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Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging

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Abstract

Cu/Sn-9Zn-30Cu/Cu 3D packaging solder joints were prepared by transient liquid phase (TLP) bonding. The effect of bonding time on microstructure, shear strength, and fracture surfaces of the solder joints was studied. The results show that the interface reaction zone of Cu/Sn-9Zn-30Cu/Cu solder joints consisted of Cu6(Sn, Zn)5 phase and Cu3Sn phase at a bonding time of 15 min. With increasing bonding time, the scallop-type Cu6(Sn, Zn)5 phase gradually transformed into the layer-type Cu3Sn phase, and the thickness of the interfacial intermetallic compound (IMC) layer gradually increased. The interfacial reaction zone entirely consisted of the layer-type Cu3Sn after bonding for 60 min. The in situ reaction zone of Cu/Sn-9Zn-30Cu/Cu solder joint consisted of Cu6(Sn, Zn)5, Cu3Sn, Cu particles, and Zn-rich phase at a bonding time of 15 min. The Cu6(Sn, Zn)5 increased content and evenly distributed in the in situ reaction zone at 30 min, resulting the microstructure gradually refined. The Zn-rich phase disappeared in the in situ reaction zone after bonding 90 min, and the in situ microstructure gradually coarsened and cracks initiated as bonding time increased. The shear strength of solder joints first increased and then declined with increasing bonding time, and the maximum shear strength reached 22.25 MPa at a bonding time of 60 min. The fracture location of the solder joint shifted from the in situ reaction zone to the interface reaction zone with increasing bonding time, and the fracture mechanism of the solder joints always exhibited brittle fracture.

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Data availability

The data provided in this study can be obtained from the corresponding author upon reasonable request.

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Acknowledgements

This research was financially supported by the National Natural Science Foundation of China (Grant No. 52165068), the Natural Science Foundation of Guangdong Province (Grant No. 2024A1515012861).

Funding

This work was supported by the National Natural Science Foundation of China (Grant No. 52165068), the Natural Science Foundation of Guangdong Province (Grant No. 2024A1515012861).

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Authors and Affiliations

  1. School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China

    Yuezhang Yang & Li Yang

  2. School of Mechanical Engineering, Guilin University of Aerospace Technology, Guilin, 541004, China

    Zheng Liu & Li Yang

  3. School of Automotive Engineering, Changshu Institute of Technology, Changshu, 215500, China

    Yaocheng Zhang

  4. National Mold Quality Inspection and Testing Center, Kunshan, 215300, China

    Huiming Gao & Zhitao Zhang

Authors
  1. Yuezhang Yang
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Contributions

All authors contributed to the conception and design of the research. Yuezhang Yang: Sample preparation, Data analysis, Writing. Zheng Liu: Survey, Methodology. Li Yang and Yaocheng Zhang: Supervision, Review, Modification. Huiming Gao and Zhitao Zhang: Data collection.

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Correspondence to Li Yang.

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Yang, Y., Liu, Z., Yang, L. et al. Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging. J Mater Sci: Mater Electron 35, 1394 (2024). https://doi.org/10.1007/s10854-024-13146-7

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