Binary and Ternary Diffusion Couples[J]. Acta Materialia, 2004, 52: 4 695–4 703
Bartek Wierzba. The Kirkendall Effect in Binary Diffusion Couples [J]. Physica A: Statistical Mechanics and Its Applications, 2013, 392: 2 860–2 867
Klinger L, Rabkin E. Theory of the Kirkendall Effect During Grain Boundary Interdiffusion [J]. Acta Materialia, 2011(59): 1 389–1 396
Yu Jin, Kim J Y. Effects of Residual S on Kirkendall Void Formation at Cu/Sn–3.5Ag Solder Joints[J]. Acta Materialia, 2008, 56: 5 514–5 523
Yu Xiao, Hu Xiaowu, Li Yulong, et al. Effect of Alloying Cu Substrate on Microstructure and Coarsening Behavior of Cu6Sn5 Grains of Soldered Joints[J]. Journal of Materials Science: Materials in Electronics, 2015(26): 2 782–2 794
Aditya Kumar, Zhong Chen, Mhaisalkar S G, et al. Effect of Ni–P Thickness on Solid–state Interfacial Reactions between Sn–3.5Ag Solder and Electroless Ni–P Metallization on Cu Substrate[J]. Thin Solid Films,2006(504): 410–415
Kumar A, He M, Chen Z, et al. Effect of Electromigration on Interfacial Reactions between Electroless Ni–P and Sn–3.5% Ag Solder[J]. Thin Solid Films, 2004(462–463): 413–418
Aditya Kumar, Zhong Chen, Mhaisalkar S G, et al.Effect of Ni–P Thickness on Solid–state Interfacial Reactions between Sn–3.5Ag Solder and Electroless Ni–P Metallization on Cu Substrate[J]. Thin Solid Films, 2006(504): 410–415
Aditya Kumar, Zhong Chen. Influence of Solid–state Interfacial Reactions on the Tensile Strength of Cu/electroless Ni–P/Sn–3.5Ag Solder Joint[J]. Materials Science and Engineering: A, 2006(423): 175–179
Shen Jun, Zhao Mali, He Peipei, et al. Growth Behaviors of Intermetallic Compounds at Sn–3Ag–0.5Cu/Cu Interface During Isothermal and Non–isothermal Aging[J]. Journal of Alloys and Compounds, 2013(574): 451–458
Author information
Authors and Affiliations
Corresponding author
Additional information
Funded by National Natural Science Foundation of China (Nos.51465039, 51665038), Natural Science Foundation of Jiangxi Province (Nos.20151BAB206041, 20161BAB206122) and the State Key Laboratory of Solidification Processing in NWPU (No. SKLSP201508)
Rights and permissions
About this article
Cite this article
Xu, T., Hu, X., Li, Y. et al. Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 34, 165–175 (2019). https://doi.org/10.1007/s11595-019-2031-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11595-019-2031-0